TI-PCA9515B.pdf资源-CSDN文库

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PCA9515B

SCL0

SDA0

SCL1

SDA1

GND

VCC EN

C or SMBus

Master (e.g.

Processor)

C Slave

Devices

VCC VCC

VCC

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SCPS232

PCA9515B

ZHCS780B –MARCH 2012–REVISED MARCH 2016

PCA9515B 双双路路双双向向 I

C 总总线线和和 SMBus 中中继继器器

1 特特性性

• 两通道双向缓冲器

• I

C 总线和 SMBus 兼容

• 支持 I

C 标准模式 (100kHz) 和快速模式 (400kHz)

• 高电平有效的中继器启用输入

• 开漏 I

C 输入和输出

• 5.5V 耐压 I

C 输入和输出以及使能输入，支持混合

模式信号操作

• 无死锁运行

• 支持标准模式、快速模式 I

C 器件、和多个主控器

• 支持中继器上的仲裁及时钟延伸

• 断电高阻抗 I

C 引脚

• 锁存性能超过 100mA，符合 JESD 78 I 类规范要

求

• 静电放电 (ESD) 保护性能超过 JESD 22 规范要求

– 2000V 人体放电模式 (A114-A)

– 1000V 充电器件模型 (C101)

2 应应用用

• 服务器

• 路由器（电信交换设备）

• 工业设备

• 具有多个 I

C 从器件且 PCB 走线较长的产品

3 说说明明

PCA9515B 是一款 BiCMOS 双路双向缓冲区集成电

路，旨在满足 I

C 总线和 SMBus 应用的需求。该器件

包含两个相同的双向开漏缓冲区电路，能够扩展 I

C 及

相似总线系统（或添加从器件），同时不会降低系统性

能。双路双向 I

C 缓冲区可由 2.3V 到 3.6V 的 V

供

电运行。

PCA9515B 能够缓冲 I

C 总线上的串行数据 (SDA) 和

串行时钟 (SCL) 信号，同时保持 I

C 系统的所有工作

模式和特性。该器件允许在 I

C 应用中连接两条电容为

400pF 的总线。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

PCA9515B VSSOP (8) 3.00mm × 3.00mm

(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。

简简化化电电路路原原理理图图

PCA9515B

ZHCS780B –MARCH 2012–REVISED MARCH 2016

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ..................................... 4

6.2 ESD Ratings ............................................................ 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information ................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Timing Requirements................................................ 5

6.7 Switching Characteristics.......................................... 5

6.8 Typical Characteristics.............................................. 6

7 Parameter Measurement Information .................. 7

8 Detailed Description.............................................. 8

8.1 Overview ................................................................... 8

8.2 Functional Block Diagram ......................................... 9

8.3 Feature Description................................................... 9

8.4 Device Functional Modes........................................ 10

9 Application and Implementation ........................ 11

9.1 Application Information............................................ 11

9.2 Typical Application ................................................. 11

10 Power Supply Recommendations ..................... 12

11 Layout................................................................... 13

11.1 Layout Guidelines ................................................. 13

11.2 Layout Example .................................................... 13

12 器器件件和和文文档档支支持持 ..................................................... 14

12.1 文档支持 ............................................................... 14

12.2 社区资源................................................................ 14

12.3 商标 ....................................................................... 14

12.4 静电放电警告......................................................... 14

12.5 Glossary................................................................ 14

13 机机械械、、封封装装和和可可订订购购信信息息....................................... 14

4 修修订订历历史史记记录录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision A (May 2013) to Revision B Page

• 已添加

器件信息

表，ESD

额定值

表，

特性说明

部分，

器件功能模式

，

应用和实施

部分，

电源相关建议

部分，

布局

部

分，

器件和文档支持

部分以及

机械、封装和可订购信息

部分. ................................................................................................. 1

• 已删除订购信息。请参见数据表末尾的 POA。 ...................................................................................................................... 1

Changes from Original (March 2012) to Revision A Page

• Updated the V

and V

- V

ILC

specifications........................................................................................................................ 5

PCA9515B

ZHCS780B –MARCH 2012–REVISED MARCH 2016

www.ti.com.cn

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage –0.5 7 V

Enable input voltage

(2)

–0.5 7 V

I/O

C bus voltage

(2)

–0.5 7 V

Input clamp current V

< 0 –50 mA

Output clamp current V

< 0 –50 mA

Continuous output current ±50 mA

Continuous current through V

or GND ±100 mA

stg

Storage temperature –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101

(2)

±1000

(1) V

specification is for the EN input and the first low level seen by the SDAx and SCLx lines. V

ILc

is for the second and subsequent low

levels seen by the SDAx and SCLx lines. V

ILc

must be at least 70 mV below V

6.3 Recommended Operating Conditions

MIN MAX UNIT

Supply voltage 2.3 3.6 V

High-level input voltage

SDA and SCL inputs 0.7 × V

5.5

EN input 2 5.5

(1)

Low-level input voltage

SDA and SCL inputs –0.5 0.3 × V

EN input –0.5 0.8

ILc

(1)

SDA and SCL low-level input voltage contention –0.5 0.4 V

Low-level output current

= 2.3 V 6

= 3 V 6

Operating free-air temperature –40 85 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

THERMAL METRIC

(1)

PCA9515B

UNITDGK (VSSOP)

8 PINS

θJA

Junction-to-ambient thermal resistance

(2)

170.8 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 62.9 °C/W

θJB

Junction-to-board thermal resistance 91.6 °C/W

Junction-to-top characterization parameter 9.5 °C/W

Junction-to-board characterization parameter 90.2 °C/W

剩余20页未读，继续阅读

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