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INCH–POUND
AMSC N/A FSC 5961
MIL–STD–750F
w/CHANGE 2
30 November 2016
SUPERSEDING
MIL–STD–750F
w/CHANGE 1
29 April 2013
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
TEST METHODS FOR SEMICONDUCTOR DEVICES
The documentation and process
conversion measures necessary to
comply with this revision shall be
completed by 1 March 2017.
Downloaded from http://www.everyspec.com
MIL–STD–750F
w/CHANGE 2
ii
FOREWORD
1. This test method standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This issue of MIL–STD–750 series establishes uniform test methods for testing the environmental, physical, and
electrical characteristics semiconductor devices.
3. This entire test method standard has been revised. This revision has been issued in six parts; the basic test
method standard (this document) and five numbered parts. This was done in order to provide flexibility in the use and
the updating of the test methods. The six parts are listed as follows:
MIL–STD–750 – Test Methods For Semiconductor Devices.
MIL–STD–750–1 – Environmental Test Methods For Semiconductor Devices.
MIL–STD–750–2 – Mechanical Test Methods For Semiconductor Devices.
MIL–STD–750–3 – Electrical Characteristics Tests for Bipolar, MOSFET, and Gallium Arsenide Transistors.
MIL–STD–750–4 – Electrical Characteristics Tests for Diodes, Microwave Diodes, Thyristors, and Tunnel
Diodes.
MIL–STD–750–5 – High Reliability Space Application Test Methods For Semiconductor Devices.
4. Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Logistics Agency, DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218–3990, or emailed to
750.TestMethods@dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at https://assist.dla.mil.
Downloaded from http://www.everyspec.com
MIL–STD–750F
w/CHANGE 2
iii
SUMMARY OF CHANGE 2 MODIFICATIONS
1. Paragraph 3.1.2 has been added to separate symbols from acronyms used throughout the standard.
2. Paragraphs 3.1.3 through 3.1.3.5 have been added to define terms used throughout the standard.
3. Paragraph 4.2 has been modified to clarify the orientation requirements.
4. The title to 4.3.2.6 has been modified.
5. Figure 1 has been modified to add more views of the types of packages used in MIL–PRF–19500
specification sheets.
6. Figure 2 has been modified to reflect the arrow style used on figure 1.
Paragraph Modification
3.1 Modified.
3.1.1 Modified.
3.1.2 New.
3.1.3 New.
3.1.3.1 New.
3.1.3.2 New.
3.1.3.3 New.
3.1.3.4 New.
3.1.3.5 New.
4.1.1 Modified.
4.1.5 Modified.
4.2 Modified.
4.3.2.5 Modified.
4.3.2.6 Modified.
4.4 Modified.
4.10 Modified.
Figure Modification
Figure 1 Added subfigures 1b, 1c, 1d, 1e, and 1f.
Figure 2 Modified.
Downloaded from http://www.everyspec.com
MIL–STD–750F
w/CHANGE 2
CONTENTS
PARAGRAPH PAGE
iv
FOREWORD ......................................................................................................................................... ii
SUMMARY OF CHANGE 1 MODIFICATIONS ..................................................................................... iii
1.
