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MIL-STD-750-2A_CHG-3.055868.pdf
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MIL-STD-750-2A_CHG-3.055868.pdf
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AMSC N/A FSC 5961
MIL–STD–750–2A
w/CHANGE 3
7 February 2018
SUPERSEDING
MIL–STD–750–2A
w/CHANGE 2
19 August 2016
(see 6.4)
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES
PART 2: TEST METHODS 2001 THROUGH 2999
The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 6 July 2018.
INCH–POUND
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MIL–STD–750–2A
w/CHANGE 3
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This subpart standard establishes uniform test methods for the mechanical testing to determine resistance to
deleterious effects of natural elements and conditions surrounding military operations.
3. Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Logistics Agency, DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218–3990, or
emailed to 750.TestMethods@dla.mil. Since contact information can change, you may want to verify the
currency of this address information using the ASSIST Online database at https://assist.dla.mil.
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MIL–STD–750–2A
w/CHANGE 3
iii
SUMMARY OF REVISION A WITH CHANGE 3 MODIFICATIONS
1. Test method 2068, entire method was rewritten extensively to clarify existing and add new requirements.
2. Test method 2071, renumbered eleven paragraphs under failure criteria.
3. Test method 2071, paragraph 4.2, reorganized subparagraphs and add new subparagraph to add new failure
criteria.
4. Test method 2071, paragraph 4.4, changed paragraph title.
5. Test method 2071, paragraph 4.5.f, delete "shard or" and replace with "sharp or unspecified".
6. Test method 2071, paragraph 4.10, deleted duplicate sentence.
7. Test method 2101, table 2101–II, footnote 3; added two new sentences to define high and low voltage diodes.
8. The following modifications to MIL–STD–750–2 have been made:
Test method Paragraph Modification
2068 All Revised entirely
2071 4.2 Revised.
2071 4.4 Revised.
2071 4.5.f Revised.
2071 4.10 Revised.
2101 Table 2101–II, footnote 3 Revised.
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MIL–STD–750–2A
w/CHANGE 3
iv
CONTENTS
PARAGRAPH PAGE
FORWARD..….………………………………………………………………………………………………….…..ii
SUMMARY OF REVISION A, CHANGE 2 MODIFICATIONS….…….…………………………………….….iii
1.
SCOPE ..................................................................................................................................... 1
1.1 Purpose ............................................................................................................................... 1
1.2 Numbering system .............................................................................................................. 1
1.2.1 Classification of tests ..................................................................................................... 1
1.2.2 Test method revisions ................................................................................................... 1
1.3 Methods of reference .......................................................................................................... 1
2. APPLICABLE DOCUMENTS .................................................................................................... 1
2.1 General ............................................................................................................................... 1
2.2 Government documents ...................................................................................................... 1
2.2.1 Specifications, standards, and handbooks .................................................................... 1
2.3 Non-Government publications ............................................................................................. 2
2.4 Order of precedence ........................................................................................................... 3
3.
DEFINITIONS ........................................................................................................................... 3
3.1 Acronyms, symbols, and definitions .................................................................................... 3
3.2 Acronyms used in this standard .......................................................................................... 3
4.
GENERAL REQUIREMENTS ................................................................................................... 4
4.1 General ............................................................................................................................... 4
4.2 Test circuits ......................................................................................................................... 4
4.3 Destructive tests .................................................................................................................. 4
4.4 Non–destructive tests .......................................................................................................... 5
4.5 Laboratory suitability ........................................................................................................... 5
5.
DETAILED REQUIREMENTS ................................................................................................... 5
6.
NOTES...................................................................................................................................... 5
6.1 Intended use ....................................................................................................................... 5
6.2 International standardization agreement ............................................................................. 6
6.3 Subject term (key word) listing ............................................................................................ 6
6.4 Supersession data............................................................................................................... 6
6.5 Change notations ................................................................................................................ 6
CONCLUDING MATERIAL………………………………………………………………………………………C-1
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MIL–STD–750–2A
w/CHANGE 3
v
CONTENTS
FIGURE TITLE
2017–1
Uniform force distribution
2017–2 Rotational capability
2017–3 Perpendicular force application
2017–4 Die shear strength criteria
2037–1 Minimum bond pull limits
2037–2 Wire loop angle
2037–3 Flat loop wire pull testing
2038–1 Sample apparatus fixture with force measuring gauge
2038–2 Close up view of sample apparatus fixture
2038–3 Condition B
2038–4 Condition C
2038–5 Condition D
2052–1 Typical STU
2068–1 Critical glass and meniscus areas for nontransparent glass, double plug, noncavity diodes
2068–2 Acceptable body glass cracks
2068–3 Unacceptable body glass cracks
2068–4 Acceptable body glass coverage
2068–5 Unacceptable body glass coverage
2068–6 Acceptable depression
2068–7 Unacceptable void
2069–1 Bond dimensions
2069–2 Torn bonds
2069–3 Acceptable and unacceptable voids and excessive pigtails
2069–4 Acceptable and unacceptable bonding material build-up
2069–5 Extraneous bonding material build-up
2069–6 Acceptable and unacceptable excess material
2070–1 Metallization scratches and voids (expanded contact)
2070–2 Cracks and chips
2070–3 Bond dimensions
2070–4 Lifted or torn bonds
2070–5 Mesh geometry
2070–6 Interdigitated geometry
2070–7 Spine geometry
2071–1 Radial cracks extending more than one-half the distance from pin to outer member
2071–2 Circumferential cracks
2071–3 Bubbles in glass exceeding one-third of the sealing area
2071–4 Single bubble or void
2071–5 Two bubbles in a line
2071–6 Interconnecting bubbles
2071–7 Meniscus cracks
2071–8 Chip outs
2071–9 Transparent glass diode
2071–10 Braze separation/delamination
2071–11 Crack in braze metallization
2071–12 Discontinuous braze metallization
2071–13 Ceramic feedthrough visual inspection criteria
2071–14 Rejectable foreign material conditions
2071–15 Plug to terminal interface depicting acceptable filler metal
2071–16 Plug to terminal interface depicting acceptable filler metal
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