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TI的TLC6C598-Q1是一款专为汽车应用设计的8位移位寄存器LED驱动器，具备高可靠性和耐温性。该器件通过了AEC-Q100认证，适用于-40°C到125°C的工作环境温度范围，具有第二级人体模型（HBM）静电放电（ESD）分类和C3B级电路板放电（CDM）ESD分类，确保在恶劣环境下的稳定工作。 TLC6C598-Q1的电源电压范围宽，支持3V到5.5V，每个输出端口可以提供最大50mA的连续电流，当Vcc为5V时，输出最大额定电压为0.40V。器件内置热关断保护机制，以防止过热损坏。为了方便多级级联，它还增强了级联功能，允许在多个阶段中串联使用。此外，该芯片的所有寄存器都可以通过单一输入清除，简化了系统操作。低功耗是TLC6C598-Q1的另一个重要特性，其慢速开关时间（tr和tf）有助于显著降低电磁干扰（EMI）。这种设计对于在要求低噪声的环境中使用LED照明和控制非常有利。该器件采用16引脚TSSOP-PW和16引脚SOIC-D封装，提供紧凑的尺寸和方便的布线选项。在典型应用中，TLC6C598-Q1常用于仪表盘、警示灯以及LED照明和控制。数据通过串行输入并行输出的方式进入8位移位寄存器，然后传递到8位D型存储寄存器。移位寄存器时钟（SRCK）的上升沿触发数据转移，而寄存器时钟（RCK）则控制存储寄存器的数据传输。当移位寄存器清除信号（CLR）为高时，存储寄存器将数据传送到输出缓冲器。若输出使能（G）保持高位，则所有输出缓冲器的数据保持低电平，LED关闭；反之，当G为低时，存储寄存器中的数据将透明地传输到输出缓冲器，点亮或控制相应的LED。 TLC6C598-Q1是一种适合汽车电子系统，尤其是涉及LED显示和指示应用的高效能、低功耗解决方案。其宽泛的电源电压范围、ESD保护、热保护和低噪声特性，使得它在汽车仪表、警示灯等场景中表现出色，为设计者提供了可靠的硬件基础。

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLC6C598-Q1

SLIS142D –DECEMBER 2012–REVISED SEPTEMBER 2016

TLC6C598-Q1 Power Logic 8-Bit Shift Register LED Driver

1 Features

• Qualified for Automotive Applications

• AEC-Q100 Qualified With the Following Results:

– Device Temperature Grade 1: –40°C to 125°C

Ambient Operating Temperature Range

– Device HBM ESD Classification Level H2

– Device CDM ESD Classification Level C3B

• Wide Vcc From 3 V to 5.5 V

• Output Maximum Rating of.40 V

• Eight Power DMOS Transistor Outputs of 50-mA

Continuous Current With V

= 5 V

• Thermal Shutdown Protection

• Enhanced Cascading for Multiple Stages

• All Registers Cleared With Single Input

• Low Power Consumption

• Slow Switching Time (t

and t

), Which Helps

Significantly With Reducing EMI

• 16-Pin TSSOP-PW Package

• 16-Pin SOIC-D Package

2 Applications

• Instrumentation Cluster

• Tell-Tale Lamps

• LED Illumination and Control

Typical Application Schematic

3 Description

The TLC6C598-Q1 is a monolithic, medium-voltage,

low-current power 8-bit shift register designed for use

in systems that require relatively moderate load

power, such as LEDs.

This device contains an 8-bit serial-in, parallel-out

shift register that feeds an 8-bit D-type storage

storage registers on the rising edge of the shift-

respectively. The storage register transfers data to

the output buffer when shift register clear (CLR) is

high. A low on CLR clears all registers in the device.

Holding the output enable (G) high, holds all data in

the output buffers low, and all drain outputs are off.

Holding G low makes data from the storage register

transparent to the output buffers. When data in the

output buffers is low, the DMOS transistor outputs are

off. When data is high, the DMOS transistor outputs

have sink-current capability. The serial output (SER

OUT) clocks out of the device on the falling edge of

SRCK to provide additional hold time for cascaded

applications. This provides improved performance for

applications where clock signals may be skewed,

devices are not located near one another, or the

system must tolerate electromagnetic interference.

The device contains built-in thermal shutdown

protection.

Outputs are low-side, open-drain DMOS transistors

with output ratings of 40 V and 50 mA continuous

sink-current capabilities when Vcc = 5 V. The current

limit decreases as the junction temperature increases

for additional device protection. The device also

provides up to 2000 V of ESD protection when tested

using the human-body model and 200 V when using

the machine model.

The TLC6C598-Q1 characterization is for for

operation over the operating ambient temperature

range of −40°C to 125°C.

