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TI-SN75DP139.pdf
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DP转TMDS
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN75DP139
SLLS977F –APRIL 2009–REVISED JULY 2017
SN75DP139 DisplayPort to TMDS Level-Shifting Re-Driver
1
1 Features
1
• DisplayPort Physical Layer Input Port to TMDS
Physical Layer Output Port
• Integrated TMDS Level-Shifting Re-driver With
Receiver Equalization
• Supports Data Rates up to 3.4 Gbps
• Achieves HDMI 1.4b Compliance
• 3D HDMI Support With TMDS Clock Rates up to
340 MHz
• 4k × 2k Operation (30 Hz, 24bpp)
• Deep Color Supporting 36bpp
• Integrated I
2
C Logic Block for DVI/HDMI
Connector Recognition
• Integrated Active I
2
C Buffer
• Enhanced ESD: 10 kV on All Pins
• Enhanced Commercial Temperature Range: 0°C
to 85°C
• 48-Pin 7-mm × 7-mm VQFN (RGZ) Package
• 40-Pin 5-mm × 5-mm WQFN (RSB) Package
2 Applications
• Personal Computer Market
– DP/TMDS Dongle
– Desktop PC
– Notebook PC
– Docking Station
– Stand-Alone Video Card
3 Description
The SN75DP139 is a dual-mode DisplayPort input to
Transition-Minimized Differential Signaling (TMDS)
output. The TMDS output has a built-in level-shifting
re-driver supporting Digital Video Interface (DVI) 1.0
and High Definition Multimedia Interface (HDMI) 1.4b
standards. The SN75DP139 is specified up to a
maximum data rate of 3.4 Gbps, supporting
resolutions greater then 1920 × 1200 or HDTV 12-bit
color depth at 1080p (progressive scan). The
SN75DP139 is compliant with the HDMI 1.4b
specifications and supports optional protocol
enhancements such as 3D graphics at resolutions
demanding a pixel rate up to 340 MHz.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SN75DP139
VQFN (48) 7.00 mm x 7.00 mm
WQFN (40) 5.00 mm x 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application
2
SN75DP139
SLLS977F –APRIL 2009–REVISED JULY 2017
www.ti.com
Product Folder Links: SN75DP139
Submit Documentation Feedback Copyright © 2009–2017, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 7
6.1 Absolute Maximum Ratings ...................................... 7
6.2 ESD Ratings.............................................................. 7
6.3 Recommended Operating Conditions....................... 7
6.4 Thermal Information.................................................. 8
6.5 Electrical Characteristics (Device Power) ................. 9
6.6 Electrical Characteristics (Hot Plug Detect).............. 9
6.7 Electrical Characteristics (Aux / I
2
C Pins)................. 9
6.8 Electrical Characteristics (TMDS and Main Link
Pins)......................................................................... 10
6.9 Switching Characteristics (Hot Plug Detect) ........... 11
6.10 Switching Characteristics (Aux / I
2
C Pins)............ 12
6.11 Switching Characteristics (TMDS and Main Link
Pins)......................................................................... 14
6.12 Typical Characteristics.......................................... 17
7 Detailed Description............................................ 18
7.1 Overview ................................................................. 18
7.2 Functional Block Diagram ....................................... 18
7.3 Feature Description................................................. 19
7.4 Device Functional Modes........................................ 22
7.5 Programming........................................................... 22
8 Application and Implementation ........................ 27
8.1 Application Information............................................ 27
8.2 Typical Application .................................................. 27
9 Power Supply Recommendations...................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Example .................................................... 30
11 Device and Documentation Support ................. 32
11.1 Receiving Notification of Documentation Updates 32
11.2 Community Resources.......................................... 32
11.3 Trademarks........................................................... 32
11.4 Electrostatic Discharge Caution............................ 32
11.5 Glossary................................................................ 32
12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (September 2014) to Revision F Page
• Added Note 1 to the Pin Functions table................................................................................................................................ 5
• Changed the Handling Ratings To ESD Ratings and moved the Storage temperature range to the Absolute
Maximum Ratings................................................................................................................................................................... 7
Changes from Revision D (July 2013) to Revision E Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision C (December 2012) to Revision D Page
• Changed title and Feature bullet from "...TMDS Translator...." to "...TMDS Level Shifting Re-driver" .................................. 1
