TI-TLV5535-Q1.pdf
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SGLS230A − JANUARY 2004 − REVISED JUNE 2008
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D Meets AEC-Q100-011 C3A CDM
Classification
D Qualified for Automotive Applications
D 8-Bit Resolution, 35 MSPS Sampling
Analog-to-Digital Converter (ADC)
D Low Power Consumption: 90 mW Typ
Using External References
D Wide Analog Input Bandwidth: 600 MHz Typ
D 3.3-V Single-Supply Operation
D 3.3-V TTL/CMOS-Compatible Digital I/O
D Internal Bottom and Top Reference
Voltages
D Adjustable Reference Input Range
D Power-Down (Standby) Mode
D Separate Power Down for Internal Voltage
References
D Three-State Outputs
D 28-Pin Thin Shrink SOP (TSSOP) Packages
D Applications
− Digital Communications (IF Sampling)
− High-Speed DSP Front-End
(TMS320C6000)
− Video Processing (Scan Rate/Format
Conversion)
− DVD Read Channel Digitization
description/ordering information
The TLV5535 is an 8-bit, 35 MSPS, high-speed A/D converter. It converts the analog input signal into 8-bit
binary-coded digital words up to a sampling rate of 35 MHz. All digital inputs and outputs are 3.3 V
TTL/CMOS-compatible.
The device consumes very little power due to the 3.3-V supply and an innovative single-pipeline architecture
implemented in a CMOS process. The user obtains maximum flexibility by setting both bottom and top voltage
references from user-supplied voltages. If no external references are available, on-chip references are
available for internal and external use. The full-scale range is 1 V
pp
up to 1.6 V
pp
, depending on the analog
supply voltage. If external references are available, the internal references can be disabled independently from
the rest of the chip, resulting in an even greater power saving.
ORDERING INFORMATION
{
T
J
PACKAGE
}
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C TSSOP (PW) Tape and reel TLV5535IPWRQ1 TLV5535Q1
†
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at http://www.ti.com.
‡
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Copyright 2008 Texas Instruments Incorporated
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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DRV
DD
D0
D1
D2
D3
D4
D5
D6
D7
DRV
SS
DV
SS
CLK
OE
DV
DD
AV
SS
AV
DD
AIN
CML
PWDN_REF
AV
SS
REFBO
REFBI
REFTI
REFTO
AV
SS
BG
AV
DD
STBY
PW PACKAGE
(TOP VIEW)
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