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

TLC6C598-Q1

SOIC (16) 9.90 mm x 3.91 mm

TSSOP (16) 5.00 mm x 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

TLC6C598-Q1

SLIS142D –DECEMBER 2012–REVISED SEPTEMBER 2016

www.ti.com

Product Folder Links: TLC6C598-Q1

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Timing Requirements................................................ 5

6.7 Switching Characteristics.......................................... 6

6.8 Timing Waveforms .................................................... 7

6.9 Typical Characteristics.............................................. 8

7 Parameter Measurement Information .................. 9

8 Detailed Description............................................ 11

8.1 Overview ................................................................. 11

8.2 Functional Block Diagram ....................................... 11

8.3 Feature Description................................................. 12

8.4 Device Functional Modes........................................ 12

9 Application and Implementation ........................ 13

9.1 Application Information............................................ 13

9.2 Typical Application ................................................. 13

10 Power Supply Recommendations ..................... 16

11 Layout................................................................... 16

11.1 Layout Guidelines ................................................. 16

11.2 Layout Example .................................................... 16

12 Device and Documentation Support ................. 17

12.1 Receiving Notification of Documentation Updates 17

12.2 Community Resources.......................................... 17

12.3 Trademarks........................................................... 17

12.4 Electrostatic Discharge Caution............................ 17

12.5 Glossary................................................................ 17

13 Mechanical, Packaging, and Orderable

Information ........................................................... 17

13.1 Package Option Addendum .................................. 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (October 2015) to Revision D Page

• Added Receiving Notification of Documentation Updates section ....................................................................................... 17

• Added new orderable part number to Package Option Addendum ..................................................................................... 18

Changes from Revision B (March 2013) to Revision C Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

16 GND

2SER_IN 15 SRCK

3DRAIN0 14 DRAIN7

4DRAIN1 13 DRAIN6

5DRAIN2 12 DRAIN5

6DRAIN3 11 DRAIN4

7CLR 10 RCK

8G 9 SER_OUT

16 GND

2SER_IN 15 SRCK

3DRAIN0 14 DRAIN7

4DRAIN1 13 DRAIN6

5DRAIN2 12 DRAIN5

6DRAIN3 11 DRAIN4

7CLR 10 RCK

8G 9 SER_OUT

TLC6C598-Q1

www.ti.com

SLIS142D –DECEMBER 2012–REVISED SEPTEMBER 2016

Product Folder Links: TLC6C598-Q1

5 Pin Configuration and Functions

PW Package

16-Pin TSSOP

Top View

D Package

16-Pin SOIC

Top View

Pin Functions

I/O DESCRIPTION

NAME NO.

CLR 7 I Shift register clear, active-low. The storage register transfers data to the output buffer

when CLR is high. Driving CLR low clears all the registers in the device.

DRAIN0 3 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN1 4 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN2 5 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN3 6 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN4 11 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN5 12 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN6 13 O Open-drain output, LED current-sink channel, connect to LED cathode

DRAIN7 14 O Open-drain output, LED current-sink channel, connect to LED cathode

G 8 I Output enable, active-low. LED-channel enable and disable input pin. Having G low

enables all drain channels according to the output-latch register content. When high, all

channels are off.

GND 16 — Power ground, the ground reference pin for the device. This pin must connect to the

ground plane on the PCB.

RCK 10 I Register clock. The data in each shift register stage transfers to the storage register at the

rising edge of RCK.

SER IN 2 I Serial data input. Data on SER IN loads into the internal register on each rising edge of

SRCK.

SER OUT 9 O Serial data output of the 8-bit serial shift register. The purpose of this pin is to cascade

several devices on the serial bus.

SRCK 15 I Serial clock input. On each rising SRCK edge, data transfers from SER IN to the internal

serial shift registers.

1 I Power supply pin for the device. TI recommends adding a 0.1-μF ceramic capacitor close

to the pin.

TLC6C598-Q1

SLIS142D –DECEMBER 2012 –REVISED SEPTEMBER 2016

www.ti.com

Product Folder Links: TLC6C598-Q1

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Logic supply voltage –0.3 8 V

Logic input-voltage range –0.3 8 V

Power DMOS drain-to-source voltage –0.3 42 V

Continuous total dissipation See Thermal Information

Operating ambient temperature –40 125 °C

Operating junction temperature range –40 150 °C

stg

Storage temperature range –55 165 °C

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002

(1)

±2000

Charged device model (CDM), per AEC

Q100-011

All pins ±750

Corner pins (1, 8, 9, and

16)

±750

6.3 Recommended Operating Conditions

MIN MAX UNIT

Supply voltage 3 5.5 V

High-level input voltage 2.4 V

Low-level input voltage 0.7 V

Operating ambient temperature –40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.4 Thermal Information

THERMAL METRIC

(1)

TLC6C598-Q1

UNITPW (TSSOP) D (SOIC)

16 PINS 16 PINS

θJA

Junction-to-ambient thermal resistance 129.4 100 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 55.4 45 °C/W

θJB

Junction-to-board thermal resistance 65.8 40 °C/W

Junction-to-top characterization parameter 9.9 10 °C/W

Junction-to-board characterization parameter 65.2 40 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance NA NA °C/W

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