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Decoder

Encoder

RESET

IR_RXD

16XCLK

U_TXD

U_RXD

IR_TXD

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TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

TIR1000x Standalone IrDA™ Encoder and Decoder

1 Features 3 Description

The TIR1000x serial infrared (SIR) encoder and

• Adds Infrared (IR) Port to Universal Asynchronous

decoder is a CMOS device that encodes and

Receiver Transmitter (UART)

decodes bit data in conformance with the IrDA

• Compatible With Infrared Data Association

specification.

(IrDA™) and Hewlett Packard Serial Infrared

A transceiver device is needed to interface to the

(HPSIR)

photo-sensitive diode (PIN) and the light emitting

• Provides 1200-bps to 115-kbps Data Rate

diode (LED). A UART is needed to interface to the

• Operates from 2.7 V to 5.5 V

serial data lines.

• Provides Simple Interface With UART

Device Information

(1)

• Decodes Negative or Positive Pulses

PART NUMBER PACKAGE BODY SIZE (NOM)

• Available in Two 8-Terminal Plastic Small Outline

TSSOP (8) 3.00 mm × 4.40 mm

Packages (PSOP)

TIR1000x

SO (8) 6.20 mm × 5.30 mm

– PS Package Has Slightly Larger Dimensions

(1) For all available packages, see the orderable addendum at

Than PW Package

the end of the data sheet.

2 Applications

• UART Interfacing

• Infrared Data Communications

Functional Block Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

Table of Contents

7.3 Feature Description................................................... 6

1 Features.................................................................. 1

7.4 Device Functional Modes.......................................... 7

2 Applications ........................................................... 1

8 Application and Implementation .......................... 9

3 Description ............................................................. 1

8.1 Application Information.............................................. 9

4 Revision History..................................................... 2

8.2 Typical Application ................................................... 9

5 Pin Configuration and Functions......................... 3

9 Power Supply Recommendations...................... 11

6 Specifications......................................................... 3

10 Layout................................................................... 12

6.1 Absolute Maximum Ratings ...................................... 3

10.1 Layout Guidelines ................................................. 12

6.2 ESD Ratings ............................................................ 4

10.2 Layout Example .................................................... 12

6.3 Recommended Operating Conditions....................... 4

11 Device and Documentation Support ................. 13

6.4 Thermal Information.................................................. 4

11.1 Community Resources.......................................... 13

6.5 Electrical Characteristics........................................... 4

11.2 Trademarks........................................................... 13

6.6 Switching Characteristics.......................................... 5

11.3 Electrostatic Discharge Caution............................ 13

7 Detailed Description.............................................. 6

11.4 Glossary................................................................ 13

7.1 Overview ................................................................... 6

12 Mechanical, Packaging, and Orderable

7.2 Functional Block Diagram ......................................... 6

Information ........................................................... 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (July 1999) to Revision G Page

• Added Applications, Pin Configuration and Functions section, ESD Ratings table, Typical Characteristics section,

Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ..................................................................................................................... 1

• Added PS package drawing ................................................................................................................................................... 3

• Changed t

output rise time FROM: 1.3 ns TO: 23.8 ns in Switching Characteristics ........................................................... 5

• Changed t

output fall time FROM: 1.8 ns TO: 9.2 ns in Switching Characteristics .............................................................. 5

Product Folder Links: TIR1000

16XCLK

U_TXD

U_RXD

GND RESET

IR_RXD

IR_TXD

16XCLK

U_TXD

U_RXD

GND RESET

IR_RXD

IR_TXD

TIR1000, TIR1000I

www.ti.com

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

5 Pin Configuration and Functions

PS Package

PW Package

8-Pin SO

8-Pin TSSOP

Top View

Pin Functions

I/O DESCRIPTION

NAME NO.

Clock signal. 16XCLK must be set to 16 times the baud rate. The highest baud rate for IrDA is 115.2 kbps

16XCLK 1 I

for which the clock frequency equals 1.843 MHz (this terminal is tied to the BAUDOUT of a UART).

GND 4 — Ground

Infrared receiver data. IR_RXD is an IrDA-SIR-modulated input from an optoelectronics transceiver whose

IR_RXD 6 I

input pulses should be 3/16 of the baud rate period.

IR_TXD 7 O Infrared transmitter data. IR_TXD is an IrDA-SIR-modulated output to an optoelectronics transceiver.

Active high reset. RESET initializes an IrDA-SIR-decode/encode state machine (this terminal is tied to a

RESET 5 I

UART reset line).

Receiver data. U_RXD is decoded (demodulated) data from IR_RXD according to the IrDA specification (this

U_RXD 3 O

terminal is tied to SIN of a UART).

Transmitter data. U_TXD is encoded (modulated) data and output data as IR_TXD (this terminal is tied to

U_TXD 2 I

SOUT from a UART).

8 — Supply voltage

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage

(2)

–0.5 6 V

Input voltage at any input –0.5 V

+ 0.5 V

Output voltage –0.5 V

+ 0.5 V

TIR1000 0 °C

Operating free-air temperature range

TIR1000I –40 85 °C

Case temperature for 10 seconds SO package 260 °C

stg

Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage levels are with respect to GND.

Product Folder Links: TIR1000

TIR1000, TIR1000I

SLLS228G –DECEMBER 1995–REVISED AUGUST 2015

www.ti.com

6.2 ESD Ratings

VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

(ESD)

Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22-

±900

C101

(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

LOW VOLTAGE (3-V NOMINAL)

Supply voltage 2.7 3 3.3 V

High-level input voltage 0.7 V

Low-level input voltage 0.2 V

TIR1000 0 70

Operating free-air

°C

temperature

TIR1000I –40 85

STANDARD VOLTAGE (5-V NOMINAL)

Supply voltage 4.5 5 5.5 V

High-level input voltage 0.7 V

Low-level input voltage 0.2 V

TIR1000 0 70

Operating free-air

°C

temperature

TIR1000I –40 85

6.4 Thermal Information

TIR1000

THERMAL METRIC

(1)

PS (SO), PW (TSSOP) UNIT

8 PINS

θJA

Junction-to-ambient thermal resistance 179.8 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 63.4 °C/W

θJB

Junction-to-board thermal resistance 108.4 °C/W

Junction-to-top characterization parameter 7.0 °C/W

Junction-to-board characterization parameter 106.7 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

= – 4 mA V

= 5 V V

– 0.8

High-level output voltage V

= – 1.8 mA V

= 3 V V

– 0.55

= +4 mA V

= 5 V 0.5

Low-level output voltage V

= +1.8 mA V

= 3 V 0.5

II Input current V

= 0 to V

All other pins floating ±3 µA

= 5.25 V T

= 25°C

Supply current All inputs at 0.2 V 16XCLK at 2 MHz 1 mA

No load on outputs

i(16XCLK)

Clock input capacitance 5 pF

(16XCLK)

Clock frequency 2 MHz

Product Folder Links: TIR1000

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