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TI-LMK04228.pdf
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DAC
Recovered
³GLUW\´FORFNRU
clean clock
0XOWLSOH³FOHDQ´
clocks at
different
frequencies
CLKout0,
CLKout1,
CLKout2,
CLKout3
CLKout10
CLKout11
CLKout4,
CLKout5
FPGA
CLKin0
VCXO
Backup
Reference
Clock
CLKin1
DAC ADC
Serializer/
Deserializer
LMK04228
CLKout6,
CLKout7,
CLKout8,
CLKout9
ADC
ADC
DAC
DAC
Copyright © 2017, Texas Instruments Incorporated
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNAS689
LMK04228
ZHCSK16A –OCTOBER 2017–REVISED JULY 2019
具具有有双双环环路路 PLL 的的 LMK04228 超超低低噪噪声声且且符符合合 JESD204B 标标准准的的时时钟钟抖抖
动动清清除除器器
1
1 特特性性
1
• JEDEC JESD204B 支持
• 超低 RMS 抖动
– 156fs RMS 抖动(12kHz 至 20MHz)
– 245fs RMS 抖动(100Hz 至 20MHz)
– 245.76MHz 时具有 –162.5dBc/Hz 本底噪声
• PLL2 提供多达 14 个差动器件时钟
– 多达 7 个 SYSREF 时钟
– 最高时钟输出频率:1.25GHz
– PLL2 提供 LVPECL、LVDS 可编程输出
• PLL1 提供缓冲的 VCXO 或晶体输出
– LVPECL、LVDS、2xLVCMOS 可编程输出
• 双环路 PLLatinum™锁相环 (PLL) 架构
• PLL1
– 多达 3 个冗余输入时钟
– 自动和手动切换模式
– 无中断切换和 LOS
– 集成低噪声晶体振荡器电路
– 输入时钟丢失时采用保持模式
• PLL2
– 标准 [1Hz] PLL 本底噪声为 -224dBc/Hz
– 相位检测器频率高达 155MHz
– OSCin 倍频器
– 两个集成低噪声 VCO
• 50% 占空比输出分配,1 至 32
(偶数和奇数)
• 精密数字延迟
• 25ps 步长模拟延迟
• 多模式:双 PLL 或单 PLL
• 工业温度范围:–40°C 至 85°C
• 3.15V 至 3.45V 工作电压
• 封装:64 引脚 WQFN (9.0 × 9.0 × 0.8mm)
2 应应用用
• 无线基础设施
• 数据转换器时钟
• 网络、SONET/SDH、DSLAM
• 医疗/视频/军事/航天
• 测试和测量
3 说说明明
LMK04228 器件是支持 JEDEC JESD204B 且在业界
具有高性能的时钟调节器。
PLL2 可以配置 14 个时钟输出以驱动 7 个 JESD204B
转换器或其他逻辑器件(使用器件和 SYSREF 时
钟)。SYSREF 可以通过直流和交流耦合提供。不只
是 JESD204B 应用,14 个输出中的每一个输出都可以
单独配置为用于传统时钟系统的高性能输出。
LMK04228 既具有出色的性能, 又具有 多种特性,如
功率和性能均衡调节、双 VCO、保持模式和可根据输
出调节的模拟和数字延迟,是提供灵活的高性能时钟树
的理想器件。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
LMK04228 WQFN (64) 9.00mm x 9.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
频频率率输输出出
器器件件型型号号 VCO0 频频率率 VCO1 频频率率
LMK04228
2370MHz 至
2630MHz
2920MHz 至 3080MHz
简简化化原原理理图图
2
LMK04228
ZHCSK16A –OCTOBER 2017–REVISED JULY 2019
www.ti.com.cn
版权 © 2017–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics........................................... 7
7.6 SPI Interface Timing ............................................... 13
7.7 Timing Diagram....................................................... 13
8 Parameter Measurement Information ................ 15
8.1 Charge Pump Current Specification Definitions...... 15
8.2 Differential Voltage Measurement Terminology ..... 16
9 Detailed Description............................................ 17
9.1 Overview ................................................................. 17
9.2 Functional Block Diagrams ..................................... 20
9.3 Feature Description................................................. 23
9.4 Programming........................................................... 32
9.5 Register Maps ........................................................ 33
10 Application and Implementation........................ 75
10.1 Application Information.......................................... 75
10.2 Typical Application ................................................ 78
10.3 Do's and Don'ts..................................................... 79
11 Power Supply Recommendations ..................... 80
11.1 Current Consumption / Power Dissipation
Calculations.............................................................. 80
12 Layout................................................................... 81
12.1 Layout Guidelines ................................................. 81
12.2 Layout Example .................................................... 82
13 器器件件和和文文档档支支持持 ..................................................... 83
13.1 器件支持................................................................ 83
13.2 社区资源................................................................ 83
13.3 商标 ....................................................................... 83
13.4 静电放电警告......................................................... 83
13.5 Glossary................................................................ 83
14 机机械械、、封封装装和和可可订订购购信信息息....................................... 83
4 修修订订历历史史记记录录
Changes from Original (October 2017) to Revision A Page
• 将数据表版本状态从产品定制更改为产品目录........................................................................................................................ 1
• 已删除 删除了有关分配模式的参考内容(不支持)................................................................................................................ 1
• 已删除 删除了有关动态延迟的参考内容(不支持)................................................................................................................ 1
• Updated default output table note ........................................................................................................................................ 11
• Added missing cross reference to differential voltage definition .......................................................................................... 12
• Removed typical phase noise plots ..................................................................................................................................... 13
• Updated description for improved clarity .............................................................................................................................. 17
• Deleted reference to distribution mode (unsupported) ......................................................................................................... 17
• Updated delay circuit descriptions for improved clarity ........................................................................................................ 18
