TI-LMP92018.pdf

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Output

VDD Relative to GND −0.3V to 6.0V

VIO Relative to GND −0.3V to VDD

VGPIO Relative to GND −0.3V to VDD

Voltage between any 2 pins

6.0V

Current through VGPIO 20mA, T

Current through GND

Junction Temperature +150°C

Storage Temperature Range −65°C to +150°C

Human Body Model 2500V

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4) When the input voltage (VIN) at any pin exceeds power supplies (VIN < GND or VIN > VDD), the current at that pin must not exceed

5mA, and the voltage (VIN) at that pin relative to any other pin must not exceed 6.0V. See Pin Descriptions for additional details of input

circuit structures.

(5) The Human Body Model (HBM) is a 100 pF capacitor charged to the specified voltage then discharged through a 1.5kΩ resistor into

each pin. The Machine Model (MM) is a 200 pF capacitor charged to specified voltage then discharged directly into each pin. The

Charged Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through

some triboelectric (frictional) or electrostatic induction process and then abruptly touches a grounded object or surface.