TI-TSU5511.pdf
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TSU5511
www.ti.com
SCDS304 –FEBRUARY 2011
SP3T SWITCH WITH IMPEDANCE DETECTION
MICRO-USB SWITCH TO SUPPORT USB, UART, AUDIO, AND CHARGER
Check for Samples: TSU5511
1
FEATURES
• ESD Performance DP/DM/ID/V
BUS
to GND
– ±8-kV Contact Discharge (IEC 61000-4-2)
• Compatible Accessories
– ±15-kV Air Gap Discharge (IEC 61000-4-2)
– USB Data Cable
– UART Cable
APPLICATIONS
– Charger (Dedicated Charger or Host/Hub
• Cellular Telephones
Charger)
– Stereo Headset With Mic
YZP PACKAGE
• Integrated LDOs for V
REF
and Mic Bias
(LASER SCRIBE VIEW)
• USB Path Supports USB 2.0 High Speed
• Audio Path Provides Negative Rail Support
and Click/Pop Reduction
• Supports Factory Test Mode
• 1.8-V Compatible I
2
C Interface
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
PIN ASSIGNMENTS
A B C D E
4 MIC ISET UART_TX USB_DM USB_DP
3 R2.2K INT UART_RX ID DP
2 SDA SCL DSS GND DM
1 CLDO V
SUPPLY
AUDIO_R AUDIO_L V
BUS
DESCRIPTION
The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a
micro-USB connector. The switch features impedance detection for identification of various accessories that are
attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the
switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to
the appropriate channel—data, audio, or UART.
The TSU5511 has an I
2
C interface for communication with the cellphone baseband or applications processor. An
interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated
when the device is unplugged.
Table 1. ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
WCSP – YZP
–40°C to 85°C Tape and reel TSU5511YZPR A62
(0.5-mm pitch)
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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