• Deleted reference to dynamic delay (unsupported) ............................................................................................................. 19
• Deleted reference to dynamic delay, bypass mode in clock output block diagram (unsupported) ...................................... 21
• Deleted reference to distribution mode in SYNC/SYSREF clocking path diagram (unsupported) ...................................... 22
• Clarified digital lock detect for cases where phase detector frequency exceeds default PLL1_WND_SIZE ...................... 29
• Removed device functional modes section .......................................................................................................................... 32
• Clarified requirements for unused registers in recommended programming sequence....................................................... 32
• Added registers 0x171 and 0x172 to default register programming .................................................................................... 32
• Deleted redundant user-inaccessible registers in register map ........................................................................................... 33
• Changed address bits to clarify address position relative to data bits ................................................................................. 33
• Deleted references to dynamic delay in register map (unsupported)................................................................................... 33
• Corrected CLKinX_R register size in register map............................................................................................................... 35
• Corrected PLL1_N register size in register map .................................................................................................................. 35
• Deleted reference to DCLKoutX_MUX bypass mode (unsupported)................................................................................... 40
• Corrected delay value descriptions for SDCLKoutY_ADLY ................................................................................................. 41
• Deleted reference to dynamic delay (unsupported) ............................................................................................................. 42
3
LMK04228
www.ti.com.cn
ZHCSK16A –OCTOBER 2017–REVISED JULY 2019
Copyright © 2017–2019, Texas Instruments Incorporated
修修订订历历史史记记录录 (接接下下页页)
• Updated missing cross-reference......................................................................................................................................... 49
• Corrected CLKinX_R register length .................................................................................................................................... 59
• Corrected PLL1_N register length........................................................................................................................................ 60
• Corrected PLL2_R register length........................................................................................................................................ 64
• Split PLL2_FCAL_DIS and PLL2_N register tables into separate definitions ...................................................................... 66
• Added register 0x171 and 0x172 to register descriptions .................................................................................................... 72
• Corrected RB_PLL1_LD and RB_PLL2_LD polarity ........................................................................................................... 73
• Added note clarifying PLL1_WND_SIZE and impact on holdover exit................................................................................. 75
• Changed references to deprecated software tools to point to TICS Pro.............................................................................. 78
• Removed application curves section.................................................................................................................................... 79
• Deleted unused column in typical current consumption table .............................................................................................. 80
• Fixed truncated layout example image ................................................................................................................................ 82
• 已删除 删除了弃用软件工具的链接....................................................................................................................................... 83
SDCLKout1
SCK
SDIO
CS*
NC
NC
NC
Vcc1_VCO
LDObyp1
LDObyp2
Status_LD1
Vcc9_CP2
Vcc7_OSCout
Vcc12_CG0
CPout2
Vcc10_PLL2
DCLKout4*
DCLKout4
OSCin
OSCin*
CPout1
Vcc8_OSCin
CLKin0
CLKin0*
SDCLKout3*
SDCLKout3
Vcc2_CG1
DCLKout2
DCLKout2*
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
SDCLKout1*
Vcc11_CG3
DCLKout10
SYNC/SYSREF_REQ
Vcc6_PLL1
CLKin1/Fin/FBCLKin
CLKin1*/Fin*/FBCLKin*
CLKin_SEL1
DCLKout0
DCLKout0*
SDCLKout11*
DCLKout10*
SDCLKout11
SDCLKout5
SDCLKout5*
OSCout*/CLKin2*
OSCout/CLKin2
SDCLKout13
DCLKout12*
SDCLKout13*
DCLKout12
SDCLKout7*
SDCLKout7
DCLKout6*
DCLKout6
SDCLKout9
DCLKout8*
SDCLKout9*
DCLKout8
Vcc4_CG2
Status_LD2
RESET/GPO
CLKin_SEL0
Vcc3_SYSREF
LLP-64
Top down view
DAP
Vcc5_DIG
Clock Group 1
Clock Group 0
Clock Group 2
Clock Group 3
4
LMK04228
ZHCSK16A –OCTOBER 2017–REVISED JULY 2019
www.ti.com.cn
Copyright © 2017–2019, Texas Instruments Incorporated
(1) OSCout may also be third clock input, CLKin2.
