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TI-LMP90080-Q1.pdf
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LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
具具有有后后台台校校准准的的 LMP90080-Q1 多多通通道道 16 位位传传感感器器模模拟拟前前端端 (AFE)
查查询询样样片片: LMP90080-Q1
1
特特性性
应应用用
23
• 16 位位低低功功耗耗三三角角积积分分 (Σ-Δ) 模模数数转转换换器器 (ADC)
• 温温度度和和压压力力发发送送器器
• 所所有有增增益益上上的的真真连连续续背背景景校校准准 • 应应变变仪仪接接口口
• 使使用用期期望望值值编编程程进进行行适适当当的的系系统统校校准准 • 工工业业过过程程控控制制
• 低低噪噪声声可可编编程程增增益益 (1x - 128x)
说说明明
• 连连续续后后台台开开路路/短短路路和和范范围围外外传传感感器器诊诊断断
LMP90080-Q1 是一款高集成、多通道、低功耗 16 位
• 单单周周期期稳稳定定的的 8 个个输输出出数数据据速速率率 (ODR)
传感器 AFE。 此器件特有一个精密 16 位三角积分模
• 源源自自 100µA 至至 1000 µA 的的 2 个个已已匹匹配配激激励励电电流流
数转换器 (ADC),此转换器具有一个低噪声可编程增
• 4 个个差差分分 (DIFF) / 7 个个单单端端 (SE) 输输入入
益放大器和一个完全差分高阻抗模拟输入复用器。 一
• 2 个个 DIFF / 4 个个 SE 输输入入
个真连续后台校准特性可在所有增益和输出数据速率上
• 7 个个通通用用输输入入/输输出出引引脚脚
实现校准而又不会中断信号路径。 后台校准特性在温
• 用用于于实实现现低低偏偏移移的的斩斩波波稳稳定定缓缓冲冲器器
度和时间范围内从根本上消除了增益和偏移误差,从而
• 支支持持循循环环冗冗余余码码校校验验 (CRC) 数数据据链链接接误误差差检检测测的的
在不损失速度和功耗的情况下提供测量精度。
SPI 4/3 线线制制接接口口
• ODR ≤ 13.42SPS 时时的的 50Hz 至至 60Hz 线线路路扰扰动动抑抑
LMP90080-Q1 的另外一个特性是其连续后台传感器诊
制制
断,此诊断可在无需用户干预的情况下实现开路和短路
• 每每通通道道独独立立增增益益和和 ODR 选选择择
情况以及范围以外信号的检测,从而提高了系统可靠
• 由由 WEBENCH
®
传传感感器器 AFE 设设计计工工具具提提供供支支持持
性。
• 自自动动通通道道排排序序器器
两组独立外部基准引脚可实现多个比率测量。 此外,
在 LMP90080-Q1 上还提供两个已匹配的可编程电流
主主要要技技术术规规格格
源来为诸如阻性温度检测器和桥式传感器等外部传感器
• 有有效效位位数数 (ENOB)/NFR::高高达达 16/16 位位
供电。 此外,还提供了 7 个 GPIO 引脚与外部发光二
• 偏偏移移误误差差((典典型型值值))::8.4nV
极管 (LED) 和开关进行对接以简化绝缘格栅上的控
• 增增益益误误差差((典典型型值值))::7ppm
制。
• 总总体体噪噪声声::< 10µV-rms
• 积积分分非非线线性性((INL 最最大大值值))::±1 最最低低有有效效位位 (LSB)
总的来说,这些特性使得 LMP90080-Q1 成为针对诸
• 输输出出数数据据速速率率 (ODR)::1.6775 - 214.65SPS
如温度、压力、应变仪和工业过程控制等低功耗、精密
• 模模拟拟电电压压,,V
A
::+4.75V 至至 +5.5V
传感器应用的完整模拟前端。 LMP90080-Q1 可在 -
• 工工作作温温度度范范围围::-40 至至 +150°C
40°C 至 +150°C 的扩展温度范围内稳定工作并采用 28
引脚带外露焊盘封装。
• 封封装装::28 引引脚脚带带外外露露垫垫封封装装
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2WEBENCH is a registered trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
版权 © 2013–2014, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not English Data Sheet: SNIS186
necessarily include testing of all parameters.
