TI-DS90CP22.pdf
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DS90CP22
www.ti.com
SNLS053E –MARCH 2000–REVISED APRIL 2013
DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch
Check for Samples: DS90CP22
1
FEATURES
DESCRIPTION
DS90CP22 is a 2x2 crosspoint switch utilizing LVDS
2
• DC - 800 Mbps Low Jitter, Low Skew Operation
(Low Voltage Differential Signaling) technology for
• 65 ps (typ) of Pk-Pk Jitter with PRBS = 2
23
−1
low power, high speed operation. Data paths are fully
Data Pattern at 800 Mbps
differential from input to output for low noise
• Single +3.3 V Supply
generation and low pulse width distortion. The non-
blocking design allows connection of any input to any
• Less than 330 mW (typ) Total Power
output or outputs. LVDS I/O enable high speed data
Dissipation
transmission for point-to-point interconnects. This
• Non-Blocking "'Switch Architecture"'
device can be used as a high speed differential
• Balanced Output Impedance
crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2
signal splitter. The mux and demux functions are
• Output Channel-to-Channel Skew is 35 ps (typ)
useful for switching between primary and backup
• Configurable as 2:1 mux, 1:2 demux, Repeater
circuits in fault tolerant systems. The 1:2 signal
or 1:2 Signal Splitter
splitter and 2:1 mux functions are useful for
• LVDS Receiver Inputs Accept LVPECL Signals distribution of serial bus across several rack-mounted
backplanes.
• Fast Switch Time of 1.2ns (typ)
The DS90CP22 accepts LVDS signal levels, LVPECL
• Fast Propagation Delay of 1.3ns (typ)
levels directly or PECL with attenuation networks.
• Receiver Input Threshold < ±100 mV
The individual LVDS outputs can be put into TRI-
• Available in 16 Lead TSSOP and SOIC
STATE by use of the enable pins.
Packages
• Conforms to ANSI/TIA/EIA-644-1995 LVDS For more details, please refer to the Application
Information section of this datasheet.
Standard
• Operating Temperature: −40°C to +85°C
Connection Diagram
Figure 1. SOIC-16 Package
or
TSSOP-16 Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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