TPS65642
ZHCSBB3 –JULY 2013
www.ti.com.cn
2 Electrical Specifications
2.1 ORDERING INFORMATION
(1)
T
A
ORDERING PACKAGE PACKAGE MARKING
–40°C to 85°C TPS65642YFF 3.16 mm × 3.45 mm DSBGA, 0.4 mm pitch TPS65642
(1) The device is supplied taped and reeled, with 3000 devices per reel.
2.2 ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN, SW2, VCORE, SW3, VIO1, VIO2 RSET, COMP, SCL, SDA,
–0.3 7 V
EN, FLK, WP, TCOMP, XAO, RST
AVDD, SW1, OUT1, OUT2, OUTA-OUTN –0.3 12 V
SW4 –0.3 36
(2)
V
Pin voltage
POS1, NEG1, POS2, NEG2 –0.3 12
(3)
V
|POS1-NEG1|
(4)
, |POS2-NEG2|
(4)
2 V
VGH, VGHM, RE –0.3 40
(5)
V
Human Body Model 2000 V
ESD Rating Machine Model 200 V
Charged Device Model 700 V
Ambient temperature, T
A
-40 85 °C
Junction temperature, T
J
-40 150 °C
Storage temperature, T
STG
–65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) V
GH
supplies up to 40 V can be generated, but require an external cascode transistor or charge pump.
(3) For supply voltages less than 12 V, the absolute maximum input voltage is equal to the supply voltage.
(4) Differential input voltage.
(5) The combination of low temperatures and high V
GH
voltages can cause increased leakage current through the RE pin. In GIP
applications that do not use the gate-voltage shaping function it is recommended to leave the RE pin open to minimize this effect.
2.3 THERMAL INFORMATION
(1)
TPS65642
THERMAL METRIC YFF UNITS
56 PINS
θ
JA
Junction-to-ambient thermal resistance 45
θ
JCtop
Junction-to-case (top) thermal resistance 0.2
θ
JB
Junction-to-board thermal resistance 6.4
°C/W
ψ
JT
Junction-to-top characterization parameter 0.8
ψ
JB
Junction-to-board characterization parameter 6.1
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Electrical Specifications Copyright © 2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS65642