TI-HD3SS214.pdf资源-CSDN文库

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Source A

Source B

HPDB

DAx(p)

HPDA

DAx(n)

HPDC

AUXAx

DDCA

DDCB

AUXCx

AUXBx

DCx(p)

DCx(n)

DP Sink

DBx(p)

DBx(n)

Control

AUX_SEL

Dx_SEL

DDCC

HD3SS214 2:1

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLAS907

HD3SS214

ZHCSEP9B –DECEMBER 2015–REVISED JUNE 2017

HD3SS214 8.1Gbps DisplayPort 1.4 2:1/1:2 差差动动开开关关

1 特特性性

• 符合 Displayport 1.4 电气标准

• 2:1 和 1:2 开关最高支持 8.1Gbps 的数据速率

• 支持热插拔检测 (HPD)、辅助 (AUX) 和显示数据通

道 (DDC) 间的切换

• 8GHz 的宽差分带宽 (BW)

• 出色的动态电气特性

• V

工作范围：3.3V±10%

• 扩展的工业温度范围：

-40°C 至 105°C

• 5mm x 5mm，50 焊球 ųBGA 封装

• 输出使能 (OE) 引脚禁用开关以省电

• 功耗

– 工作模式：< 2mW（典型值）

– 待机模式：< 10µW（典型值）（OE = 低电平

时）

2 应应用用范范围围

• 笔记本电脑

• 台式机/一体化计算机

• 集线站

• 数字电视

3 说说明明

HD3SS214 是一款高速无源开关，能够在应用中将两

个完全 DisplayPort 4 通道端口从两个源之一切换到一

个目标位置。它还将一个源切换到两个接收设备中的一

个。对于 DisplayPort 应用，采用 ZQE 封装的

HD3SS214 支持在辅助 (AUX)、显示数据通道 (DDC)

和热插拔检测 (HPD) 信号间切换。

一个典型应用就是包含 2 个图形处理单元 (GPU) 的母

板，此处理单元需要驱动一个 DisplayPort 负输出。

GPU 由 Dx_SEL 引脚选择。另外的应用是一个源需要

在两个负输出间切换，其中的一个例子就是一个侧面连

接器和一个扩展坞连接器。此切换由 Dx_SEL 和

AUX_SEL 引脚控制。HD3SS214 在 -40°C 至 105°C

的扩展工业温度范围内由 3.3V 单电源供电运行。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

HD3SS214

µBGA (50) 5.00mm x 5.00mm

HD3SS214I

(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品

附录。

简简化化原原理理图图

HD3SS214

ZHCSEP9B –DECEMBER 2015–REVISED JUNE 2017

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用范范围围................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 5

6.1 Absolute Maximum Ratings ...................................... 5

6.2 ESD Ratings.............................................................. 5

6.3 Recommended Operating Conditions....................... 5

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 6

6.6 Electrical Characteristics, Device Parameters.......... 6

6.7 Timing Requirements................................................ 7

6.8 Typical Characteristics.............................................. 7

7 Detailed Description.............................................. 8

7.1 Overview ................................................................... 8

7.2 Functional Block Diagram ......................................... 9

7.3 Feature Description................................................... 9

7.4 Device Functional Modes........................................ 10

8 Application and Implementation ........................ 11

8.1 Application Information............................................ 11

8.2 Typical Application ................................................. 11

9 Power Supply Recommendations...................... 16

10 Layout................................................................... 16

10.1 Layout Guidelines ................................................. 16

10.2 Layout Example .................................................... 17

11 器器件件和和文文档档支支持持 ..................................................... 19

11.1 器件支持 ............................................................... 19

11.2 接收文档更新通知 ................................................. 19

11.3 社区资源................................................................ 19

11.4 商标 ....................................................................... 19

11.5 静电放电警告......................................................... 19

11.6 Glossary................................................................ 19

12 机机械械、、封封装装和和可可订订购购信信息息....................................... 19

4 修修订订历历史史记记录录

Changes from Revision A (July 2016) to Revision B Page

• 将

标题

和

特性

从 DisplayPort 1.3 改为 DisplayPort 1.4 ......................................................................................................... 1

Changes from Original (December 2015) to Revision A Page

• Changed DC2(p) to DC2(n) in Pin Functions......................................................................................................................... 4

• Changed DC2(n) to DC2(p) in Pin Functions......................................................................................................................... 4

HD3SS214

ZHCSEP9B –DECEMBER 2015–REVISED JUNE 2017

www.ti.com.cn

Pin Functions (continued)

I/O DESCRIPTION

(1)