• Changed second sentence text string in Description section from "...built in level translator..." to "built in level
shifting re-driver....."................................................................................................................................................................ 1
3
SN75DP139
www.ti.com
SLLS977F –APRIL 2009–REVISED JULY 2017
Product Folder Links: SN75DP139
Submit Documentation FeedbackCopyright © 2009–2017, Texas Instruments Incorporated
Changes from Revision A (July 2010) to Revision B Page
• Added to FEATURES "40 Pin 5 x 5 QFN (RSB) Package" .................................................................................................... 1
• Added RSB package drawing................................................................................................................................................. 4
• Changed Pin Functions to include RSB package pins........................................................................................................... 5
• Added RSB package to ORDERING INFORMATION table................................................................................................... 6
• Changed voltage range section of Absolute Maximum Ratings............................................................................................. 7
• Changed input voltages within the Recommended Operating Conditions ............................................................................. 7
• Changed thermal resistance info and enable voltages to 3.6V.............................................................................................. 8
• Changed enable voltages from 5 V to 3.6 V .......................................................................................................................... 9
• Changed V
IH(AUX
) max from 5.5 V to 3.6 V ............................................................................................................................. 9
• Changed OUT_Dx terminal connections.............................................................................................................................. 18
44
45
43
42
41
40
39
38
3536 33 32 31 30 2934 28
37
1 2 3 4 5 6 7 8 9
14
13
15
16
17
18
19
20
21
23
22
24
47
48
46
1110 12
27 26 25
GND
SRC
VCC
I2C_EN
Vsadj
GND
HPD_SOURCE
SCL_SOURCE
SDA_SOURCE
NC
GND
VCC
OUT_D4+
OUT_D4-
VCC
OUT_D3+
OUT_D3-
OUT_D2+
GND
OUT_D2-
VCC
OUT_D1+
OUT_D1-
GND
GND
OE_N
VCC
SCL_SINK
SDA_SINK
DDC_EN
HPD_SINK
GND
VCC
HPDINV
OVS
GND
IN_D1-
GND
IN_D1+
IN_D2-
VCC
IN_D2+
GND
IN_D4-
VCC
IN_D3-
IN_D3+
IN_D4+
1
1098765432
30 212223242526272829
11
20
19
18
17
16
15
14
13
12
40
31
32
33
34
35
36
37
38
39
NC
VCC
I2C_EN
Vsadj
HPD_SOURCE
SDA_SOURCE
SCL_SOURCE
SRC
VCC
NC
VCC
NC
VCC
OUT_D4+
OUT_D4-
OUT_D3+
OUT_D3-
OUT_D2+
OUT_D2-
OUT_D1+
OUT_D1-
VCC
VCC
DDC_EN
HPD_SINK
SDA_SINK
SCL_SINK
OVS
OE_N
HPDINV
IN_D4+
IN_D4-
IN_D1+
IN_D1-
IN_D2+
IN_D2-
IN_D3+
IN_D3-
VCC
VCC
4
SN75DP139
SLLS977F –APRIL 2009–REVISED JULY 2017
www.ti.com
Product Folder Links: SN75DP139
Submit Documentation Feedback Copyright © 2009–2017, Texas Instruments Incorporated
5 Pin Configuration and Functions
48-Pin VQFN
RGZ Package
(Top View)
40-Pin WQFN
RSB Package
(Top View)
5
SN75DP139
www.ti.com
SLLS977F –APRIL 2009–REVISED JULY 2017
Product Folder Links: SN75DP139
Submit Documentation FeedbackCopyright © 2009–2017, Texas Instruments Incorporated
(1) Connect the Thermal Pad to GND
Pin Functions
PIN
I/O DESCRIPTION
SIGNAL
NO.
RGZ RSB
MAIN LINK INPUT PINS
IN_D1 38, 39 1, 2 I DisplayPort Main Link Channel 0 Differential Input
IN_D2 41, 42 4, 5 I DisplayPort Main Link Channel 1 Differential Input
IN_D3 44, 45 6, 7 I DisplayPort Main Link Channel 2 Differential Input
IN_D4 47, 48 9, 10 I DisplayPort Main Link Channel 3 Differential Input
MAIN LINK PORT B OUTPUT PINS
OUT_D1 23, 22 30, 29 O TMDS Data 2 Differential Output
OUT_D2 20, 19 27, 26 O TMDS Data 1 Differential Output
OUT_D3 17, 16 25, 24 O TMDS Data 0 Differential Output
OUT_D4 14, 13 22, 21 O TMDS Data Clock Differential Output
HOT PLUG DETECT PINS
HPD_SOURCE 7 16 O Hot Plug Detect Output
HPD_SINK 30 35 I Hot Plug Detect Input
AUXILIARY DATA PINS
SDA_SOURCE,
SCL_SOURCE
8, 9 17, 18 I/O Source Side Bidirectional DisplayPort Auxiliary Data Line
SDA_SINK,
SCL_SINK
29, 28 34, 33 I/O TMDS Port Bidirectional DDC Data Lines
CONTROL PINS
OE_N 25 31 I
Output Enable and power saving function for High Speed Differential level
shifter path.
NC 10 11, 20, 40 No Connect
OVS 35 39 I DDC I2C buffer offset select
DDC_EN 32 36 I Enables or Disables the DDC I2C buffer
HPDINV 34 38 I HPD_SOURCE Logic and Level Select
VSadj 6 15 I TMDS Compliant Voltage Swing Control
SRC 3 13 I TMDS outputs rise and fall time select
I2C_EN 4 14 I Internal I
2
C register enable, used for HDMI / DVI connector differentiation
SUPPLY AND GROUND PINS
VCC
2, 11, 15, 21, 26,
33, 40, 46
3, 8, 12, 19, 23
28, 32, 37
3.3 V Supply
GND
1, 5, 12, 18, 24,
27, 31, 36, 37,
43
(1)
Thermal Pad Ground
剩余44页未读,继续阅读
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