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TI-LM3632A.pdf
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VIN
EN
LM3632
SCL
SDA
C1
C2
VNEG
VPOS
BLED1
BLED2
FLED
BL_OUT
FL_OUT
LCM_OUT
FL_SW BL_SW
LCM_SW
TX
PWM
LCM_EN1
LCM_EN2
AGND
FL_GND LCM_GNDBL_GND CP_GND
STROBE
FL_OUT
FLED
C
FL_OUT
C
FLY
L
BL
C
IN
V
BATT
Up to 8 LEDs / String
C
BL_OUT
C
LCM
C
VPOS
C
VNEG
FL_SW
L
FL
L
LCM
D1
Load (mA)
Efficiency (%)
0 5 10 15 20 25 30 35 40 45 50
50
55
60
65
70
75
80
85
90
95
D007
V
IN
= 2.7 V
V
IN
= 3.7 V
V
IN
= 5 V
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LM3632A
ZHCSDN2 –APRIL 2015
LM3632A 集集成成单单芯芯片片背背光光、、偏偏置置电电源源和和 1.5A 闪闪光光灯灯 LED 驱驱动动器器
1 特特性性 3 说说明明
1
• 可驱动多达两个灯串(通常为 8 个串联的 LED)
LM3632A 器件集成了用于 LCD 面板背光照明和摄像
机闪光灯的白光发光二极管 (WLED) 驱动器以及用于
– 集成背光升压转换器,最高输出电压达 29V
LCD 面板的偏置电源。 该器件具备 LED 驱动器所需
– 两个低侧恒流 LED 驱动器,最高输出电流达
25mA
的全套安全功能,并且效率高达 90%,正/负偏置电源
• 背光效率高达 90%
轨精度高达 1.5%。 该器件最多能够驱动 16 个背光
• 11 位指数或线性调光
LED,是中小型显示屏的理想选择。 该器件可使用由
• 具有外部脉宽调制 (PWM) 输入,可实现内容自适
同步升压转换器供电的 1.5A 恒流 LED 驱动器来驱动
应背光控制 (CABC) 背光操作
闪光灯。 高侧闪光灯电流源支持 LED 阴极接地操作。
• LCD 偏置电源效率 > 85%
LM3632A 兼具高集成度和可编程性,无需修改硬件即
• 可编程的正 LCD 偏置电源(4V 至 6V),最大输
可适应各类应用。
出电流达 50mA
• 可编程的负 LCD 偏置电源(-6V 至 -4V),最大输
器器件件信信息息
(1)
出电流达 50mA
器器件件型型号号 封封装装 封封装装尺尺寸寸((最最大大值值))
• 1.5A 闪光灯 LED 升压转换器
LM3632A DSBGA (30) 2.47mm x 2.07mm
• 闪光灯效率 > 85%
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
• 输入电压范围:2.7V 至 5V
空白
2 应应用用
空白
• 智能手机 LCD 背光照明和偏置电源
空白
• 小型平板电脑 LCD 背光照明和偏置电源
空白
简简化化电电路路原原理理图图
背背光光效效率率,,2P7S
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNVSA63
LM3632A
ZHCSDN2 –APRIL 2015
www.ti.com.cn
目目录录
7.4 Device Functional Modes........................................ 26
1 特特性性.......................................................................... 1
7.5 Programming........................................................... 26
2 应应用用.......................................................................... 1
7.6 Register Maps......................................................... 31
3 说说明明.......................................................................... 1
8 Application and Implementation ........................ 39
4 修修订订历历史史记记录录 ........................................................... 2
8.1 Application Information............................................ 39
5 Pin Configuration and Functions......................... 3
8.2 Typical Application .................................................. 39
6 Specifications......................................................... 4
9 Power Supply Recommendations...................... 53
6.1 Absolute Maximum Ratings ...................................... 4
10 Layout................................................................... 53
6.2 ESD Ratings.............................................................. 4
10.1 Layout Guidelines ................................................ 53
6.3 Recommended Operating Conditions....................... 4
10.2 Layout Example ................................................... 54
6.4 Thermal Information ................................................. 4
11 器器件件和和文文档档支支持持 ..................................................... 55
6.5 Electrical Characteristics .......................................... 5
11.1 器件支持................................................................ 55
6.6 I
2
C Timing Requirements (SDA, SCL) ..................... 8
11.2 文档支持................................................................ 55
6.7 Typical Characteristics.............................................. 9
11.3 商标 ....................................................................... 55
7 Detailed Description............................................ 12
