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TMP1827 Single-Wire, ±0.3°C Accurate Temperature Sensor With SHA-256-HMAC
Authentication Engine, 2-kbit EEPROM
1 Features
• Single-wire interface with multi-drop shared bus
and CRC
• Bus powered with operating voltage from 1.7 V to
5.5 V
• IEC 61000-4-2 ESD for 8-kV contact discharge
• High-accuracy digital temperature sensor:
– ±0.1°C (typical)/±0.3°C (maximum) from –20°C
to +85°C
– ±0.3°C (typical)/±0.5°C (maximum) from –55°C
to +125°C
– ±0.5°C (typical)/±1.0°C (maximum) from –55°C
to +150°C
• Active current of 100-µA (typical) and shutdown
current of 1.0 µA (typical)
• 16-bit temperature resolution: 7.8125 m°C (1 LSB)
• Fast data rates of 90 kbps in overdrive speed
• Flexible user programmable short address modes
for faster device address
• SHA-256-HMAC authentication scheme
– FIPS 180-4 compliant Secure Hash
Implementation
– FIPS 198-1 compliant HMAC Implementation
• 2-kbit EEPROM features:
– Write operation in block size of 64-bits
– Continuous read mode
– Read with write protection with page size of
256-bits
– Authenticated write protection mode with page
size of 256-bits
– Read/write current of 95 µA/178 µA (typical)
• NIST traceable factory-programmed non erasable
64-bit identification number for device addressing
• 4 configurable open-drain digital input-output and
temperature alert
2 Applications
• Factory automation and control
• Appliances
• Medical accessories
• CPAP machine
• Battery packs
• Cold chain applications
• Temperature transmitters
• EV charging infrastructure
3 Description
The TMP1827 is a high-accuracy, single-wire
compatible digital output temperature sensor with
integrated 2-kbit EEPROM and SHA-256-HMAC
authentication scheme with a wide operating
temperature range from –55°C to +150°C. The
TMP1827 provides a high accuracy of ±0.1°C
(typical)/±0.3°C (maximum) across the temperature
range of –20°C to +85°C. Each device comes with
a factory programmed 64-bit unique identification
number for addressing and NIST traceability. The
TMP1827 supports both standard speed for legacy
application and overdrive mode with 90-kbps data rate
for low latency communication across a wide voltage
range of 1.7 V to 5.5 V.
In the simplest mode of operation, the TMP1827
single-wire interface, with an integrated 8-kV
IEC-61000-4-2 ESD protection on the data pin,
requires only a single connection and a ground return
in bus powered mode, which simplifies and reduces
cost by reducing the number of wires and external
protection components. Additionally, there is the V
DD
power pin also available for applications that may
want to have a dedicated power supply.
Package Information
PART NUMBER PACKAGE
(1)
BODY SIZE (NOM)
TMP1827 WSON (8) 2.50 mm × 2.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
MCU
V
DD
= 1.7V to 5.5V
R
PU
TMP1827
SDQ
GND
V
DD
TMP1827
SDQ
GND
V
DD
GPIO
GND
V
DD
V
DD
Powered
Bus Powered
Simplified Schematic
ADVANCE INFORMATION
TMP1827
SBOSA15 – SEPTEMBER 2022
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (cont.)...........................................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics.............................................5
7.6 1-Wire Interface Timing...............................................7
7.7 Security Engine Characteristics.................................. 7
7.8 EEPROM Characteristics............................................7
7.9 Timing Diagrams.........................................................8
7.10 Typical Characteristics............................................ 10
8 Detailed Description......................................................13
8.1 Overview................................................................... 13
8.2 Functional Block Diagram......................................... 13
8.3 Feature Description...................................................13
8.4 Device Functional Modes..........................................24
8.5 Programming............................................................ 39
8.6 Register Maps...........................................................43
9 Application and Implementation.................................. 55
9.1 Application Information............................................. 55
9.2 Typical Applications.................................................. 55
9.3 Power Supply Recommendations.............................58
9.4 Layout....................................................................... 58
10 Device and Documentation Support..........................59
10.1 Documentation Support.......................................... 59
10.2 Receiving Notification of Documentation Updates..59
10.3 Support Resources................................................. 59
10.4 Trademarks.............................................................59
10.5 Electrostatic Discharge Caution..............................59
10.6 Glossary..................................................................59
11 Mechanical, Packaging, and Orderable
Information.................................................................... 59
11.1 Package Option Addendum.................................... 63
11.2 Tape and Reel Information...................................... 64
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
September 2022 * Initial Release
TMP1827
SBOSA15 – SEPTEMBER 2022
www.ti.com
ADVANCE INFORMATION
2 Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMP1827
5 Description (cont.)
The TMP1827 implements the SHA-256-HMAC authentication engine along with key storage, for system
authentication requirements of an end equipment. The 2 kbit EEPROM on the device allows the host application
to store application specific content in block sizes of 64-bit. The memory can be write protected in page size
of 256-bits to avoid accidental data overwrite. The memory architecture enables application to optimize the bus
bandwidth when updating variables which are only few bytes while providing an optimal memory size for write
protection. The device also features mechanism for host authentication by means of authenticated memory write
operations.
