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AMC3330-Q1 具有集成直流/直流转换器的精密、±1V 输入、增强型隔离放大器

1 特性

• 符合面向汽车应用的 AEC-Q100 标准：

– 温度等级 1: – 40 ° C 至 125 ° C 、 T

• 3.3V 或 5V 单电源运行，具有集成直流/直流转换器

• ±1V 输入电压范围，针对具有高输入阻抗的电压测

量进行了优化

• 固定增益：2.0

• 低直流误差：

– 增益误差：±0.2%（最大值）

– 增益漂移：±45ppm/°C（最大值）

– 失调电压误差：±0.3mV（最大值）

– 温漂±4µV/°C（最大值）

– 非线性度：±0.02%（最大值）

• 高 CMTI: 85kV/µs（最小值）

• 系统级诊断功能

• 安全相关认证：

– 符合 DIN VDE V 0884-11 (VDE V 0884-11) 标

准的 6000V

增强型隔离：2017-01

– 符合 UL1577 标准且长达 1 分钟的

4250V<sub>1RMS</sub>2 隔离

• 符合 CISPR-11 和 CISPR-25 EMI 标准

2 应用

• 可用于以下应用的隔离式电压感应：

– HEV/EV 车载充电器 (OBC)

– HEV/EV 直流/直流转换器

– HEV/EV 牵引逆变器

3 说明

AMC3330-Q1 是一款具有完全集成的隔离式直流/直流

转换器的精密隔离式放大器，能实现器件低侧的单电源

运行。该增强型电容隔离层通过了 VDE V 0884-11 和

UL1577 标准认证，将以不同共模电压电平运行的系统

各部分隔开，并保护低压域免受损坏。

AMC3330-Q1 的输入针对直接连接高阻抗电压信号源

（例如电阻分压器网络）的情况进行了优化，以感应高

压信号。集成式隔离直流/直流转换器可测量非接地信

号，并使该器件成为嘈杂空间受限应用的独特解决方

案。

器件性能出色，支持进行精确的电压监控和控制。

AMC3330-Q1 的集成直流/直流转换器故障检测和诊断

输出引脚可简化系统级设计和诊断。

AMC3330-Q1 的额定工作温度范围为 -40°C 至

+125°C。

器件信息

(1)

器件型号封装

封装尺寸（标称值）

AMC3330-Q1 SOIC (16) 10.30mm × 7.50mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

Isolated

Power

Isolated

Power

AMC3330-Q1

Reinforced Isolation

DCDC_IN

DCDC_GND

LDO_OUT

VDD

OUTP

OUTN

GND

DIAG

GND

To MCU (optional)

DCDC_OUT

DCDC_HGND

HLDO_IN

HLDO_OUT

HGND

INP

INN

3.3 V / 5 V

to ADC / MCU

应用示例

www.ti.com.cn

AMC3330-Q1

ZHCSKS7A – JUNE 2020 – REVISED OCTOBER 2020

Submit Document Feedback

Product Folder Links: AMC3330-Q1

AMC3330-Q1

ZHCSKS7A – JUNE 2020 – REVISED OCTOBER 2020

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SBASA35

Table of Contents

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4

6.2 ESD Ratings .............................................................. 4

6.3 Recommended Operating Conditions ........................4

6.4 Thermal Information ...................................................5

6.5 Power Ratings ............................................................5

6.6 Insulation Specifications ............................................ 6

6.7 Safety-Related Certifications ..................................... 7

6.8 Safety Limiting Values ................................................7

6.9 Electrical Characteristics ............................................8

6.10 Switching Characteristics .........................................9

6.11 Timing Diagram......................................................... 9

6.12 Insulation Characteristics Curves........................... 10

6.13 Typical Characteristics............................................ 11

7 Detailed Description......................................................17

7.1 Overview................................................................... 17

7.2 Functional Block Diagram......................................... 17

7.3 Feature Description...................................................17

7.4 Device Functional Modes..........................................21

8 Application and Implementation.................................. 22

8.1 Application Information............................................. 22

8.2 Typical Application.................................................... 22

8.3 What to Do and What Not to Do............................... 25

9 Power Supply Recommendations................................26

10 Layout...........................................................................28

10.1 Layout Guidelines................................................... 28

10.2 Layout Example...................................................... 28

11 Device and Documentation Support..........................29

11.1 Device Support........................................................29

11.2 Documentation Support.......................................... 29

11.3 Receiving Notification of Documentation Updates.. 29

11.4 Support Resources................................................. 29

11.5 Trademarks............................................................. 29

11.6 Electrostatic Discharge Caution.............................. 29

11.7 Glossary.................................................................. 29

12 Mechanical, Packaging, and Orderable

Information.................................................................... 29

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision * (June 2020) to Revision A (October 2020) Page

• 将文档状态从“预告信息”更改为“量产数据”................................................................................................ 1

AMC3330-Q1

ZHCSKS7A – JUNE 2020 – REVISED OCTOBER 2020

www.ti.com.cn

Submit Document Feedback

Product Folder Links: AMC3330-Q1

6 Specifications

6.1 Absolute Maximum Ratings

see

(1)

MIN MAX UNIT

Power-supply voltage VDD to GND

–0.3

6.5 V

Analog input voltage INP, INN

HGND – 6

HLDOout

+ 0.5 V

Analog output voltage OUTP, OUTN

GND – 0.5

VDD + 0.5 V

Digital output voltage DIAG

GND – 0.5

5.5 V

Input current Continuous, any pin except power-supply pins

–10

10 mA

Temperature

Junction, T

150

°C

Storage, T

stg

–65

150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002

(1)

, HBM ESD classification

Level 2

±2000

Charged-device model (CDM), per AEC Q100-011, CDM ESD

classification Level C6

±1000

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN NOM MAX UNIT

POWER SUPPLY

VDD Low-side supply voltage VDD to GND 3.0 3.3 5.5 V

ANALOG INPUT

Clipping

Differential input voltage before clipping output

= V

INP

– V

INN

±1.25 V

FSR

Specified linear differential full-scale voltage

= V

INP

– V

INN

–1

1 V

Absolute common-mode input voltage

(1)

INP

+ V

INN

) / 2 to HGND

–2

3 V

Operating common-mode input voltage

INP

+ V

INN

) / 2 to HGND,

INP

= V

INN

–1.4

1.6

INP

+ V

INN

) / 2 to HGND,

INP

– V

INN

| = 1.0 V

(2)

–0.925

0.725

INP

+ V

INN

) / 2 to HGND,

INP

– V

INN

| = 1.25 V

–0.8

0.6

DIGITAL OUTPUT

Pull-up supply-voltage for DIAG pin 0 VDD V

TEMPERATURE RANGE

Operating ambient temperature

–40

25 125 °C

(1) Steady-state voltage supported by the device in case of a system failure. See specified common-mode input voltage V

for normal

operation. Observe analog input voltage range as specified in the Absolute Maximum Ratings table.

(2) Linear response.

AMC3330-Q1

ZHCSKS7A – JUNE 2020 – REVISED OCTOBER 2020

www.ti.com.cn

Submit Document Feedback

Product Folder Links: AMC3330-Q1

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