LMP91300
ZHCSBP0B –SEPTEMBER 2013–REVISED MARCH 2014
www.ti.com.cn
目目录录
7.3 Feature Description................................................. 11
1 特特性性.......................................................................... 1
7.4 Device Functional Modes........................................ 14
2 应应用用范范围围................................................................... 1
7.5 Programming........................................................... 14
3 说说明明.......................................................................... 1
7.6 Register Maps......................................................... 18
4 修修订订历历史史记记录录 ........................................................... 2
8 Application and Implementation ........................ 28
5 Terminal Configuration and Functions................ 3
8.1 Application Information............................................ 28
6 Specifications......................................................... 5
8.2 Typical Application .................................................. 28
6.1 Absolute Maximum Ratings ..................................... 5
9 Power Supply Recommendations...................... 35
6.2 Handling Ratings....................................................... 5
10 Layout................................................................... 35
6.3 Recommended Operating Conditions....................... 5
10.1 Layout Guidelines ................................................. 35
6.4 Thermal Information.................................................. 5
10.2 Layout Example .................................................... 36
6.5 Electrical Characteristics .......................................... 6
11 器器件件和和文文档档支支持持 ..................................................... 37
6.6 Timing Requirements................................................ 7
11.1 Trademarks........................................................... 37
6.7 Typical Characteristics.............................................. 8
11.2 Electrostatic Discharge Caution............................ 37
7 Detailed Description............................................ 11
11.3 Glossary................................................................ 37
7.1 Overview ................................................................. 11
12 机机械械封封装装和和可可订订购购信信息息 .......................................... 37
7.2 Functional Block Diagram ....................................... 11
4 修修订订历历史史记记录录
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2013) to Revision B Page
• 已更改 将版面布局更改为全新的数据表格式 .......................................................................................................................... 1
• Added Burn Current Specification. ......................................................................................................................................... 6
• Added additional information to Low R
P
, Close Target, Under Range Switch Enable section. .......................................... 12
• Changed typo. ..................................................................................................................................................................... 31
• Added additional information to R
EXTB
section. .................................................................................................................... 31
Changes from Original (September 2013) to Revision A Page
• 已更改 更改为生产数据........................................................................................................................................................... 1
• Added CSP package ............................................................................................................................................................. 3
2 Copyright © 2013–2014, Texas Instruments Incorporated
