Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................4
Pin Functions.................................................................... 4
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings ....................................... 5
6.2 ESD Ratings .............................................................. 5
6.3 Recommended Operating Conditions ........................5
6.4 Thermal Information ...................................................5
6.5 Electrical Characteristics ............................................6
6.6 Typical Characteristics................................................ 7
7 Detailed Description........................................................9
7.1 Overview..................................................................... 9
7.2 Functional Block Diagram........................................... 9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes..........................................10
8 Application and Implementation.................................. 11
8.1 Application Information..............................................11
8.2 Typical Application.................................................... 11
9 Power Supply Recommendations................................16
10 Layout...........................................................................16
10.1 Layout Guidelines................................................... 16
10.2 Layout Example...................................................... 16
11 Device and Documentation Support..........................17
11.1 Receiving Notification of Documentation Updates.. 17
11.2 Support Resources................................................. 17
11.3 Trademarks............................................................. 17
11.4 Electrostatic Discharge Caution.............................. 17
11.5 Glossary.................................................................. 17
12 Mechanical, Packaging, and Orderable
Information.................................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (June 2020) to Revision C (September 2020) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Added AEC-Q100 Temperature Grade 0 rating for SOT-5X3/DYA package...................................................... 1
• Moved HBM and CDM ESD classification levels to ESD Ratings table............................................................. 1
• Removed DYA preview notice............................................................................................................................ 1
• Updated Device Comparison table with 150 °C rating for DYA packages..........................................................3
• Increased maximum junction temperature from 150 to 155 in Absolute Maximum Ratings Table..................... 5
• Increased maximum storage temperature from 150 to 155 in Absolute Maximum Ratings Table......................5
• Added DYA T
A
support to Recommended Operating Conditions Table............................................................. 5
• Added DYA package to Thermal Information table.............................................................................................5
• Added 1000 hour Long Term Drift specification for DYA package......................................................................6
• Changed the Typical Characteristics section......................................................................................................7
• Added Built-In Fail Safe section........................................................................................................................10
Changes from Revision A (March 2020) to Revision B (June 2020) Page
• Added DYA package as preview information......................................................................................................1
• Updated Device Comparison table..................................................................................................................... 3
• Corrected view description in Pin Configuration and Functions......................................................................... 4
• Changed Maximum ISNS from 400 µA to 40 µA in Recommended Operating Conditions Table ..................... 5
Changes from Revision * (December 2019) to Revision A (March 2020) Page
• Updated Title.......................................................................................................................................................1
• Changed device status from Advanced Information to Production Data............................................................ 1
• Updated features list...........................................................................................................................................1
• Updated Applications..........................................................................................................................................1
• Updated Description........................................................................................................................................... 1
• Updated Thermistor Design Tool link................................................................................................................10
TMP63-Q1
SNIS215C – JANUARY 2020 – REVISED SEPTEMBER 2020
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