VA
Internal
CLK
Ext. Clk
Detect
CLK/
XIN
XOUT
CSB
SCLK
SDI
SDO/DRDYB
VREFP1
VREFN1
VIN0
VIN1
VIN2
VIN3
VIN4
VIN5
IB1
IB2
VA
EXC.
CURRENT
GND
GPIO
D0
D6/
DRDYB
Open/Short
Sensor Diag.
VIO
EXC.
CURRENT
SERIAL I/F
CONTROL
&
CALIBRATION
DATA PATH
POR
16 bit 6'
Module
DIGITAL
FILTER
CLK
MUX
BUFF
VIN6/VREFP2
MUX
Chip Configurable
Channel Configurable
Fixed
LMP90080
BACKGROUND
CALIBRATION
PGA
1x, 2x,
4x, 8x
VIN7/VREFN2
VREF
FGA
16x
INPUT MUX
LMP90080/
LMP90078 only
LMP90080/
LMP90079 only
LMP90080
IB1
Micro-
Controller
SCLK
VIN0
VIN2
VIN4
VIN6/VREFP2
4-Wire RTD
3-Wire RTD
2 -Wire RTD
1
4
2
3
...
...
VIN7/
VREFN2
CSB
SDO/DRDYB
SDI
D0
D6/DRDYB
...
XOUT
CLK/XIN
GND
VA
IB2
VREFN1
...
VIO
VA
LEDs/
Switches
VREFP1
Thermocouple
+
-
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
Typical Application
Block Diagram
Figure 1. Block Diagram
2 Copyright © 2013–2014, Texas Instruments Incorporated
1
VA
2VIN0
3
VIN1
4
VIN2
5
VIN3
6
VIN4
7
VIN5
8
VREFP1
9
VREFN1
10
VIN6/VREFP2
11
12
28
27
26
25
24
23
22
21
20
19
18
17
VIO
D6 / DRDYB
D5
D4
D3
D2
D1
D0
SDO/DRDYB
SDI
SCLK
13
14
LMP90080
16
15
VIN7/VREFN2
IB2
IB1
XOUT
CSB
GND
XIN/CLK
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
True Continuous Background Calibration
The LMP90080-Q1 features a 16 bit ΣΔ core with continuous background calibration to compensate for gain and
offset errors in the ADC, virtually eliminating any drift with time and temperature. The calibration is performed in
the background without user or ADC input interruption, making it unique in the industry and eliminating down time
associated with field calibration required with other solutions. Having this continuous calibration improves
performance over the entire life span of the end product.
Continuous Background Sensor Diagnostics
Sensor diagnostics are also performed in the background, without interfering with signal path performance,
allowing the detection of sensor shorts, opens, and out-of-range signals, which vastly improves system reliability.
In addition, the fully flexible input multiplexer described below allows any input pin to be connected to any ADC
input channel providing additional sensor path diagnostic capability.
Flexible Input MUX Channels
The flexible input MUX allows interfacing to a wide range of sensors such as thermocouples, RTDs, thermistors,
and bridge sensors. The LMP90080-Q1’s multiplexer supports 4 differential channels. Each effective input
voltage that is digitized is V
IN
= V
INX
– V
INY
, where x and y are any input. In addition, the input multiplexer of the
LMP90080-Q1 also supports 7 single-ended channels, where the common ground is any one of the inputs.
Programmable Gain Amplifiers (FGA & PGA)
The LMP90080-Q1 contains an internal 16x fixed gain amplifier (FGA) and a 1x, 2x, 4x, or 8x programmable gain
amplifier (PGA). This allows accurate gain settings of 1x, 2x, 4x, 8x, 16x, 32x, 64x, or 128x through configuration
of internal registers. Having an internal amplifier eliminates the need for external amplifiers that are costly, space
consuming, and difficult to calibrate.