NO. NAME

A6 DA2(n) I/O Port A, Channel 2, High Speed Negative Signal

A8 DA3(p) I/O Port A, Channel 3, High Speed Positive Signal

A9 DA3(n) I/O Port A, Channel 3, High Speed Negative Signal

B1 DC0(n) I/O Port C, Channel 0, High Speed Negative Signal

B2 DC0(p) I/O Port C, Channel 0, High Speed Positive Signal

B3,C8,G2,G

8,H4,H7

GND Supply Ground

B4 DA0(p) I/O Port A, Channel 0, High Speed Positive Signal

B5 DA1(p) I/O Port A, Channel 1, High Speed Positive Signal

B6 DA2(p) I/O Port A, Channel 2, High Speed Positive Signal

B7 OE I

Output Enable:

OE = V

: Normal Operation

OE = V

: Standby Mode

B8 DB0(p) I/O Port B, Channel 0, High Speed Positive Signal

B9 DB0(n) I/O Port B, Channel 0, High Speed Negative Signal

C2 AUX_SEL Control I AUX/DDC Selection Control Pin in Conjunction with Dx_SEL Pin

D1 DC1(n) I/O Port C, Channel 1, High Speed Negative Signal

D2 DC1(p) I/O Port C, Channel 1, High Speed Positive Signal

D8 DB1(p) I/O Port B, Channel 1, High Speed Positive Signal

D9 DB1(n) I/O Port B, Channel 1, High Speed Negative Signal

E1 DC2(n) I/O Port C, Channel 2, High Speed Negative Signal

E2 DC2(p) I/O Port C, Channel 2, High Speed Positive Signal

E8 DB2(p) I/O Port B, Channel 2, High Speed Positive Signal

E9 DB2(n) I/O Port B, Channel 2, High Speed Negative Signal

F1 DC3(n) I/O Port C, Channel 3, High Speed Negative Signal

F2 DC3(p) I/O Port C, Channel 3, High Speed Positive Signal

F8 DB3(p) I/O Port B, Channel 3, High Speed Positive Signal

F9 DB3(n) I/O Port B, Channel 3, High Speed Negative Signal

H1 AUXC(n) I/O Port C AUX Negative Signal

H2 AUXC(p) I/O Port C AUX Positive Signal

H3 HPDB I/O Port B Hot Plug Detect

H6 AUXB(p) I/O Port B AUX Positive Signal

H5 DDCCLK_B I/O Port B DDC Clock Signal

H8 DDCCLK_A I/O Port A DDC Clock Signal

H9 AUXA(p) I/O Port A AUX Positive Signal

J1 HPDC I/O Port C Hot Plug Detect

J2 HPDA I/O Port A Hot Plug Detect

J3 DDCCLK_C I/O Port C DDC Clock Signal

J5 DDCDAT_B I/O Port B DDC Data Signal

J6 AUXB(n) I/O Port B AUX Negative Signal

J7 DDCDAT_C I/O Port C DDC Data Signal

J8 DDCDAT_A I/O Port A DDC Data Signal

J9 AUXA(n) I/O Port A AUX Negative Signal

HD3SS214

www.ti.com.cn

ZHCSEP9B –DECEMBER 2015–REVISED JUNE 2017

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential voltages, are with respect to network ground terminal.

(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B

6 Specifications

6.1 Absolute Maximum Ratings

(1)(2)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Supply voltage range

(3)

–0.5 4 V

Voltage range

Differential I/O –0.5 4

Control pin –0.5 V

+ 0.5

Continuous power dissipation See Thermal Information

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101

(2)

±500

6.3 Recommended Operating Conditions

Typical values for all parameters are at V

= 3.3 V and T

= 25°C. All temperature limits are specified by design.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Supply voltage 3 3.3 3.6 V

Input high voltage

Control Pins, Signal Pins

(Dx_SEL, AUX_SEL, MODE, OE)

2 V

Input mid level voltage AUX_SEL Pin

/2 -300

Input low voltage

Control Pins, Signal Pins

(Dx_SEL, AUX_SEL, MODE, OE)

-0.1 0.8 V

I/O_Diff

Differential voltage (Dx, AUXx) Switch I/O diff voltage 0 1.8 Vpp

I/O_CM

Dx switching I/O Common mode voltage

Switch I/O common mode voltage

0 2 V

AUXx (1) switching I/O Common mode

voltage

0 3.6

Operating free-air temperature

HD3SS214 0 70 °C

HD3SS214I –40 105 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

(1)

HD3SS214

UNITZQE (µBGA)

50 PINS

θJA

Junction-to-ambient thermal resistance 90.5 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 41.9 °C/W

θJB

Junction-to-board thermal resistance 53.9 °C/W

Junction-to-top characterization parameter 1.8 °C/W

Junction-to-board characterization parameter 53.4 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance n/a °C/W

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