11.4 静电放电警告......................................................... 55
7.1 Overview ................................................................. 12
11.5 术语表 ................................................................... 55
7.2 Functional Block Diagram ....................................... 13
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 55
7.3 Features Description............................................... 14
4 修修订订历历史史记记录录
日日期期 修修订订版版本本 注注释释
2015 年 4 月 * 最初发布。
2 Copyright © 2015, Texas Instruments Incorporated
1 2
3 4 5
A
B
C
D
E
F
LM3632A
www.ti.com.cn
ZHCSDN2 –APRIL 2015
5 Pin Configuration and Functions
YFF Package
30-Pin DSBGA
Top View
Pin Functions
PIN
TYPE DESCRIPTION
NUMBER NAME
A1 VPOS O Positive LDO output for LCM bias power
A2 LCM_OUT O LCM bias boost output voltage
A3 LCM_SW O LCM bias boost switch connection
A4 BL_GND - Backlight boost ground connection
A5 BL_SW O Backlight boost switch connection
B1 LCM_EN2 I Enable for inverting charge pump output
B2 LCM_EN1 I Enable for positive LDO output
B3 EN I Active high chip enable
B4 LCM_GND - LCM bias boost ground connection
B5 BL_OUT O Backlight boost output voltage
C1 C1 O Inverting charge pump flying capacitor positive connection
C2 SDA I/O Serial data connection for I
2
C- compatible interface
C3 TX I Flash interrupt input
C4 AGND - Analog ground connection
C5 BLED1 O Input pin to internal LED current sink 1
D1 CP_GND - Inverting charge pump ground connection
D2 SCL I Serial clock connection for I
2
C- compatible interface
D3 STROBE I Flash enable input
D4 PWM I PWM input for CABC current control
D5 BLED2 O Input pin to internal LED current sink 2
E1 C2 O Inverting charge pump flying capacitor negative connection
E2 FLED O High-side current source output for flash LED
E3 FL_OUT O Flash boost output voltage
E4 FL_SW O Flash boost switch connection
E5 VIN I Input voltage connection
F1 VNEG O Inverting charge pump output voltage
F2 FLED O High-side current source output for flash LED
F3 FL_OUT O Flash boost output voltage
F4 FL_SW O Flash boost switch connection
F5 FL_GND - Flash boost ground connection
Copyright © 2015, Texas Instruments Incorporated 3
LM3632A
ZHCSDN2 –APRIL 2015
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
(1)
Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage on VIN, FL_SW, FL_OUT, FLED, EN, LCM_EN1, LCM_EN2, PWM, STROBE, TX, –0.3 6 V
SCL, SDA
Voltage on LCM_SW, LCM_OUT, VPOS, C1 –0.3 7 V
Voltage on VNEG, C2 –7 0.3 V
Voltage on BL_SW, BL_VOUT, BLED1, BLED2 –0.3 30 V
Continuous power dissipation Internally limited
Maximum junction temperature, T
J(MAX)
150
°C
Storage temperature, T
stg
–45 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted).
MIN MAX UNIT
Input voltage, V
IN
2.7 5 V
Operating ambient temperature, T
A
(1)
–40 85 °C
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125ºC), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to-ambient thermal resistance of the
part/package in the application (R
θJA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θJA
× P
D-MAX
).
6.4 Thermal Information
LM3632A
THERMAL METRIC
(1)
YFF (DSBGA) UNIT
30 PINS
R
θJA
Junction-to-ambient thermal resistance 58.6
R
θJC
Junction-to-case (top) thermal resistance 0.2
R
θJB
Junction-to-board thermal resistance 8.3 °C/W
Ψ
JT
Junction-to-top characterization parameter 1.4
Ψ
JB
Junction-to-board characterization parameter 8.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2015, Texas Instruments Incorporated
LM3632A
www.ti.com.cn
ZHCSDN2 –APRIL 2015
6.5 Electrical Characteristics
Unless otherwise specified, limits apply over the full operating ambient temperature range (−40°C ≤ T
A
≤ 85°C), V
IN
= 3.7 V,
V
VPOS
= 5.5 V, V
VNEG
= –5.4 V, V
LCM_OUT
= 6 V.
