© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
1 Publication Order Number:
NUP4103FC/D
NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
Features
• Unidirectional, Quad ESD Protection
• Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm)
• Compliance with IEC61000−4−2 (Level 4) Requirements
• Maximum Leakage Current of 100 nA at 3.3 V
• Pb−Free Package is Available*
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
• Small Package Saves on PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
• Low Leakage Capability Minimizes Power Loss in the System
Applications
• ESD Protection for Portable Equipment
• Cell Phones
• MP3 Players
• PDAs
MAXIMUM RATINGS
Rating Symbol Value Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
Machine Model
V
PP
30
30
16
1.6
kV
Junction Temperature T
J
150 °C
Operating Ambient Temperature Range T
A
−40 to +85 °C
Storage Temperature Range T
STG
−55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package
ORDERING INFORMATION
NUP4103FCT1 Flip−Chip 3000/Tape & Reel
CIRCUIT DESCRIPTION
A1 C1
A3 C3
B2
A
B
C
A
B
C
12 12
TOP VIEW
(Bumps Down)
BOTTOM VIEW
(Bumps Up)
33
E M G
G
E = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
MARKING
DIAGRAM
1
5−PIN FLIP−CHIP CSP
PLASTIC
CASE 766AB
NUP4103FCT1G Flip−Chip
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Shipping
†
http://onsemi.com