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TI-ADS131M04-Q1.pdf
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ADS131M04-Q1 汽车类、4 通道、64 kSPS、同步采样、24 位、Δ-Σ ADC
1 特性
• 符合面向汽车应用的 AEC-Q100 标准:
– 温度等级 1:–40°C 至 +125°C,T
A
• 4 同步采样差分输入
• 可编程数据速率高达 64kSPS
• 可编程增益高达 128
• 噪声性能:
– 当增益为 1.4 kSPS 时,动态范围为 102dB
– 当增益为 64.4 kSPS 时,动态范围为 80dB
• 总谐波失真:-100dB
• 用于直接传感器连接的高阻抗输入:
– 当增益为 1、2 和 4 时,
输入阻抗为 330 kΩ
– 当增益为 8、16、32、64 和 128 时,
输入阻抗为 ≥ 1 MΩ
• 可编程的通道间相位延迟校准:
– 分辨率 = 244 ns,f
CLKIN
= 8.192 MHz
• 电流监测模式可实现超低功耗篡改监测
• 快速启动:
– 电压斜升 0.5 ms 内的第一个数据
• 集成的负电荷泵允许输入信号低于接地值
• 通道间串扰:-120 dB
• 低漂移内部电压基准
• 用于通信和寄存器映射的 CRC
• 模拟和数字电源:2.7V 至 3.6V
• 低功耗:3V AVDD 和 DVDD 下为 3.3 mW
• 封装:20 引脚 TSSOP
• 工作温度范围:–40°C 至 +125°C
2 应用
• 汽车电池管理系统 (BMS):
– 电流分流测量
– 使用外部电阻分压器实现电压测量
– 使用热敏电阻或模拟输出温度传感器实现温度测
量
• 电动汽车充电站:
– 直流电子计量
– 交流电子计量
• 能量存储系统 (ESS)
3 说明
ADS131M04-Q1 是一款 four 通道、同步采样、24
位、Δ-Σ 模数转换器 (ADC),具有宽动态范围、低功
耗和电能测量特定功能,因此非常适合汽车电池管理系
统 (BMS)。ADC 输入可以直接连接到分流电阻器以实
现双向电池电流测量,连接到电阻分压器网络以实现高
电压测量,或者连接到温度传感器(例如,热敏电阻或
模拟输出温度传感器)。
可以根据传感器输入独立配置各个 ADC 通道。低噪
声、可编程增益放大器 (PGA) 提供了从 1 到 128 的增
益,用以放大低电平信号。此外,该器件集成了通道间
相位校准、偏移和增益校准寄存器,有助于消除信号链
误差。
该器件集成了低漂移、1.2V 基准,从而减小了印刷电
路板 (PCB) 面积。数据输入、数据输出和寄存器映射
中可选的循环冗余校验 (CRC) 确保了通信完整性。
完整的模拟前端 (AFE) 采用 20 引脚 TSSOP 封装,额
定汽车级温度范围为 –40°C 至 +125°C。
器件信息
(1)
器件型号 封装
封装尺寸(标称值)
ADS131M04-Q1 TSSOP (20) 6.50mm × 4.40mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
'6ADC
SCLK
DOUT
DIN
Control &
Serial Interface
CS
Gain & Offset
Calibration
AVDD
AGND
DVDD
DGND
DRDY
Clock
Generation
CLKIN
1.2-V
Reference
SYNC / RESET
Phase Shift &
Digital Filters
'6ADC
Gain & Offset
Calibration
Phase Shift &
Digital Filters
'6ADC
Gain & Offset
Calibration
Phase Shift &
Digital Filters
'6ADC
Gain & Offset
Calibration
Phase Shift &
Digital Filters
AIN0P
AIN0N
+
±
AIN1P
AIN1N
+
±
AIN2P
AIN2N
+
±
AIN3P
AIN3N
+
±
简化版方框图
ADVANCE INFORMATION
ADS131M04-Q1
ZHCSOL7 – MARCH 2022
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBASA13
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................6
6.6 Timing Requirements.................................................. 8
6.7 Switching Characteristics............................................8
6.8 Timing Diagrams......................................................... 9
6.9 Typical Characteristics.............................................. 10
7 Parameter Measurement Information.......................... 15
7.1 Noise Measurements................................................ 15
8 Detailed Description......................................................17
8.1 Overview................................................................... 17
8.2 Functional Block Diagram......................................... 17
8.3 Feature Description...................................................18
8.4 Device Functional Modes..........................................29
8.5 Programming............................................................ 35
8.6 ADS131M04-Q1 Registers....................................... 45
9 Application and Implementation.................................. 75
9.1 Application Information............................................. 75
9.2 Typical Application.................................................... 79
10 Power Supply Recommendations..............................82
10.1 CAP Pin Behavior................................................... 82
10.2 Power-Supply Sequencing......................................82
10.3 Power-Supply Decoupling.......................................82
11 Layout........................................................................... 82
11.1 Layout Guidelines................................................... 82
11.2 Layout Example...................................................... 83
12 Device and Documentation Support..........................84
12.1 Documentation Support.......................................... 84
12.2 接收文档更新通知................................................... 84
12.3 支持资源..................................................................84
12.4 Trademarks............................................................. 84
12.5 Electrostatic Discharge Caution..............................84
12.6 术语表..................................................................... 84
13 Mechanical, Packaging, and Orderable
Information.................................................................... 84
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE REVISION NOTES
March 2022 * Initial Release
ADS131M04-Q1
ZHCSOL7 – MARCH 2022
www.ti.com.cn
ADVANCE INFORMATION
2 Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: ADS131M04-Q1
5 Pin Configuration and Functions
1AVDD 20 DVDD
2AGND 19 DGND
3AIN0P 18 CAP
4AIN0N 17 CLKIN
5AIN1N 16 DIN
6AIN1P 15 DOUT
7AIN2P 14 SCLK
8AIN2N 13 DRDY
9AIN3N 12 CS
10AIN3P 11 SYNC/RESET
Not to scale
图 5-1. PW Package, 20-Pin TSSOP (Top View)
表 5-1. Pin Functions
PIN
I/O DESCRIPTION
(1)
NAME NO.
