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MIL-STD-750_4_CHG-2.055756.pdf
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MIL-STD-750_4_CHG-2.055756.pdf
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AMSC N/A FSC 5961
INCH–POUND
MIL–STD–750–4
w/CHANGE 2
18 August 2017
SUPERSEDING
MIL–STD–750–4
w/CHANGE 1
15 August 2014
(see 6.4)
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
DIODE ELECTRICAL TEST METHODS FOR SEMICONDUCTOR DEVICES
PART 4: TEST METHODS 4000 THROUGH 4999
The documentation and process
conversion measu
res necessary to
comply with this revision shall be
completed by 18 February 2018.
Downloaded from http://www.everyspec.com
MIL–STD–750–4
w/CHANGE 2
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This issue of MIL–STD–750–4 establishes uniform test methods for testing the electrical characteristics of
diodes, microwave diodes, thyristors, and tunnel diodes.
3. Comments, suggestions, or questions on this document should be addressed to: Commander,
Defense Logistics Agency, DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218–3990,
or emailed 750.TestMethods@dla.mil. Since contact information can change, you may want to verify the
currency of this address information using the ASSIST Online database at https://assist.dla.mil.
Downloaded from http://www.everyspec.com
MIL–STD–750–4
w/CHANGE 2
iii
SUMMARY OF CHANGE 2 MODIFICATIONS
1. Paragraph 1.3 has been added to address method of reference.
2. Paragraphs 3.1.1, 3.1.2 and 3.1.3 have been added to separate acronyms from symbols from terms used
throughout the standard. Acronyms used in various test methods have been added. Acronyms not used in
any test methods have been deleted.
3. Test method 4011 was reformatted and revised to correct errors and include requirements to allow the use
of automatic test equipment.
4. Test method 4026 was reformatted and revised to correct errors and to standardize the definitions and
symbols used.
5. The following modifications to MIL–STD–750–4 have been made:
Paragraph Modification
1.3 Added.
3.1.1 Changed.
3.1.2 Added.
3.1.3 Added.
3.1.3.1 Added.
3.1.3.2 Added.
4.6 Deleted.
6.4 Changed.
6.5 Changed.
Test Method Modification
4011 Revised.
4026 Revised.
Downloaded from http://www.everyspec.com
MIL–STD–750–4
w/CHANGE 2
iv
CONTENTS
PARAGRAPH PAGE
FOREWORD………………………………………………………………………………………………………...ii
SUMMARY OF CHANGE 2 MODIFICATIONS………………………………………………………………….iii
1.
SCOPE ...................................................................................................................................... 1
1.1 Purpose ............................................................................................................................... 1
1.2 Numbering system .............................................................................................................. 1
1.2.1 Classification of tests ..................................................................................................... 1
1.2.2 Test method revisions ................................................................................................... 1
1.3 Methods of reference .......................................................................................................... 1
2.
APPLICABLE DOCUMENTS ..................................................................................................... 2
2.1 General ............................................................................................................................... 2
2.2 Government documents ...................................................................................................... 2
2.2.1 Specifications, standards, and handbooks .................................................................... 2
2.3 Non-Government publications ............................................................................................. 2
2.4 Order of precedence ........................................................................................................... 2
3.
DEFINITIONS ............................................................................................................................ 3
3.1 Acronyms, symbols, and terms ........................................................................................... 3
3.1.1 Acronyms used in this standard .......................................................................................... 3
3.1.2 Symbols used in this standard ............................................................................................ 3
3.1.3 Terms used in this standard ................................................................................................ 3
3.1.3.1 NPN ............................................................................................................................... 3
3.1.3.2 PNP ............................................................................................................................... 3
4.
GENERAL REQUIREMENTS .................................................................................................... 4
4.1 General ............................................................................................................................... 4
4.2 Test conditions for electrical measurements ....................................................................... 4
4.2.1 Steady-state dc measurements (test method series 4000) ........................................... 4
4.2.2 Pulse measurements (test method series 4000) ........................................................... 4
4.2.3 Electrical characteristics tests for microwave diodes (test method series 4100) ........... 4
4.2.4 Test circuits ................................................................................................................... 4
4.3 Non–destructive tests .......................................................................................................... 5
4.4 Destructive tests .................................................................................................................. 5
4.5 Laboratory suitability ........................................................................................................... 5
5.
DETAILED REQUIREMENTS .................................................................................................... 5
6.
NOTES ....................................................................................................................................... 5
6.1 Intended use ....................................................................................................................... 5
6.2 International standardization agreement ............................................................................. 5
6.3 Subject term (key word) listing ............................................................................................ 5
6.4 Supersession data............................................................................................................... 6
6.5 Changes from previous issue .............................................................................................. 6
Downloaded from http://www.everyspec.com
MIL–STD–750–4
w/CHANGE 2
v
CONTENTS
FIGURE TITLE
4001–1
Test circuit for capacitance
4011–1 Test circuits for forward voltage
4016–1 Test circuit for reverse current leakage (dc method)
4016–2 Test circuit for reverse current leakage (ac method)
4021–1 Test circuit for breakdown voltage (diodes)
4022–1 Test circuit for breakdown voltage (voltage regulators and voltage – reference diodes)
4023–1 Ideal reverse trace
4023–2 Soft knee
4023–3 Drift
4023–4 Slope
4023–5 Double break (reject criteria for sharp knee devices
4023–6 Double trace
4023–7 Double trace, soft knee
4023–8 Unstable (jitter)
4023–9 Discontinuity
4023–10 Snap back – collapsing V
BR
4023–11 Floater
4023–12 Arcing
4026–1 Test circuit for forward recovery time and peak forward recovery voltage
4026–2 Input forward current pulse and output voltage waveforms
4031–1 Test circuit for condition A
4031–2 Response pulse waveforms for condition A
4031–3 Test circuit for condition B
4031–4 Suggested board layout for low L
1
/R
4
for condition B
4031–5 Current through DUT (condition B)
4031–6 Circuit for measuring reverse recovery characteristics (condition C)
4031–7 Test current waveforms for various types of rectifier diodes under test in the circuit for measuring
reverse recovery characteristics
4031–8 Test circuit for condition D
4031–9 Suggest board layout for low L
1
/R
4
for test condition D
4031–10 Generalized reverse recovery waveforms for test condition D
4036–1 Test circuit for measuring Q
4041–1 Test circuit for rectification efficiency
4046–1 Test circuit for reverse current, average
4051–1 Test circuit for small-signal reverse breakdown impedance
4056–1 Test circuit for small-signal forward impedance
4061–1 Test circuit for stored charge
4064–1 Test circuit 1
4064–2 Test circuit 1 response
4064–3 Test Circuit 2
4064–4 Test Circuit 2 response
4065–1 Rectangular current pulse test setup
4065–2 Rectangular 20µs Current Pulse Waveform
4065–3 Voltage response
4066–1 Surge pulse applied to continuous halfwave conditions (condition A1)
4066–2 Surge pulse applied to continuous dc conditions (condition A2)
4066–3 Rectangular current pulse test setup
4066–4 Rectangular current pulse waveforms
4066–5 Clamping voltage test circuit
4066–6 Standard current impulse waveshape
Downloaded from http://www.everyspec.com
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