TI-TUSB217-Q1.pdf资源-CSDN文库

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D2 D1

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本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确

性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLLSF89

TUSB217-Q1

ZHCSIS9A –SEPTEMBER 2018–REVISED DECEMBER 2018

TUSB217-Q1 USB 高高速速信信号号调调节节器器

1 特特性性

• 符合面向汽车应用的 AEC-Q100 标准

– 器件温度等级 2：

–40°C 至 105°C T

• 宽电源电压范围：2.3 - 6.5V

• 超低 USB 断开和关断功耗

• 可提供 USB 2.0 高速信号调节

• 与 USB 2.0、OTG 2.0 和 BC 1.2 兼容

• 支持低速、全速和高速信号传输

• 主机/设备无关

• 支持长达 5m 的电缆

– 通过外部下拉电阻器实现四种可选的信号增强

（边沿升压与直流升压）设置

– 通过上拉或下拉可配置引脚实现三种可选的 RX

灵敏度，以补偿高损耗应用中的 ISI 抖动

• 可扩展解决方案 - 用于高损耗应用的菊花链器件

• 与 TUSB213 (5V) 引脚兼容

2 应应用用

• 汽车信息娱乐系统

• 汽车音响主机

• 汽车媒体中心

• 笔记本电脑/台式计算机/扩展坞

• 平板电脑/手机

• 电视

• 有源电缆、电缆扩展器

• 背板

3 说说明明

TUSB217-Q1 是第三代 USB 2.0 高速信号调节器，旨

在补偿传输通道中的交流损失（由于电容性负载）和直

流损失（由于电阻性负载）。

TUSB217-Q1 采用了专利设计，可通过边缘加速器来

对 USB 2.0 高速信号的传输边缘进行加速，并通过直

流升压功能来提高静态电平。此外，TUSB217-Q1 还

具有预均衡功能，可提高接收器的灵敏度并补偿较长线

缆应用中的 ISI 抖动。USB 低速和全速信号特征不受

TUSB217-Q1 的影响。

TUSB217-Q1 可在不改变数据包计时或增加传播延迟

的情况下提高信号质量，是需要低延迟的应用的理想

选择。

TUSB217-Q1 可使用长达 5 米的线缆帮助系统通过

USB 2.0 高速电气近端眼图合规性测试。

TUSB217-Q1 与 USB On-The-Go (OTG) 和电池充电

(BC 1.2) 协议兼容。

器器件件信信息息

器器件件编编号号封封装装封封装装尺尺寸寸（（标标称称值值））

TUSB217-Q1 VQFN (14) 3.50mm x 3.50mm

简简化化原原理理图图

TUSB217-Q1

ZHCSIS9A –SEPTEMBER 2018–REVISED DECEMBER 2018

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 5

6.6 Switching Characteristics.......................................... 6

6.7 Timing Requirements................................................ 7

7 Detailed Description.............................................. 8

7.1 Overview ................................................................... 8

7.2 Functional Block Diagram ......................................... 8

7.3 Feature Description................................................... 8

7.4 Device Functional Modes.......................................... 8

7.5 TUSB217 Registers .................................................. 9

8 Application and Implementation ........................ 12

8.1 Application Information............................................ 12

8.2 Typical Application ................................................. 12

9 Power Supply Recommendations...................... 21

10 Layout................................................................... 22

10.1 Layout Guidelines ................................................. 22

10.2 Layout Example .................................................... 22

11 器器件件和和文文档档支支持持 ..................................................... 23

11.1 文档支持 ............................................................... 23

11.2 接收文档更新通知 ................................................. 23

11.3 社区资源................................................................ 23

11.4 商标 ....................................................................... 23

11.5 静电放电警告......................................................... 23

11.6 术语表 ................................................................... 23

12 机机械械、、封封装装和和可可订订购购信信息息....................................... 24

4 修修订订历历史史记记录录

Changes from Original (September 2018) to Revision A Page

• 将文档状态从

预告信息

更改为

生产

数据.................................................................................................................................. 1

TUSB217-Q1

ZHCSIS9A –SEPTEMBER 2018–REVISED DECEMBER 2018

www.ti.com.cn

Pin Functions (continued)

I/O

INTERNAL

PULLUP/PULLDOWN

DESCRIPTION

NAME NO. (RGY)

(2) Pull-up resistors for SDA and SCL pins in I

C mode should be R

Pull-up

(depending on I2C bus voltage). If both SDA and SCL are pulled

up at power-up the device enters into I

C mode.

