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Source A
Source B
HPDB
DAx(p)
HPDA
DAx(n)
HPDC
AUXAx
DDCA
DDCB
AUXCx
AUXBx
DCx(p)
DCx(n)
DBx(p)
DBx(n)
Control
AUX_SEL
Dx_SEL
DDCC
OE
DP/DP++
HDMI Sink A
DP/DP++
HDMI Sink B
HPDB
DAx(p)
HPDA
DAx(n)
HPDC
AUXAx
DDCA
DDCB
AUXCx
AUXBx
DCx(p)
DCx(n)
Source
DBx(p)
DBx(n)
Control
AUX_SEL
Dx_SEL
DDCC
OE
HD3SS215 2:1
HD3SS215 1:2
4
4
4
4
4
4
2
2
2
2
2
2
4
4
4
4
4
4
4
4
2
2
2
2
2
2
DP/DP++
HDMI sink
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLAS971
HD3SS215, HD3SS215I
ZHCSE00D –MAY 2014–REVISED OCTOBER 2015
HD3SS215 6.0Gbps HDMI/DisplayPort 2:1/1:2 差差动动开开关关
1
1 特特性性
1
• 通用 2:1/1:2 差动开关
• 兼容 DisplayPort 电气标准
• 兼容 HDMI 电气标准
• 2:1 和 1:2 开关最高支持 6Gbps 的数据速率
• 支持热插拔检测 (HPD) 开关
• 支持辅助 (AUX) 和显示数据通道 (DDC) 切换
• -3dB 差分带宽宽达 7GHz
• 出色动态特性(3GHz 时)
– 串扰 = –35dB
– 隔离 = -21dB
– 插入损耗 = –1.6dB
– 回波损耗 = –12dB
– 最大位到位失真 = 5ps
• 漏极电源电压 (VDD) 运行范围 3.3V ± 10%
• 商业温度范围:0°C 至 70°C (HD3SS215)
• 工业温度范围:–40°C 至 85°C (HD3SS215I)
• 封装选项:
– 5mm x 5mm,50 焊球 ZQE
– 8mm × 8mm,56 引脚 RTQ
• 输出使能 (OE) 引脚禁用开关以省电
• 功耗:
– 工作模式:< 9mW(典型值)
– 待机模式:< 30µW(最大值)(OE = 低电平
时)
2 应应用用
• 台式机和笔记本 应用:
– PCI Express 1 代、2 代开关
– DP 开关
– HDMI 开关
– LVDS 开关
• 扩展坞
• UHDTV、HDTV 和监控器
• 机顶盒
• AVR、蓝光、DVD 播放器
3 说说明明
HD3SS215 是一款高速宽共模范围无源开关,能够支
持要求刷新率达到 4k2k 60Hz 的 DisplayPort HBR2
和 高清多媒体接口 (HDMI) 应用。HD3SS215 经配置
可支持两个源设备连接一个接收设备,或者一个源设备
连接两个接收设备。为了支持这些视频标
准,HD3SS215 还可以切换显示数据通道 (DDC) 和热
插拔检测 (HPD) 信号,这适用于 HDMI 或数字视频接
口 (DVI) 应用。该器件还可以为 DisplayPort 应用切换
辅助 (AUX) 和热插拔检测 (HPD) 信号。HD3SS215
支持宽共模范围和直流/交流耦合链路,具有独特的灵
活性,是许多应用的理想 选择。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
HD3SS215,HD3S
S215I
µBGA (50) 5.00mm x 5.00mm
QFN (56) 8.00mm x 8.00mm
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。
应应用用电电路路原原理理图图

2
HD3SS215, HD3SS215I
ZHCSE00D –MAY 2014–REVISED OCTOBER 2015
www.ti.com.cn
版权 © 2014–2015, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 说说明明 ((续续)).............................................................. 4
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 7
7.1 Absolute Maximum Ratings ...................................... 7
7.2 ESD Ratings.............................................................. 7
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics........................................... 8
7.6 Electrical Characteristics, Device Parameters.......... 9
7.7 Switching Characteristics.......................................... 9
7.8 Timing Diagrams....................................................... 9
8 Detailed Description............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 13
9 Applications and Implementation ...................... 14
9.1 Application Information............................................ 14
9.2 Typical Applications ................................................ 14
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 20
12 器器件件和和文文档档支支持持 ..................................................... 22
12.1 社区资源................................................................ 22
12.2 商标 ....................................................................... 22
12.3 静电放电警告......................................................... 22
12.4 Glossary................................................................ 22
13 机机械械封封装装和和可可订订购购信信息息 .......................................... 22
4 修修订订历历史史记记录录
Changes from Revision C (August 2015) to Revision D Page
• 已更改 说明 文本字符串“....DisplayPort 1.2a...”至“...DisplayPort HBR2...”,“..HDMI 2.0..”至“...HDMI...” ............................. 1
• Deleted R
θJC(bot)
spec from Thermal Information table as N/A ............................................................................................... 7
• Deleted "Operating free air temperature " spec from Electrical Characteristics table............................................................. 8
• Changed Figure 8 ................................................................................................................................................................ 18
• Changed Power Supply Recommendations text string from "Decoupling capacitors may be used to reduce noise
and improve power supply integrity" to "Decoupling capacitors must be used to reduce power supply noise" .................. 19
Changes from Revision B (July 2015) to Revision C Page
• Added t
on(OE_L-H)
, t
off(OE_H-L)
, and t
SWITCH_OVER
to the Switching Characteristics........................................................................ 9
Changes from Revision A (May 2014) to Revision B Page
• 已将标题中的“2.0/DisplayPort 1.2A”更改为“DisplayPort” ....................................................................................................... 1
• 已将
特性
列表项“兼容 DisplayPort 1.2a 电气标准”更改为“兼容 DisplayPort 电气标准”........................................................... 1
• 已将
特性
列表项“兼容 HDMI 1.4b 和 HDMI 2.0 电气标准”更改为“兼容 HDMI 电气标准” ........................................................ 1
• 已添加
特性
条目“商业温度范围:–40°C 至 70°C (HD3SS215)”.............................................................................................. 1
• 已添加
特性
条目“工业温度范围:–40°C 至 85°C (HD3SS215I)”............................................................................................. 1
• 已添加
特性
,封装选项:8mm × 8mm,56 引脚 RTQ .......................................................................................................... 1
• 已将
应用
列表项“TV 和监控器”更改为“UHDTV、HDTV 和监控器”.......................................................................................... 1
• 已添加 说明 (续) 段落。 ..................................................................................................................................................... 4
• Added the 56-Pin QFN image ................................................................................................................................................ 5
• Added RTQ column to the Pin Functions table ..................................................................................................................... 6
• Moved T
stg
From: ESD Ratings To: Absolute Maximum Ratings
(1)(2)
.................................................................................... 7
• Changed the Handling Ratings table to ESD Ratings table .................................................................................................. 7
• Added HD3SS2151I, Operating free-air temperature Recommended Operating Conditions ............................................... 7
• Added RTQ 56 PIN values to the Thermal Information.......................................................................................................... 7