PARAMETER TEST CONDITION MIN TYP MAX UNIT
CURRENT CONSUMPTION
I
SD
Shutdown current EN = 0 1 4 µA
Quiescent current, device not
I
Q
EN = V
IN
, LCD bias boost disabled 2 10 µA
switching
I
LCD_EN
LCD bias boost enabled, no-load 0.5 mA
DEVICE PROTECTION
TSD Thermal shutdown 140 °C
BACKLIGHT LED CURRENT SINKS
Maximum output current in 2.7 V ≤ V
IN
≤ 5 V, linear or exponential mA
I
LED_MAX
25
BLED1/2 mode
Minimum output current in 2.7 V ≤ V
IN
≤ 5 V, linear or exponential µA
I
LED_MIN
50
BLED1/2 mode
2.7 V ≤ V
IN
≤ 5 V, 50 µA ≤ I
LED
≤ 25
I
ACCU
LED current accuracy
(1)
-3% 0.1% 3%
mA, linear or exponential mode
LED1 to LED2 current 2.7 V ≤ V
IN
≤ 5 V, 300 µA ≤ I
LED
≤ 25
I
MATCH
-2% 0.1% 2%
matching
(1)
mA, linear or exponential mode
BACKLIGHT BOOST CONVERTER
Backlight boost output
V
OVP_BL
2.7 V ≤ V
IN
≤ 5 V, 29 V option 28 28.75 29.5 V
overvoltage protection
I
LED
= 5 mA/string, V
IN
= 3.7 V
Efficiency Typical efficiency
(2)
87%
(2 x 7 LEDs), (P
OUT
/P
IN
)
I
LED
= 25 mA 250 mV
Regulated current sink
V
HR
headroom voltage
I
LED
= 5 mA 100 mV
V
HR_MIN
Current sink minimum headroom I
LED
= 95% of nominal, I
LED
= 5 mA 30 mV
voltage
R
DSON
NMOS switch on resistance I
SW
= 100 mA 0.25 Ω
I
CL
NMOS switch current limit 2.7 V ≤ V
IN
≤ 5 V 900 1000 1100 mA
ƒ
SW_BLBOOST
2.7 V ≤ V
IN
≤ 5 V 500-kHz mode 450 500 550
Switching frequency kHz
1-MHz mode 900 1000 1100
D
MAX
Maximum duty cycle 94%
LCM BIAS BOOST CONVERTER
LCM bias boost output 2.7 V ≤ V
IN
≤ 5 V
V
OVP_LCM
7 V
overvoltage protection
ƒ
SW_LCMBST
Switching frequency
(3)
2.7 V ≤ V
IN
≤ 5 V 2500 kHz
Bias boost output voltage range 4.5 6.4 V
Output voltage step size 50 mV
Peak-to-peak ripple voltage
(3)
I
LOAD
= 5 mA & 50 mA, C
BST
= 10 µF 50 mVpp
V
IN
+ 500 mVp-p AC square wave, Tr =
V
LCM_OUT
LCM_OUT line transient
100 mV/µs, 200 Hz, 12.5 % duty, I
LOAD
–50 ±25 50 mV
response
(3)
= 5 mA, C
IN
= 10 µF
LCM_OUT load transient Load current step 0 mA to 100 mA,
–150 150 mV
response
(3)
T
RISE/FALL
= 100 mA/µs, C
IN
= 10 µF
I
CL_LCMBST
Valley current limit 1000 mA
(1) Output Current Accuracy is the difference between the actual value of the output current and programmed value of this current.
Matching is the maximum difference from the average. For the constant current sinks on the device (BLED1 and BLED2), the following
is determined: the maximum output current (MAX), the minimum output current (MIN), and the average output current of both outputs
(AVG). Matching number is calculated: (I
LED1
– I
LED2
)/(I
LED1
+ I
LED2
). The typical specification provided is the most likely norm of the
matching figure of all parts. Note that some manufacturers have different definitions in use.
(2) Typical value only for information.
(3) Limits set by characterization and/or simulation only.
Copyright © 2015, Texas Instruments Incorporated 5
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