SDA

(2)

11 I/O

500 kΩ PU

1.8 MΩ PD

I2C Mode:

Bidirectional I2C data pin [7-bit I2C slave address = 0x2C].

In non I2C mode:

Reserved for TI test purpose.

VCC 12 P N/A Supply power

RSTN 14 I

500 kΩ PU

1.8 MΩ PD

Device disable/enable.

Low – Device is at reset and in shutdown, and

High - Normal operation.

Recommend 0.1-µF external capacitor to GND to ensure clean

power on reset if not driven. If the pin is driven, it must be held

low until the supply voltage for the device reaches within

specifications.

SCL

(2)

/CD 13 I/O

When RSTN asserted there is

a 500 kΩ PD

In I2C mode:

I2C clock pin [I2C address = 0x2C].

Non I2C mode:

After reset: Output CD. Flag indicating that a USB device is

attached (connection detected). Asserted from an

unconnected state upon detection of DP or DM pull-up

resistor. De-asserted upon detection of disconnect.

Thermal Pad TPAD N/A N/A

Thermal Pad is electrically not connected to device ground.

Connection to board ground is optional.

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage range VCC –0.3 7 V

Voltage range USB data DxP, DxM –0.3 5.5 V

Voltage range on BOOST pin BOOST -0.3 1.98 V

Voltage range other pins SCL, SDA, RX_SEN, RSTN -0.3 5 V

Storage temperature, T

stg

–65 150 °C

Maximum junction temperature, T

J (max)

125 °C

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic

discharge

Human-body model (HBM), per AEC Q100-002

(1)

HBM ESD Classification Level 2

±2000

Charged-device model (CDM), per AEC Q100- 011

CDM ESD Classification Level C4A

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply voltage 2.3 5 6.5 V

Operating free-air temperature (AEC-Q100) –40 105 °C

Junction temperature (AEC-Q100) 115 °C

I2C_BUS

I2C Bus Voltage 1.62 3.6 V

TUSB217-Q1

www.ti.com.cn

ZHCSIS9A –SEPTEMBER 2018–REVISED DECEMBER 2018

Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

DxP, DxM Voltage range USB data 0 3.6 V

BOOST Voltage range BOOST pin 0 1.98 V

SCL, SDA,

RX_SEN,

RSTN

Voltage range other pins (SCL, SDA, RX_SEN, RSTN) 0 3.6 V

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC

(1)

RGY (VQFN)

UNIT

14 PINS

θJA

Junction-to-ambient thermal resistance 49.1 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 52.8 °C/W

θJB

Junction-to-board thermal resistance 24.2 °C/W

Junction-to-top characterization parameter 2.2 °C/W

Junction-to-board characterization parameter 24.3 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance 7 °C/W

(1) All typical values are at V

= 5 V, and T

= 25°C.

6.5 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

(1)

MAX UNIT

POWER

ACTIVE_HS

High Speed Active Current

USB channel = HS mode. 480 Mbps

traffic. V

supply stable, with Boost =

Max

22 36 mA

IDLE_HS

High Speed Idle Current

USB channel = HS mode, no traffic.

supply stable, Boost = Max

22 36 mA

HS_SUPSPEND

High Speed Suspend Current

USB channel = HS Suspend mode.

supply stable

0.75 1.4 mA

Full-Speed Current

USB channel = FS mode, 12 Mbps traffic,

supply stable

0.75 1.4 mA

DISCONN

Disconnect Power

Host side application. No device

attachment.

0.80 1.4 mA

SHUTDN

Shutdown Power RSTN driven low, V

supply stable 35 95 µA

CONTROL PIN LEAKAGE

LKG_FS

Pin failsafe leakage current for

SDA, RSTN

= 0 V, pin at V

IH, max

10 15 µA

LKG_FS

Pin failsafe leakage current for

BOOST, RX_SEN

= 0 V, pin at V

IH, max

6 10 µA

LKG_FS

Pin failsafe leakage current for

SCL

= 0 V, pin at V

IH, max

70 nA

INPUT RSTN

High level input voltage 1.5 3.6 V

Low-level input voltage 0 0.5 V

High level input current V

= 3.6 V, R

enabled ±15 µA

Low level input current V

= 0V, R

enabled ±20 µA

INPUT RX_SEN (3-level input, for mid level leave pin floating)

High level input voltage

RXSEN1

=47kΩ, R

RXSEN2

=10kΩ

VCC<=4.3V 1.8 3.6 V

High level input voltage

RXSEN1

=37kΩ, R

RXSEN2

=47kΩ

VCC>4.3V 2.0 3.6 V

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