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LMP90080 是一款高度集成的多通道低功耗 16 位传感器模拟前端 (AFE)，具有精密的 16 位 Σ-Δ 模数转换器 (ADC)，低噪声可编程增益放大器和完全差分高阻抗模拟输入复用器。它具有真连续后台校准特性，可以在所有增益和输出数据速率上实现校准，而不会中断信号路径。知识点1：多通道低功耗 16 位传感器 AFE * LMP90080 是一款多通道低功耗 16 位传感器模拟前端 (AFE)，具有高精度和低功耗的特点。知识点2：16 位 Σ-Δ 模数转换器 (ADC) * LMP90080 的 16 位 Σ-Δ 模数转换器 (ADC) 具有高精度和低噪声的特点，可以对模拟信号进行高精度的采样和转换。知识点3：低噪声可编程增益放大器 * LMP90080 的低噪声可编程增益放大器可以对信号进行可编程的增益调整，以适应不同的应用场景。知识点4：完全差分高阻抗模拟输入复用器 * LMP90080 的完全差分高阻抗模拟输入复用器可以对模拟信号进行差分式的采样和处理，以提高信号的抗干扰能力。知识点5：真连续后台校准特性 * LMP90080 的真连续后台校准特性可以在所有增益和输出数据速率上实现校准，而不会中断信号路径，从而提高了测量的精度和可靠性。知识点6：应用场景 * LMP90080 可应用于温度和压力发送器、应变仪接口、工业过程控制等领域，具有广泛的应用前景。知识点7：封装和尺寸 * LMP90080 采用 28 引脚的带外露垫封装，尺寸为 9.70mm x 4.40mm。知识点8：输出数据速率 (ODR) * LMP90080 的输出数据速率 (ODR) 可以达到 1.6775 至 214.65SPS，满足了不同的应用场景的需求。知识点9：工作温度范围 * LMP90080 的工作温度范围为 -40°C 至 125°C，满足了不同的应用场景的需求。知识点10：WEBENCH 传感器 AFE 设计工具 * LMP90080 支持 WEBENCH 传感器 AFE 设计工具，方便了设计和开发的过程。

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LMP90080

IB1

Micro-

Controller

SCLK

VIN0

VIN2

VIN4

VIN6/VREFP2

4-Wire RTD

3-Wire RTD

2 -Wire RTD

...

VIN7/

VREFN2

CSB

SDO/DRDYB

SDI

D6/DRDYB

...

XOUT

CLK/XIN

GND

IB2

VREFN1

...

VIO

LEDs/

Switches

VREFP1

Thermocouple

Product Channel Configuration Current Sources

LMP90080 4 Differential/7 Single-Ended Yes

LMP90079 4 Differential/7 Single-Ended No

LMP90078 2 Differential/4 Single-Ended Yes

LMP90077 2 Differential/4 Single-Ended No

LM90xxx 16-bit Sensor AFE Family of Products

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SNAS521

LMP90077

LMP90078

LMP90079

LMP90080

ZHCS587H –JULY 2011–REVISED JANUARY 2016

LMP9007x/LMP90080 传传感感器器 AFE 系系统统：：具具有有真真正正连连续续后后台台校校准准功功能能的的多多

通通道道低低功功耗耗 16 位位传传感感器器 AFE

1 特特性性

• 16 位低功耗 Σ-Δ 模数转换器 (ADC)

• 所有增益上的真连续背景校准

• 使用期望值编程进行适当的系统校准

• 低噪声可编程增益 (1x - 128x)

• 连续后台开路/短路和范围外传感器诊断

• 单周期稳定的 8 个输出数据速率 (ODR)

• 源自 100µA 至 1000 µA 的 2 个已匹配激励电流

(LMP90080/LMP90078)

• 4 个差分输入/7 个单端输入

(LMP90080/LMP90079)

• 2 个差分输入/4 个单端输入

(LMP90078/LMP90077)

• 7 个通用输入/输出引脚

• 用于实现低偏移的斩波稳定缓冲器

• 支持循环冗余码校验 (CRC) 数据链接误差检测的

SPI 4/3 线制接口

• ODR ≤ 13.42SPS 时的 50Hz 至 60Hz 线路扰动抑

制

• 每通道独立增益和 ODR 选择

• 由 WEBENCH

传感器 AFE 设计工具提供支持

• 自动通道排序器

• 主主要要技技术术规规范范

– 有效位数 (ENOB)/NFR：高达 16/16 位

– 偏移误差（典型值）：8.4nV

– 增益误差（典型值）：7ppm

– 总体噪声：< 10µV-rms

– 积分非线性（INL 最大值）：±1 最低有效位

(LSB)

– 输出数据速率 (ODR)：1.6775 至 214.65SPS

– 模拟电压 V

：2.85V 至 5.5V

– 工作温度范围：–40°C 至 125°C

– 封装：28 引脚带外露垫封装

2 应应用用

• 温度和压力发送器

• 应变仪接口

• 工业过程控制

3 说说明明

LLMP9007x 和 LMP90080 是高度集成的多通道低功

耗 16 位传感器模拟前端 (AFE)。此器件特有一个精密

16 位三角积分模数转换器 (ADC)，此转换器具有一个

低噪声可编程增益放大器和一个完全差分高阻抗模拟输

入复用器。一个真连续后台校准特性可在所有增益和输

出数据速率上实现校准而又不会中断信号路径。后台校

准特性在温度和时间范围内从根本上消除了增益和偏移

误差，从而在不损失速度和功耗的情况下提供测量精

度。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

LMP90077

HTSSOP (28) 9.70mm x 4.40mm

LMP90078

LMP90079

LMP90080

(1) 如需了解所有可用封装，请参见数据表末尾的可订购产品附

录。

典典型型传传感感器器应应用用

LMP90077

LMP90078

LMP90079

LMP90080

ZHCS587H –JULY 2011–REVISED JANUARY 2016

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 说说明明（（续续））.............................................................. 3