AGND 2 Supply Analog ground
AIN0N 4 Analog input Negative analog input 0
AIN0P 3 Analog input Positive analog input 0
AIN1N 5 Analog input Negative analog input 1
AIN1P 6 Analog input Positive analog input 1
AIN2N 8 Analog input Negative analog input 2
AIN2P 7 Analog input Positive analog input 2
AIN3N 9 Analog input Negative analog input 3
AIN3P 10 Analog input Positive analog input 3
AVDD 1 Supply Analog supply. Connect a 1-µF capacitor to AGND.
CAP 18 Analog output
Digital low-dropout (LDO) regulator output.
Connect a 220-nF capacitor to DGND.
CLKIN 17 Digital input Controller clock input
CS 12 Digital input Chip select; active low
DGND 19 Supply Digital ground
DIN 16 Digital input Serial data input
DOUT 15 Digital output Serial data output
DRDY 13 Digital output Data ready; active low
DVDD 20 Supply Digital I/O supply. Connect a 1-µF capacitor to DGND.
SCLK 14 Digital input Serial data clock
SYNC/RESET 11 Digital input Conversion synchronization or system reset; active low
Thermal pad
— —
Thermal pad; connect to AGND
(1) See the Unused Inputs and Outputs section for details on how to connect unused pins.
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ADS131M04-Q1
ZHCSOL7 – MARCH 2022
ADVANCE INFORMATION
Copyright © 2022 Texas Instruments Incorporated
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3
Product Folder Links: ADS131M04-Q1
6 Specifications
6.1 Absolute Maximum Ratings
See
(1)
MIN MAX UNIT
Power-supply voltage
AVDD to AGND
–0.3
3.9
V
AGND to DGND
–0.3
0.3
DVDD to DGND
–0.3
3.9
DVDD to DGND, CAP tied to DVDD
–0.3
2.2
CAP to DGND
–0.3
2.2
Analog input voltage AINxP, AINxN
AGND – 1.6
AVDD + 0.3
Digital input voltage CS, CLKIN, DIN, SCLK, SYNC/RESET
DGND – 0.3
DVDD + 0.3
Input current Continuous, all pins except power-supply pins
–10
10 mA
Temperature
Junction, T
J
150
°C
Storage, T
stg
–60
150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM),
per AEC Q100-002
(1)
HBM ESD classification level 2
±2000
V
Charged-device model (CDM),
per AEC Q100-011
CDM ESD classification level C4B
Corner pins ±750
All other non-corner pins ±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
ADS131M04-Q1
ZHCSOL7 – MARCH 2022
www.ti.com.cn
ADVANCE INFORMATION
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Copyright © 2022 Texas Instruments Incorporated
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6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
Analog power supply
AVDD to AGND, normal operating modes 2.7 3.0 3.6
V
AVDD to AGND, standby and current-detect
modes
2.4 3.0 3.6
AGND to DGND
–0.3
0 0.3
Digital power supply
DVDD to DGND 2.7 3.0 3.6
V
DVDD to DGND, DVDD shorted to CAP
(digital LDO bypassed)
1.65 1.8 2
ANALOG INPUTS
(1)
V
AINxP
,
V
AINxN
Absolute input voltage
Gain = 1, 2, or 4
AGND –
1.3
AVDD
V
Gain = 8, 16, 32, 64 or 128
AGND –
1.3
AVDD – 1.8
V
IN
Differential input voltage V
IN
= V
AINxP
- V
AINxN
–V
REF
/
Gain
V
REF
/ Gain V
EXTERNAL CLOCK SOURCE
f
CLKIN
External clock frequency
High-resolution mode 0.3 8.192 8.4
MHzLow-power mode 0.3 4.096 4.15
Very-low-power mode 0.3 2.048 2.08
Duty cycle 40% 50% 60%
DIGITAL INPUTS
Input voltage DGND DVDD V
TEMPERATURE RANGE
T
A
Operating ambient temperature
–40
125 °C
(1) The subscript "x" signifies the channel. For example, the positive analog input to channel 0 is named AIN0P. See the Pin Configuration
and Functions section for the pin names.
6.4 Thermal Information
THERMAL METRIC
(1)
ADS131M04-Q1
UNITPW (TSSOP)
20 PINS
R
θJA
Junction-to-ambient thermal resistance 94.9 °C/W
R
θ
JC(top)
Junction-to-case (top) thermal resistance 34.9 °C/W
R
θJB
Junction-to-board thermal resistance 46.4 °C/W
Ψ
JT
Junction-to-top characterization parameter 2.7 °C/W
Ψ
JB
Junction-to-board characterization parameter 46.0 °C/W
R
θ
JC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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ADS131M04-Q1
ZHCSOL7 – MARCH 2022
ADVANCE INFORMATION
Copyright © 2022 Texas Instruments Incorporated
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