安森美半导体ESD保护器件NUP4103FCT1-D 数据手册.pdf

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安森美半导体ESD保护器件NUP4103FCT1-D 数据手册pdf,安森美半导体ESD保护器件NUP4103FCT1-D 数据手册
NUP4103FC Tek Run: 250MS/s Sample Trig W Ch12.0/div M 200 ns c 4.80v Figure 3. ESD Response for Human Body Model (+8 kv) Tek stop: 250MS/S 15 ACqs A气 chi 500 mV/div M200 ns chi 631y Figure 4. ESD Response for Human Body Model (-8 kv) http:/onsemi.com NUP4103FC Printed circuit board recommendations 500 um Pitch Parameter 300μ m Solder Ball PCB Pad size 250um+25/-0 Pad si Round Pad Type NSMD Solder Mask Opening 350um±25 Solder stencil thickness 125m Stencil Aperture 250×250pmsq Solder flux Ratio 50/50 Solder Paste type No Clean Type 3 or Fine Trace Finish OSP Cu Trace Width 150 um Max Copper Solder mask NSMD SMD Figure 5. Solder Mask versus Non -Solder Mask Definition Controlled Atmosphere 50 225°cMin 235°cMax 200 183° 2to5°/s 150 140to160° 100 50 1to5°c/s 0 to 2 min 30-100sec TIME(minutes) Figure 6. Solder Reflow Profile http:/onsemi.com NUP4103FC PACKAGE DIMENSIONS 5-PIN FLIP-CHIP CSP CASE 766AB-01 ISSUEO NOTES 1. DIMENSIONING AND TOLERANCING PER 010c ASME Y14.5M. 1994 CONTROLLING DIMENSION: MILLIMETERS COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS MILLIMETER DIM MAX TERMINAL A A LOCATOR A10.2100.270 A203800.4 D1330 bsc - A1 0.960BSc 0.2900.340 010c 0.500 BSC A2yA〖c 0.433BSc D1 0.866 BSC (2()2 0.05C SEATING PLAN D1 5x b 2005|A|B|3+ 2003C A B C ON Semiconductor and (N are registered trademarks of Semiconduc or Components Industries LLC (SCILLC). SCILLC reserves the right to make changes without further notice arising out of the application or use of any product or circuit, and specifically disclaims any and all liabiliy, including without limitaticn special, consequential or incidental damages Typica"parameters which may be provided in SCiLLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including"Typicals"must be validated for each customer application by customer's techn cal experts. SCiLLC does not convey any license under its patent right lor the rights of others. SCiLLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIlla product could create a situation where personal injury or death may occur. Should buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates and distributors harmless against all claims, casts, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCillA was negligent regarding the design or manufacture of the part SCiLLC is an equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT N.AmericanTechnicalSupport800-282-9855TollFreeOnSemiconductorWebsitehttp://onsemi.com Literature Distribution Certer for on Semiconductor USA/Canac P O. Box 61312. Phoenix, Arizona 85082-1312 USA OrderLiteraturehttp:/w/ww.onsemi.com/litorder Phone: 480-829-7710 or 800-344-386C Toll Free USA/Canada Japan ON Semiconductor, Japan Customer Focus Center Fax: 480-B29-7709 or 800-344-3867 Tcll Free USA/Canada 2-9-1 Kamimeguro, Meguro-ku, Tckyo, Japan 153-0051 For additional information, please contact your Email: orderlitonsemi com Phone:81-3-5773-3850 local Salcs Roprosentativc NUP4013FC/D

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