SCOPE ....................................................................................................................................... 1
1.1 Purpose ................................................................................................................................. 1
1.2 Numbering system ................................................................................................................ 1
1.2.1 Classification of tests ....................................................................................................... 1
1.2.2 Test method revisions ..................................................................................................... 1
1.3 Methods of reference ............................................................................................................ 1
2. APPLICABLE DOCUMENTS ...................................................................................................... 2
2.1 General ................................................................................................................................. 2
2.2 Government documents ........................................................................................................ 2
2.2.1 Specifications, standards, and handbooks ...................................................................... 2
2.3 Non-Government publications ............................................................................................... 2
2.4 Order of precedence ............................................................................................................. 3
3. DEFINITIONS ............................................................................................................................. 3
3.1 Acronyms, symbols, and definitions ...................................................................................... 3
3.1.1 Acronyms used in this standard ....................................................................................... 3
3.1.2 Symbols used in this standard ......................................................................................... 4
3.1.3 Definitions used in this standard ...................................................................................... 4
3.1.3.1 Accuracy .................................................................................................................... 4
3.1.3.2 Acquisition documents ............................................................................................... 4
3.1.3.3 Precision .................................................................................................................... 4
3.1.3.4 Standard reference material ...................................................................................... 4
3.1.3.5 Uncertainty ................................................................................................................. 4
4. GENERAL REQUIREMENTS ..................................................................................................... 5
4.1 Test conditions ...................................................................................................................... 5
4.1.1 Permissible temperature variation in environmental chambers ....................................... 5
4.1.2 Electrical test frequency .................................................................................................. 5
4.1.3 Sinusoidal pulse testing ................................................................................................... 5
4.1.4 Accuracy .......................................................................................................................... 5
4.1.4.1 Control based on uncertainty ..................................................................................... 6
4.1.4.2 Test methods and circuits .......................................................................................... 6
4.1.5 Calibration requirements ................................................................................................. 7
4.2 Identification of orientations, direction of forces applied and major plane for x-sectioning .... 7
4.3 General precautions .............................................................................................................. 9
4.3.1 Transients ........................................................................................................................ 9
4.3.2 Test conditions for electrical measurements ................................................................... 9
4.3.2.1 Thermal resistance measurements (test method series 3100) .................................. 9
4.3.2.2 Low frequency tests (test method series 3200) ......................................................... 10
4.3.2.3 High frequency tests (test method series 3300) ......................................................... 10
4.3.2.4 Electrical characteristics tests for MOS field effect transistors (series 3400) ............. 10
4.3.2.5 Steady-state dc measurements (test method series 4000) ........................................ 10
4.3.2.6 Pulse measurements (test method series 3000 and 4000) ........................................ 10
4.3.2.7 Electrical characteristics tests for microwave diodes (test method series 4100) ........ 10
4.3.3 Test circuits ..................................................................................................................... 11
4.3.3.1 Test method variation ................................................................................................ 11
4.3.4 Soldering ......................................................................................................................... 11
Downloaded from http://www.everyspec.com
MIL–STD–750F
w/CHANGE 2
CONTENTS
PARAGRAPH PAGE
v
4.3.5
Order of connection of leads ........................................................................................... 11
4.3.6 Radiation precautions ...................................................................................................... 11
4.3.7 Handling precautions ....................................................................................................... 11
4.3.7.1 UHF and microwave devices ..................................................................................... 11
4.3.7.2 Electrostatic discharge sensitive devices ................................................................... 11
4.4 Continuity verification of burn-in and life tests ....................................................................... 11
4.4.1 Bias interruption .................................................................................................................... 12
4.5 Requirements for high temperature reverse bias (HTRB) and burn-in .................................. 12
4.6 Bias requirements ................................................................................................................. 13
4.7 Destructive tests .................................................................................................................... 13
4.8 Non–destructive tests ............................................................................................................ 14
4.9 Laboratory suitability ............................................................................................................. 15
4.10 Recycled, recovered, or environmentally preferable materials .............................................. 15
5. DETAILED REQUIREMENTS ..................................................................................................... 15
5.1 Organization .......................................................................................................................... 15
5.2 Arrangement and contents .................................................................................................... 15
5.3 References to MIL–STD–750 ................................................................................................ 15
6. NOTES ....................................................................................................................................... 15
6.1 Intended use ......................................................................................................................... 15
6.2 International standardization agreement ............................................................................... 15
6.3 Subject term (key word) listing .............................................................................................. 16
6.4 Changes from previous issue ................................................................................................ 16
CONCLUDING MATERIAL ................................................................................................................... 16
FIGURE TITLE PAGE
1.
Orientation of non-cylindrical semiconductor device ................................................................. 7
2. Orientation of cylindrical semiconductor device ........................................................................ 9
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