TI-HD3SS212.pdf资源-CSDN文库

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Dx_SEL

HPDA

HPDB

VDD

GND

AUXA (p)

AUXA (n)

AUXB (p)

AUXB (n)

DAz (p)

DAz (n)

DBz(p)

DBz(n)

SEL

HD3SS212

SEL = 0

SEL = 1

(z = 0,1, 2or3)

HPDC

DCz

(p)

DCz

(n)

AUXC

(p)

AUXC

(n)

SEL = 1

SEL = 0

SEL = 1

SEL = 0

125kW

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLAS822

HD3SS212

ZHCS600C –DECEMBER 2011 –REVISED OCTOBER 2016

HD3SS212 5.4Gbps DisplayPort 1.2 2 选选 1 差差动动开开关关

1 特特性性

• 与Displayport 1.2的电气标准兼容

• 2:1开关支持的最高数据速率为5.4Gbps

• 支持热插拔检测(HPD)开关

• 在5.4 GHz上宽-3dB差分带宽(BW)

• 出色的动态特性（2.7GHz情况下）

– 串扰 = -50dB

– 隔音 = -22dB

– 插入损耗 = –1.4dB

– 回波损耗 = –11dB

– 最大位到位失真 = 4ps

• 漏极电源电压电压(VDD)运行范围3.3V ± 10%

• 小型 5mm x 5mm x 1mm，48 焊球 u*BGA 封装方

式

• 输出使能 (OE) 引脚禁用开关以省电

• 功耗

– HD3SS212 < 10mW（待机功耗 < 30µW，此

时，OE = L）在整个文档内将

2 应应用用

• 需要 DP 和 PCI Express 的主板应用

• 台式电脑

• 笔记本电脑

• 底座

3 说说明明

HD3SS212 是一款高速无源开关，能够在应用中将两

个完全 DisplayPort 4 通道端口从两个源之一切换到一

个目标位置。对于 DisplayPort 应用， HD3SS212 还

支持在辅助 (AUX) 和热插拔检测 (HPD) 信号间切换。

HPD 路径是一个缓冲器，此缓冲器在 HPDC 线路上要

求一个 125kΩ 下拉电阻。

一个典型应用将是包含 2 个图形处理单元 (GPU) 的主

板，这些处理单元需要驱动一个 DisplayPort 负输出。

GPU 由 Dx_SEL 引脚选择。HD3SS212 采用 48 焊球

球状引脚栅格阵列 (BGA) 封装方式并在 -40°C 至

105°C 的完全工业温度范围内由 3.3V 单电源供电运

行。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

HD3SS212

BGA MicroStar

Junior (48)

5.00mm x 5.00mm

(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。

功功能能方方框框图图

HD3SS212

ZHCS600C –DECEMBER 2011 –REVISED OCTOBER 2016

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Function........................... 3

6 Specifications......................................................... 5

6.1 Absolute Maximum Ratings ...................................... 5

6.2 ESD Ratings ............................................................ 5

6.3 Recommended Operating Conditions....................... 5

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 6

6.6 Typical Characteristics.............................................. 7

7 Parameter Measurement Information .................. 8

7.1 Test Timing Diagrams............................................... 8

8 Detailed Description............................................ 10

8.1 Overview ................................................................. 10

8.2 Functional Block Diagram ....................................... 10

8.3 Feature Description................................................. 11

8.4 Device Functional Modes........................................ 11

9 Application and Implementation ........................ 12

9.1 Application Information............................................ 12

9.2 Typical Application ................................................. 13

10 Power Supply Recommendations ..................... 15

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Example .................................................... 15

12 器器件件和和文文档档支支持持 ..................................................... 16

12.1 接收文档更新通知 ................................................. 16

12.2 社区资源................................................................ 16

12.3 商标 ....................................................................... 16

12.4 静电放电警告......................................................... 16

12.5 Glossary................................................................ 16

13 机机械械、、封封装装和和可可订订购购信信息息....................................... 16

4 修修订订历历史史记记录录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision B (January 2014) to Revision C Page

• 已添加器件信息表，ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部

分，器件和文档支持部分以及机械、封装和可订购信息部分。............................................................................................... 1

• 已删除订购信息表。请参见数据表末尾的 POA。.................................................................................................................. 1

Changes from Revision A (March 2012) to Revision B Page

• 已更改 OE 更改为 OE ............................................................................................................................................................ 1

Changes from Original (December 2011) to Revision A Page

• 已更改说明，从“–40°C 到 85°C 的整个工业温度范围”更改为“–40°C 到 105°C 的整个工业温度范围” ................................ 1

• Added Operating Temperature to the Abs Max Table ........................................................................................................... 5

• Changed the Operating free-air temperature From MAX = 85°C To: 105°C ......................................................................... 5

• Changed the values of ψ

and ψ

in the Thermal Information table .................................................................................... 5

• Changed the MAX value of Leakage current (Dx_SEL), VDD = 0 V From: 8µA To: 10µA ................................................... 6

HD3SS212

www.ti.com.cn

ZHCS600C –DECEMBER 2011–REVISED OCTOBER 2016

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential voltages, are with respect to network ground terminal.

(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)(2)

MIN MAX UNIT

Supply voltage range

(3)

VDD –0.5 4 V

Voltage range

Differential I/O –0.5 4 V

Control pin –0.5 VCC +0.5 V

Operating free-air temperature –40 105 °C

Continuous power dissipation See Thermal Information

Storage temperature –55 125 °C

(1) Tested in accordance with JEDEC Standard 22, Test Method C101-A

(2) Tested in accordance with JEDEC Standard 22, Test Method A115-A

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM)

(1)

±4000

Charged-device model (CDM)

(2)

±1000

6.3 Recommended Operating Conditions

Nominal values for all parameters are at V

= 3.3V and T

= 25°C, all temperature limits are specified by design

PARAMETER CONDITIONS MIN NOM MAX UNIT

Supply voltage 3.0 3.3 3.6 V

Input high voltage Control Pins, Signal Pins (Dx_SEL, OE) (HPDC, 5V Tolerant) 2.0 VDD V

Input low voltage Control Pins, Signal Pins (Dx_SEL, OE, HPDC) –0.1 0.8 V

I/O_Diff

Differential voltage (Dx,

AUXx)

Switch I/O diff voltage 0 1.8 Vpp

I/O_CM

Common voltage (Dx,

AUXx)

Switch I/O common mode voltage 0 2.0 V

Operating free-air

temperature

–40 105 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

(1)

HD3SS212

UNITµ*BGA (ZQE)

48-Ball

Junction-to-ambient thermal resistance 90.5 °C/W

JCtop

Junction-to-case (top) thermal resistance 41.9 °C/W

Junction-to-board thermal resistance 53.9 °C/W

Junction-to-top characterization parameter 1.8 °C/W

Junction-to-board characterization parameter 53.4 °C/W

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