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TI-TMP64.pdf
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNIS212
TMP64
ZHCSKL6A –DECEMBER 2019–REVISED MARCH 2020
采采用用 0402 封封装装的的 TMP64 ±1% 47kΩ 线线性性热热敏敏电电阻阻
1
1 特特性性
1
• 具有正温度系数 (PTC) 的硅基热敏电阻
• 线性电阻随温度变化
• 在 25°C 下具有 47kΩ 标称电阻 (R25)
– ±1% 最大值(0°C 至 70°C)
• –40°C 至 +125°C 的宽工作温度范围
• 在整个温度范围内具有稳定的灵敏度
– 6400ppm/°C TCR (25°C)
– 在整个温度范围内具有 0.2% 的典型 TCR 容差
• 快速热响应时间为 0.6s (DEC)
• 长寿命和稳健性能
– 内置失效防护,能够在发生短路故障时提供保护
– 传感器长期温漂典型值为 0.5%
2 应应用用
• 温度监控
– HVAC 和恒温器
– 工业控制和电器
• 热补偿
– 显示屏背光
– 楼宇自动化
• 热阈值检测
– 电机控制
– 充电器
3 说说明明
立即开始使用热敏电阻设计工具,它提供了完整的电阻
与温度关系表(R-T 表)的计算以及用于推导温度和示
例 C 代码的有用方法。
线性热敏电阻可在整个温度范围内提供线性度和一致的
灵敏度,支持使用简单而准确的方法进行温度转换。低
功耗和较小的热质量可最大限度地减小自发热的影响。
凭借内置的高温失效防护以及对环境变化的强大抵抗
力,这类器件可长时间提供高性能。TMP6 系列器件外
型小巧,可靠近热源放置,并具有快速响应时间。
与 NTC 热敏电阻相比,它具有以下优点:无需额外的
线性化电路、最大程度减少校准工作量、电阻容差变化
更小、高温下灵敏度更高以及可节省处理器时间和内存
的简化转换方法。
TMP64 目前采用与 0402 封装外形兼容的 X1SON 封
装。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
TMP64 X1SON 0.60mm × 1.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
典典型型实实施施电电路路 典典型型电电阻阻与与环环境境温温度度间间的的关关系系
2
TMP64
ZHCSKL6A –DECEMBER 2019 –REVISED MARCH 2020
www.ti.com.cn
Copyright © 2019–2020, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 TMP64 R-T table....................................................... 9
7.4 Feature Description................................................... 9
7.5 Device Functional Modes.......................................... 9
8 Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Example .................................................... 15
11 器器件件和和文文档档支支持持 ..................................................... 16
11.1 接收文档更新通知 ................................................. 16
11.2 支持资源................................................................ 16
11.3 商标 ....................................................................... 16
11.4 静电放电警告......................................................... 16
11.5 Glossary................................................................ 16
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 16
4 修修订订历历史史记记录录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision Original (December 2019) to Revision A Page
• 将数据表状态从“预告信息”更改为“生产数据” .......................................................................................................................... 1
• 更新了标题.............................................................................................................................................................................. 1
• 更新了 特性............................................................................................................................................................................. 1
• 更新了 应用............................................................................................................................................................................. 1
• 更新了 说明) ......................................................................................................................................................................... 1
• Increased ESD CDM Rating from ±750 V to ± 1000 V .......................................................................................................... 4
• Changed minimum 'Long Term Drift' spec for RH = 85 % from 0.1 % to -1 %...................................................................... 5
• Added typical. 'Long Term Drift' spec for RH = 85 %............................................................................................................. 5
• Changed maximum 'Long Term Drift' spec for RH = 85 % from 0.8 % to 1 % ...................................................................... 5
• Changed minimum 'Long Term Drift' spec from 0.1 % to -1% ............................................................................................... 5
• Added typical. 'Long Term Drift' spec..................................................................................................................................... 5
• Changed maximum 'Long Term Drift' spec from 1 % to 1.8 % ............................................................................................. 5
• Added 'Supply Dependence Resistance vs. Bias Current' graph........................................................................................... 6
• Added 'Supply Dependence Resistance vs. Bias Voltage' graph .......................................................................................... 6
• Added 'Step Response' graph................................................................................................................................................ 6
• Added 'Thermal Response time' graphs................................................................................................................................. 6
• Updated Thermistor Design Tool link ..................................................................................................................................... 9
1
2
3
TMP64
www.ti.com.cn
ZHCSKL6A –DECEMBER 2019–REVISED MARCH 2020
Copyright © 2019–2020, Texas Instruments Incorporated
5 Pin Configuration and Functions
DEC Package
2-Pin X1SON
Top View (Angled)
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
– 1
—
Thermistor (–) and (+) terminals. For proper operation, ensure a positive bias where the +
terminal is at a higher voltage potential than the – terminal.