www.ti.com
TMP1827
SBOSA15 – SEPTEMBER 2022
ADVANCE INFORMATION
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TMP1827
6 Pin Configuration and Functions
6
8
7
5
3
ADDR
SDQ
IO3
GND
1
2
4
Thermal
Pad
V
DD
IO0
IO1
IO2/ALERT
Figure 6-1. NGR 8-Pin WSON Top View
Table 6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME WSON
ADDR 3 I Resistor address select. If unused, TI recommends to connect pin to ground
GND 4 — Ground
IO0 6 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground
IO1 7 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground
IO2/ALERT 8 I/O
General-purpose digital IO or configurable as temperature alert. If unused, TI recommends to
connect pin to ground
IO3 5 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground
SDQ 2 I/O Serial bidirectional data. In bus power mode, the pin is used to power the internal capacitor
V
DD
1 I Supply voltage in V
DD
powered mode. In bus powered mode, must be connected to ground
7 Specifications
7.1 Absolute Maximum Ratings
Over free-air temperature range unless otherwise noted
(1)
MIN MAX UNIT
Supply voltage V
DD
6.5 V
I/O voltage
SDQ, Bus powered mode –0.3 6.5
V
SDQ, Supply powered mode –0.3 V
DD
+ 0.3
I/O voltage IO0, IO1, IO2, IO3 –0.3 6.5 V
I/O voltage ADDR –0.3 1.65 V
Operating junction temperature, T
J
–55 155 °C
Storage temperature, T
stg
–65 155 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
All pins ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
All pins ±500 V
IEC 61000-4-2 Contact Discharge SDQ pin ±8000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
TMP1827
SBOSA15 – SEPTEMBER 2022
www.ti.com
ADVANCE INFORMATION
4 Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMP1827
7.3 Recommended Operating Conditions
MIN NOM MAX UNIT
V
DD
Supply voltage V
DD
powered mode 1.70 5.5 V
V
PUR
Supply voltage on SDQ in bus powered mode (V
DD
= GND) 1.70 5.5 V
V
I/O
All IO pins in V
DD
powered mode (except SDQ and ADDR
(1)
) 0 5.5 V
SDQ pin in V
DD
powered mode 0 V
DD
+ 0.3 V
T
A
Operating ambient temperature
(2)
-55 150 °C
(1) If ADDR pin is not used, it is recommended to be connected to GND
(2) In bus powered mode, overdrive speed supports the max operating temperature up to 150°C, while standard speed supports up to
125°C for full V
PUR
range and 150C for V
PUR
> 2.5V (See Figure 7-17)
7.4 Thermal Information
THERMAL METRIC
(1)
TMP1827
UNITNGR (WSON)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 66.1 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 55.7 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 20.2 °C/W
R
θJB
Junction-to-board thermal resistance 26.3 °C/W
ψ
JT
Junction-to-top characterization parameter 1.0 °C/W
ψ
JB
Junction-to-board characterization parameter 26.1 °C/W
M
T
Thermal Mass TBD mJ/°C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
Over free-air temperature range and V
DD
= 1.7 V to 5.5 V (unless otherwise noted); Typical specifications are at T
A
= 25 °C
and V
DD
= 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
T
ERR
Temperature accuracy
–20 °C to 85°C ±0.1 ±0.3
°C–55 °C to 125°C ±0.3 ±0.5
–55 °C to 150°C ±0.5 ±1.0
PSR DC power supply sensitivity ±0.03 °C/V
T
RES
Temperature resolution
Including sign bit 16 Bits
LSB 7.8125 m°C
T
REPEAT
Repeatability
(1)
V
DD
= 3.3 V
Averaging enabled, Conversion Time = 5.5 ms,
16-bit mode,
1-Hz conversion interval, 300 acquisition
±2 LSB
T
LTD
Long-term stability and drift 1000 hours at 150°C
(2)
0.0625 °C
T
HYST
Temperature cycling and
hysteresis
T
START
= –40°C
T
FINISH
= 150°C
T
TEST
= 25°C
3 cycles
4 LSB
t
RESP_L
Response time (Stirred
Liquid)
Single layer Flex PCB
τ = 63 %
25°C to 75°C
0.77 s
2-layer 62-mil Rigid
PCB
1.91 s
t
ACT
Active Conversion time (No
Averaging)
CONV_TIME_SEL = 0
(Figure 8-12)
TBD 3 TBD ms
CONV_TIME_SEL = 1 TBD 5.5 TBD ms
www.ti.com
TMP1827
SBOSA15 – SEPTEMBER 2022
ADVANCE INFORMATION
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TMP1827
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