3
HD3SS215, HD3SS215I
www.ti.com.cn
ZHCSE00D –MAY 2014–REVISED OCTOBER 2015
版权 © 2014–2015, Texas Instruments Incorporated
• Added table Note " This pin can be driven.." to the Electrical Characteristics table .............................................................. 8
• Changed the Electrical Characteristics, Device Parameters
(3)
table to include ZQE and RTQ package values................... 9
• Added the Switching Characteristics table ............................................................................................................................ 9
• Added section: HDMI 2:1 Sink Application Using the RTQ Package .................................................................................. 18
• Added Figure 11 .................................................................................................................................................................. 21
Changes from Original (May 2014) to Revision A Page
• 已更改 说明部分...................................................................................................................................................................... 1
• Changed Figure 4 ................................................................................................................................................................ 14

1 2 3 4 5 6 7 8 9
A
Dx_SEL VDD DA0(n) DA1(n) DA2(n) DA3(p) DA3(n)
B
DC0(n) DC0(p) GND DA0(p) DA1(p) DA2(p)
OE DB0(p) DB0(n)
C
AUX_SEL GND
D
DC1(n) DC1(p) DB1(p) DB1(n)
E
DC2(n) DC2(p) DB2(p) DB2(n)
F
DC3(n) DC3(p) DB3(p) DB3(n)
G
GND GND
H
AUXC(n) AUXC(p) HPDB GND DDCCLK_B AUXB(p) GND DDCCLK_A AUXA(p)
J
HPDC HPDA DDCCLK_C VDD DDCDAT_B AUXB(n) DDCDAT_C DDCDAT_A AUXA(n)
4
HD3SS215, HD3SS215I
ZHCSE00D –MAY 2014–REVISED OCTOBER 2015
www.ti.com.cn
Copyright © 2014–2015, Texas Instruments Incorporated
5 说说明明 ((续续))
一个典型应用就是包含 2 个图形处理单元 (GPU) 的母板,此处理单元需要驱动一个 DisplayPort 负输出。GPU 由
Dx_SEL 引脚选择。另一个应用是一个源设备需要在两个接收设备间切换的情况,例如侧连接器和扩展坞连接器。
此切换操作由 Dx_SEL 和 AUX_SEL 引脚控制。HD3SS215I 在 –40°C 至 85°C 的工业温度范围由 3.3V 单电源供
电运行,并且提供 ZQE 封装和 56 引脚 RTQ 封装。
6 Pin Configuration and Functions
50-Pin µBGA
ZQE Package
(Top View)

HD3SS215 RTQ
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
15
16
17
18
19
20
21
22
23
24
25
26
27
28
AUX_SEL
DC0(P)
DC0(N)
GND
DC1(P)
DC1(N)
GND
DC2(P)
DC2(N)
GND
DC3(P)
DC3(N)
AUXC(P)
AUXC(N)
NC
DB0(P)
DB0(N)
GND
DB1(P)
DB1(N)
GND
DB2(P)
DB2(N)
GND
DB3(P)
DB3(N)
AUXA(P)
AUXA(N)
HPDC
HPDA
HPDB
DDCCLK_C
VDD
NC
NC
DDCCLK_B
DDCDAT_B
AUXB(P)
AUXB(N)
DDCDAT_C
DDCCLK_A
DDCDAT_A
DX_SEL
VDD
DA0(P)
DA0(N)
GND
DA1(P)
DA1(N)
GND
DA2(P)
DA2(N)
GND
DA3(P)
DA3(N)
OE
5
HD3SS215, HD3SS215I
www.ti.com.cn
ZHCSE00D –MAY 2014–REVISED OCTOBER 2015
Copyright © 2014–2015, Texas Instruments Incorporated
56-Pin QFN
RTQ Package
(Top View)
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