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MIL-STD-750-2_CHG-4.047783.pdf
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MIL-STD-750-2_CHG-4.047783.pdf
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i
INCH–POUND
MIL–STD–750–2
w/CHANGE 4
1 September 2013
SUPERSEDING
MIL–STD–750-2
w/CHANGE 3
29 April 2013
(see 6.4)
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES
PART 2: TEST METHODS 2001 THROUGH 2999
AMSC N/A FSC 5961
The documentation and process
conversion measures necessary to
comply with this revision shall be
completed by 15 October 2013.
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MIL-STD-750-2
w/CHANGE 4
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This revision has resulted in many changes to the format, but the most significant one is the splitting the
document into parts. See MIL–STD–750 for the change summary.
3. Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Logistics Agency, DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH
43218–3990, or emailed to semiconductor@dla.mil. Since contact information can change, you may want to
verify the currency of this address information using the ASSIST Online database at https://assist.dla.mil.
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MIL-STD-750-2
w/CHANGE 4
iii
SUMMARY OF CHANGE 4 MODIFICATIONS
1. Test method 2006 was revised to include default conditions.
2. Test method 2056 was revised to include examination and failure criteria requirements.
Test Method Paragraph Modification
2006 3 Changed
2006 4 Changed
2056 3.3 Changed
2056 3.4 Changed
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MIL-STD-750-2
w/CHANGE 4
iv
PARAGRAPH PAGE
FOREWORD…………………………………………………………………………………………………….…...ii
SUMMARY OF CHANGE 4 MODIFICATIONS .......................................................................................... iii
1.
SCOPE ..................................................................................................................................... 1
1.1 Purpose ............................................................................................................................... 1
1.2 Numbering system .............................................................................................................. 1
1.2.1 Classification of tests ..................................................................................................... 1
1.2.2 Test method revisions ................................................................................................... 1
1.3 Methods of reference .......................................................................................................... 1
2.
APPLICABLE DOCUMENTS .................................................................................................... 2
2.1 General ............................................................................................................................... 2
2.2 Government documents ...................................................................................................... 2
2.2.1 Specifications, standards, and handbooks .................................................................... 2
2.3 Non-Government publications ............................................................................................. 2
2.4 Order of precedence ........................................................................................................... 3
3.
DEFINITIONS ........................................................................................................................... 4
3.1 Acronyms, symbols, and definitions .................................................................................... 4
3.2 Acronyms used in this standard .......................................................................................... 4
4.
GENERAL REQUIREMENTS ................................................................................................... 4
4.1 General ............................................................................................................................... 4
4.2 Test circuits ......................................................................................................................... 5
4.3 Destructive tests .................................................................................................................. 5
4.4 Non–destructive tests .......................................................................................................... 6
4.5 Laboratory suitability ........................................................................................................... 6
5.
DETAILED REQUIREMENTS ................................................................................................... 6
6.
NOTES...................................................................................................................................... 6
6.1 Intended use ....................................................................................................................... 6
6.2 International standardization agreement ............................................................................. 7
6.3 Subject term (key word) listing ............................................................................................ 7
6.4 Supersession data............................................................................................................... 7
6.5 Change notations ................................................................................................................ 7
CONCLUDING MATERIAL………………………………………………………………………………………..C-1
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MIL-STD-750-2
w/CHANGE 4
v
CONTENTS
FIGURE TITLE
2017–1 Uniform force distribution
2017–2 Rotational capability
2017–3 Perpendicular force application
2017–4 Die shear strength criteria
2037–1 Minimum bond pull limits
2037–2 Wire loop angle
2037–3 Flat loop wire pull testing
2038–1 Sample apparatus fixture with force measuring gauge
2038–2 Close up view of sample apparatus fixture
2038–3 Condition B
2038–4 Condition C
2038–5 Condition D
2052–1 Typical STU
2069–1 Bond dimensions
2069–2 Torn bonds
2069–3 Acceptable and unacceptable voids and excessive pigtails
2069–4 Acceptable and unacceptable bonding material build-up
2069–5 Extraneous bonding material build-up
2069–6 Acceptable and unacceptable excess material
2070–1 Metallization scratches and voids (expanded contact)
2070–2 Cracks and chips
2070–3 Bond dimensions
2070–4 Lifted or torn bonds
2070–5 Mesh geometry
2070–6 Interdigitated geometry
2070–7 Spine geometry
2071–1 Radial cracks extending more than one-half the distance from pin to outer member
2071–2 Circumferential cracks
2071–3 Bubbles in glass exceeding one-third of the sealing area
2071–4 Single bubble or void
2071–5 Two bubbles in a line
2071–6 Interconnecting bubbles
2071–7 Meniscus cracks
2071–8 Chip outs
2071–9 Transparent glass diode
2071–10 Braze separation/delamination
2071–11 Crack in braze metallization
2071–12 Discontinuous braze metallization
2071–13 Ceramic feedthrough visual inspection criteria
2071–14 Rejectable foreign material conditions
2072–1 Metallization scratches, probe marks and voids
2072–2 Innermost guard band metallization scratches, probe marks and voids
2072–3 Active region metallization scratches, probe marks and voids
2072–4 Pad and contact metallization scratches, probe marks and voids
2072–5 Contact metallization scratches, probe marks and voids
2072–6 Metallization probing damage
2072–7 Metallization bridging between two normally unconnected metallization areas
2072–8 Metallization bridging between two normally unconnected metallization paths
2072–9 Metallization misalignment, cross section view
2072–10 Metallization misalignment
2072–11 Passivation and diffusion faults
2072–12 Passivation and diffusion faults, cross section view
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