Excitation Current Sources (IB1 & IB2)
Two matched internal excitation currents, IB1 and IB2, can be used for sourcing currents to a variety of sensors.
The current range is from 100 µA to 1000 µA in steps of 100 µA.
Connection Diagram
Figure 2. 28-pin HTSSOP
Copyright © 2013–2014, Texas Instruments Incorporated 3
LMP90080-Q1
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
www.ti.com.cn
Pin Descriptions
Pin # Pin Name Type Function
1 VA Analog Supply Analog power supply pin
2 - 4 VIN0 - VIN2 Analog Input Analog input pins
5 - 7 VIN3 - VIN5 Analog Input Analog input pins
8 VREFP1 Analog Input Positive reference input
9 VREFN1 Analog Input Negative reference input
10 VIN6 / VREFP2 Analog Input Analog input pin or VREFP2 input
11 VIN7 / VREFN2 Analog Input Analog input pin or VREFN2 input
12 - 13 IB2 & IB1 Analog output Excitation current sources for external RTDs
14 XOUT Analog output External crystal oscillator connection
15 XIN / CLK Analog input External crystal oscillator connection or external clock input
16 GND Ground Power supply ground
17 CSB Digital Input Chip select bar
18 SCLK Digital Input Serial clock
19 SDI Digital Input Serial data input
20 SDO / DRDYB Digital Output Serial data output and data ready bar
21 - 26 D0 - D5 Digital IO General purpose input/output (GPIO) pins
27 D6 / DRDYB Digital IO General purpose input/output pin or data ready bar
28 VIO Digital Supply Digtal input/output supply pin
Thermal Pad Leave the thermal pad floating
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)(4)
Analog Supply Voltage, VA -0.3V to 6.0V
Digital I/O Supply Voltage, VIO -0.3V to 6.0V
Reference Voltage, VREF -0.3V to VA+0.3V
Voltage on Any Analog Input Pin to GND
(5)
-0.3V to VA+0.3V
Voltage on Any Digital Input PIN to GND
(5)
-0.3V to VIO+0.3V
Voltage on SDO
(5)
-0.3V to VIO + 0.3V
Input Current at Any Pin
(5)
5mA
Output Current Source or Sink by SDO 3mA
Total Package Input and Output Current 20mA
Human Body Model (HBM) 2500V
ESD Susceptibility Machine Model (MM) 200V
Charged Device Model (CDM) 1250V
Junction Temperature (T
JMAX
) +150°C
Storage Temperature Range –65°C to +150°C
(1) All voltages are measured with respect to GND, unless otherwise specified
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) For soldering specifications see product folder at http://www.ti.com and http://www.ti.com/lit/SNOA549
(4) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(5) When the input voltage (VIN) exceeds the power supply (VIN < GND or VIN > VA), the current at that pin must be limited to 5mA and
VIN has to be within the Absolute Maximum Rating for that pin. The 20 mA package input current rating limits the number of pins that
can safely exceed the power supplies with current flow to four pins.
4 Copyright © 2013–2014, Texas Instruments Incorporated
LMP90080-Q1
www.ti.com.cn
ZHCSC22A –MAY 2013–REVISED JANUARY 2014
Operating Ratings
Analog Supply Voltage, VA +4.75V to 5.5V
Digital I/O Supply Voltage, VIO +2.7V to 5.5V
Full Scale Input Range, VIN ±VREF / PGA
Reference Voltage, VREF +0.5V to VA
T
MIN
= –40°C
Temperature Range for Electrical Characteristics
T
MAX
= +150°C
Operating Temperature Range –40°C ≤ T
A
≤ +150°C
Junction to Ambient Thermal Resistance (θ
JA
)
(1)
41°C/W
(1) The maximum power dissipation is a function of T
J(MAX)
AND θ
JA
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
) / θ
JA
.
Copyright © 2013–2014, Texas Instruments Incorporated 5
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