6 Device Comparison Table..................................... 3

7 Pin Configuration and Functions......................... 4

8 Specifications......................................................... 5

8.1 Absolute Maximum Ratings ...................................... 5

8.2 ESD Ratings.............................................................. 5

8.3 Recommended Operating Conditions....................... 6

8.4 Thermal Information.................................................. 6

8.5 Electrical Characteristics........................................... 6

8.6 Timing Requirements.............................................. 11

8.7 Timing Requirements - CSB Timing ....................... 11

8.8 Timing Requirements - SCLK and SDI Timing ....... 11

8.9 Timing Requirements - SDO Timing With DOD1.... 11

8.10 Timing Requirements - SDO Timing with DOD2 .. 11

8.11 Timing Requirements - SDO and DRDYB Timing 11

8.12 Typical Characteristics.......................................... 15

9 Detailed Description............................................ 20

9.1 Overview ................................................................. 20

9.2 Functional Block Diagram ....................................... 20

9.3 Feature Description................................................. 21

9.4 Device Functional Modes........................................ 29

9.5 Programming........................................................... 32

9.6 Register Maps......................................................... 43

10 Application and Implementation........................ 53

10.1 Application Information.......................................... 53

10.2 Typical Applications .............................................. 54

11 Power Supply Recommendations ..................... 60

12 Layout................................................................... 60

12.1 Layout Guidelines ................................................. 60

12.2 Layout Example .................................................... 60

13 器器件件和和文文档档支支持持 ..................................................... 61

13.1 器件支持................................................................ 61

13.2 相关链接................................................................ 61

13.3 社区资源................................................................ 61

13.4 商标 ....................................................................... 62

13.5 静电放电警告......................................................... 62

13.6 Glossary................................................................ 62

14 机机械械、、封封装装和和可可订订购购信信息息....................................... 62

4 修修订订历历史史记记录录

Changes from Revision G (January 2015) to Revision H Page

• Changed Buffer Enable/Disable. .......................................................................................................................................... 48

• Changed BUF_EN = 1 to 0. ................................................................................................................................................ 53

Changes from Revision F (March 2013) to Revision G Page

• 已添加

引脚配置和功能

部分，ESD

额定值

表，

特性描述

部分，

器件功能模式

，

应用和实施

部分，

电源相关建议

部

分，

布局

部分，

器件和文档支持

部分以及

机械、封装和可订购信息

部分 ................................................................................ 1

• Added footnote to INL, GE, and Crosstalk specifications. ..................................................................................................... 6

• Changed t

DOD1

specification. ................................................................................................................................................ 11

• Deleted CH_STS and ADC_DOUTM from Compute the CRC... sentence.......................................................................... 38

• Added sentence to the end of the RESET and RESTART section...................................................................................... 39

Changes from Revision E (March 2013) to Revision F Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 52

LMP90077

LMP90078

LMP90079

LMP90080

www.ti.com.cn

ZHCS587H –JULY 2011–REVISED JANUARY 2016

Pin Functions (continued)

TYPE FUNCTION

NAME

LMP90080

PIN NO.

LMP90079

PIN NO.

LMP90078

PIN NO.

LMP90077 PIN

NO.

SDI 19 19 19 19 Digital Input Serial data input

SDO / DRDYB 20 20 20 20 Digital Output

Serial data output and data

ready bar

D0 21 21 21 21

Digital IO

General purpose input/output

(GPIO) pins

D1 22 22 22 22

D2 23 23 23 23

D3 24 24 24 24

D4 25 25 25 25

D5 26 26 26 26

D6 / DRDYB 27 27 27 27 Digital IO

General purpose input/output

pin or data ready bar

VIO 28 28 28 28 Digital Supply Digital input/output supply pin

Thermal Pad — — — — — Leave the thermal pad floating

(1) All voltages are measured with respect to GND, unless otherwise specified

(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3) For soldering specifications see product folder at http://www.ti.com and http://www.ti.com/lit/SNOA549

(4) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(5) When the input voltage (VIN) exceeds the power supply (VIN < GND or VIN > VA), the current at that pin must be limited to 5mA and

VIN has to be within the Absolute Maximum Rating for that pin. The 20 mA package input current rating limits the number of pins that

can safely exceed the power supplies with current flow to four pins.

8 Specifications

8.1 Absolute Maximum Ratings

See

(1)(2)(3)(4)

MIN MAX UNIT

Analog Supply Voltage, VA –0.3 6.0

Digital I/O Supply Voltage, VIO –0.3 6.0

Reference Voltage, VREF –0.3 VA+0.3

Voltage on Any Analog Input Pin to GND

(5)

–0.3 VA+0.3

Voltage on Any Digital Input PIN to GND

(5)

–0.3 VIO+0.3

Voltage on SDO

(5)

–0.3 VIO+0.3

Input Current at Any Pin

(5)

mAOutput Current Source or Sink by SDO 5

Total Package Input and Output Current 20

Junction Temperature (T

JMAX

) 150 °C

Storage Temperature (T

stg

) –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2500

Charged-device model (CDM), per JEDEC specification JESD22-

C101

(2)

±1250

Machine models (MM) ±200

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