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TI-TS3DS26227.pdf

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TI-TS3DS26227.pdf

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TS3DS26227

SCDS224B –JUNE 2008–REVISED OCTOBER 2010

HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH

WITH INPUT LOGIC TRANSLATION

1 FEATURES

• High-Bandwidth Data Paths – Up to 800 MHz

• Specified Break-Before-Make Switching

• Control Inputs Reference to V

• Low Charge Injection

• Excellent ON-State Resistance Matching

• Low Total Harmonic Distortion (THD)

• 2.3-V to 3.6-V Power Supply (V

)

• 1.65-V to 1.95-V Logic Supply (V

)

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 4000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

– 200-V Machine Model (A115-A)

2 APPLICATIONS

• Cell Phones

• PDAs

• Portable Instrumentation

• Low-Voltage Differential Signal Routing

• Mobile Industry Processor Interface (MIPI) Signal

Routing

4 9

A B

TS3DS26227

SCDS224B –JUNE 2008–REVISED OCTOBER 2010

www.ti.com

Product Folder Links: TS3DS26227

YZT PACKAGE

(BOTTOM VIEW)

Table 1. TERMINAL ASSIGNMENTS

A B C D

1 IN1 NO1 COM1 NC1

2 V

GND GND V

3 IN2 NO2 COM2 NC2

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

3 DESCRIPTION/ORDERING INFORMATION

The TS3DS26227 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from

2.3 V to 3.6 V. The device offers high-bandwidth data paths, and a break-before-make feature to prevent signal

distortion during the transferring of a signal from one path to another. The device has excellent total harmonic

distortion (THD) performance and consumes very low power. These features make this device suitable for

portable applications.

The TS3DS26227 has a separate logic supply pin (V

) that operates from 1.65 V to 1.95 V. V

powers the

control circuitry, which allows the TS3DS26227 to be controlled by 1.8-V signals.

Table 2. ORDERING INFORMATION

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(3)

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZT (Pb-free)

Tape and reel TS3DS26227YZTR

COM1

IN1

(S )ee Note A

NC1

NO1

COM2

IN2

(S )ee Note A

NO2

NC2

TS3DS26227

www.ti.com

SCDS224B –JUNE 2008–REVISED OCTOBER 2010

Product Folder Links: TS3DS26227

(1) V

= 2.7 V, T

= 25°C

Table 3. SUMMARY OF CHARACTERISTICS

(1)

Configuration

Dual 2:1

Multiplexer/Demultiplexer

(2 × SPDT)

Number of channels 2

ON-state resistance (r

) 5 Ω max

ON-state resistance match (Δr

) 0.1 Ω max

ON-state resistance flatness [r

on(flat)

] 3 Ω max

Turn-on/turn-off time (t

OFF

) 9 ns/4 ns

Break-before-make time (t

BBM

) 8 ns

Charge injection (Q

) 5.5 pC

Bandwidth (BW) 800 MHz

OFF isolation (O

ISO

) –40 dB

Crosstalk (X

TALK

) –39 dB

Leakage current [I

NO(OFF)

NC(OFF)

] ±5 nA

Power-supply current (I

) ±20 nA

Package options 12-bump WCSP

Table 4. FUNCTION TABLE

NC TO COM,

COM TO NC

NO TO COM,

COM TO NO

L ON OFF

H OFF ON

LOGIC DIAGRAM

A. IN1 and IN2 are control inputs referenced to V

TS3DS26227

SCDS224B –JUNE 2008–REVISED OCTOBER 2010

www.ti.com

Product Folder Links: TS3DS26227

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum

(3) All voltages are with respect to ground, unless otherwise specified.

(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(5) This value is limited to 5.5 V maximum.

(6) The package thermal impedance is calculated in accordance with JESD 51-7.

3.1 ABSOLUTE MAXIMUM RATINGS

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Supply voltage range

(3)

–0.5 4.6 V

COM

Analog voltage range

(3) (4) (5)

–0.5 V

+ 0.5 V

Analog port diode current

, V

COM

< 0, or V

, V

COM

> V

+ 0.5

–50 50 mA

COM

On-state switch current V

, V

COM

= 0 to V

–64 64

On-state peak switch current –100 100

Digital input voltage range –0.5 V

+ 0.5 V

Digital input clamp current

(3) (4)

< 0, or V

> V

+ 0.5 –50 50 mA

Continuous current through V

–100 100 mA

GND

Continuous current through GND –100 100 mA

Package thermal impedance

(6)

YZT package TBD °C/W

stg

Storage temperature range –65 150 °C

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