5 Device Comparison Table
Table 1. Device Configuration Information
PART NUMBER
REF-
ERENCE
INPUTS
(1)
OSCout (BUFFERED
OSCin Clock) LVDS/
LVPECL/ LVCMOS
(1)
PLL2
PROGRAMMABLE
LVDS/LVPECL
OUTPUTS
VCO0 FREQUENCY VCO1 FREQUENCY
LMK04228 Up to 3 Up to 1 14 2370 to 2630 MHz 2920 to 3080 MHz
(1) See Pin Connection Recommendations section for recommended connections.
6 Pin Configuration and Functions
NKD Package
64-Pin WQFN
Top View
Pin Functions
(1)
PIN
I/O TYPE DESCRIPTION
NO. NAME
1 DCLKout0
O Programmable Device clock output 0.
2 DCLKout0*
3 SDCLKout1
O Programmable SYSREF / Device clock output 1
4 SDCLKout1*
5
LMK04228
www.ti.com.cn
ZHCSK16A –OCTOBER 2017–REVISED JULY 2019
Copyright © 2017–2019, Texas Instruments Incorporated
Pin Functions
(1)
(continued)
PIN
I/O TYPE DESCRIPTION
NO. NAME
5 RESET/GPO I CMOS Device reset input or GPO
6 SYNC/SYSREF_REQ I CMOS Synchronization input or SYSREF_REQ for requesting continuous SYSREF.
7, 8, 9 NC — — Do not connect. These pins must be left floating.
10 Vcc1_VCO — PWR Power supply for VCO LDO.
11 LDObyp1 — ANLG LDO Bypass, bypassed to ground with 10-µF capacitor.
12 LDObyp2 — ANLG LDO Bypass, bypassed to ground with a 0.1-µF capacitor.
13 SDCLKout3
O Programmable SYSREF / Device Clock output 3.
14 SDCLKout3*
15 DCLKout2
O Programmable Device clock output 2.
16 DCLKout2*
17 Vcc2_CG1 — PWR Power supply for clock outputs 2 and 3.
18 CS* I CMOS Chip Select
19 SCK I CMOS SPI Clock
20 SDIO I/O CMOS SPI Data
21 Vcc3_SYSREF — PWR Power supply for SYSREF divider and SYNC.
22 SDCLKout5
O Programmable SYSREF / Device clock output 5.
23 SDCKLout5*
24 DCLKout4
O Programmable Device clock output 4.
25 DCLKout4*
26 Vcc4_CG2 — PWR Power supply for clock outputs 4, 5, 6 and 7.
27 DCLKout6
O Programmable Device clock output 6.
28 DCLKout6*
29 SDCLKout7
O Programmable SYSREF / Device clock output 7.
30 SDCLKout7*
31 Status_LD1 I/O Programmable Programmable status pin.
32 CPout1 O ANLG Charge pump 1 output.
33 Vcc5_DIG — PWR Power supply for the digital circuitry.
34 CLKin1
I ANLG Reference Clock Input Port 1 for PLL1.
35 CLKin1*
36 Vcc6_PLL1 — PWR Power supply for PLL1, charge pump 1, holdover DAC
37 CLKin0
I ANLG Reference Clock Input Port 0 for PLL1.
38 CLKin0*
39 Vcc7_OSCout — PWR Power supply for OSCout port.
40 OSCout/CLKin2
O Programmable
Buffered output of OSCin port.
41 OSCout*/CLKin2* Reference Clock Input Port 2 for PLL1.
42 Vcc8_OSCin — PWR Power supply for OSCin
43 OSCin
I ANLG Feedback to PLL1, Reference input to PLL2. AC-coupled.
44 OSCin*
45 Vcc9_CP2 — PWR Power supply for PLL2 Charge Pump.
46 CPout2 O ANLG Charge pump 2 output.
47 Vcc10_PLL2 — PWR Power supply for PLL2.
48 Status_LD2 I/O Programmable Programmable status pin.
49 SDCLKout9
O Programmable SYSREF / Device clock 9
50 SDCLKout9*
51 DCLKout8
O Programmable Device clock output 8.
52 DCLKout8*
53 Vcc11_CG3 — PWR Power supply for clock outputs 8, 9, 10, and 11.
54 DCLKout10
O Programmable Device clock output 10.
55 DCLKout10*
56 SDCLKout11
O Programmable SYSREF / Device clock output 11.
57 SDCLKout11*
58 CLKin_SEL0 I/O Programmable Programmable status pin.
59 CLKin_SEL1 I/O Programmable Programmable status pin.
60 SDCLKout13
O Programmable SYSREF / Device clock output 13.
61 SDCLKout13*
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