+ 2
4
TMP64
ZHCSKL6A –DECEMBER 2019–REVISED MARCH 2020
www.ti.com.cn
Copyright © 2019–2020, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended
OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Voltage across pins 2 (+) and 1 (–) +6 V
Current through the device +450 µA
Junction temperature (T
J
) –65 +150 °C
Storage temperature (T
stg
) –65 +150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM) per JESD22-A114
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
Sns
Voltage across pins 2 (+) and 1 (–) 0 5.5 V
I
Sns
Current passing through the device 0 400 µA
T
A
Operating free-air temperature (specified performance) (X1SON/DEC Package) –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The junction to ambient thermal resistance (Rθ
JA
) under natural convection is obtained in a simulation on a JEDEC-standard, High-K
board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are
included in the PCB, per JESD 51-5.
(3) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
6.4 Thermal Information
THERMAL METRIC
(1)
TMP64
UnitsDEC (X1SON)
2 PINS
R
θJA
Junction-to-ambient thermal resistance
(2)(3)
443.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 195.7 °C/W
R
θJB
Junction-to-board thermal resistance 254.6 °C/W
Ψ
JT
Junction-to-top characterization parameter 19.9 °C/W
Ψ
JB
Junction-to-board characterization parameter 254.5 °C/W
R
θJC(bot)
Junction-to-case (bot) thermal resistance – °C/W
5
TMP64
www.ti.com.cn
ZHCSKL6A –DECEMBER 2019–REVISED MARCH 2020
版权 © 2019–2020, Texas Instruments Incorporated
6.5 Electrical Characteristics
T
A
= -40 °C - 125 °C, I
Sns
= 42.553 μA (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
25
Thermistor Resistance at 25 °C T
A
= 25 °C 46.53 47 47.47 kΩ
R
TOL
Resistance Tolerance
T
A
= 25 °C –1 1
%T
A
= 0 °C - 70 °C –1 1
T
A
= -40 °C - 125 °C –1.5 1.5
TCR
-35
Temperature Coefficient of Resistance
T1 = -40 ° C, T2 = -30 °C +6220
ppm/°CTCR
25
T1 = 20 °C, T2 = 30 °C +6400
TCR
85
T1 = 80 °C, T2 = 90 °C +5910
TCR
-35
%
Temperature Coefficient of Resistance Tolerance
T1 = -40 ° C, T2 = -30 °C ±0.4
%TCR
25
% T1 = 20 °C, T2 = 30 °C ±0.2
TCR
85
% T1 = 80 °C, T2 = 90 °C ±0.3
ΔR Sensor Long Term Drift (Reliability)
96 hours continuous operation at RH = 85% and
T
A
= 130 ° C
V
Bias
= 5.5 V
-1 ±0.1 1
%
600 hours continuous operation at T
A
= 150 ° C
V
Bias
= 5.5V
-1 0.5 1.8
t
RES (stirred
liquid)
Thermal response to 63%
T1 = 25 °C in Still Air to T2 = 125 °C in Stirred
Liquid
0.6 s
t
RES (still air)
Thermal response to 63% T1 = 25 °C to T2 = 70 °C in Still Air 3.2 s
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