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I/O扩展器
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PCA9554A 具有中断输出和配置寄存器的远程 8 位 I2C 和 SMBus I/O 扩展器
1 特性
• I
2
C 至并行端口扩展器
• 开漏电路低电平有效中断输出
• 2.3 V 至 5.5V 的工作电源电压范围
• 耐受 5V 电压的 I/O
• 400kHz 快速 I
2
C 总线
• 3 个硬件地址引脚可在 I
2
C/SMBus 上支持最多 8 个
器件
• 输入/输出配置寄存器
• 极性反转寄存器
• 内部加电复位
• 所用通道在加电时被配置为输入
• 加电时无毛刺脉冲
• 针对直接驱动 LED 的具有高电流驱动最大能力的锁
存输出
• 锁断性能超过 100mA,符合 JESD 78 II 类规范的
要求)
• ESD 保护性能超过 JESD 22 规范要求
– 2000V 人体放电模型 (A114-A)
– 200V 机器放电模型 (A115-A)
– 1000V 带电器件模型 (C101)
2 说明
这个用于两线双向总线 (I
2
C) 的 8 位扩展器设计用于
2.3V 至 5.5V V
CC
运行。通过 I
2
C 接口 [串行时钟
(SCL),串行数据 (SDA)],它为大多数微控制器系列产
品提供通用远程 I/O 扩展。
PCA9554A 包含一个 8 位配置(输入或输出选择)、
输入、输出和极性反转(高电平有效或低电平有效)寄
存器。加电时,I/O 被配置为到 V
CC
的弱上拉输入。但
是,系统主控制器可以通过写入 I/O 配置位将 I/O 启用
为输入或输出。每一个输入或者输出的数据被保存在相
应的输入或者输出寄存器内。输入端口寄存器的极性可
借助极性反转寄存器进行转换。所有寄存器都可由系统
主控器读取。
发生超时或其他不当操作时,系统主控器可通过使用上
电复位功能,将寄存器置于其默认状况并初始化 I2C/
SMBus 状态机,从而复位 PCA9554A。
器件信息
器件型号
封装
(1)
封装尺寸(标称值)
PCA9554A
DB (SSOP) (16) 6.20mm × 5.30mm
DBQ (VQFN) (16) 4.90mm × 3.90mm
DGV (TSSOP) (16) 3.60mm × 4.40mm
DW (SOIC) 10.3mm x 7.50mm
PW (TSSOP) 5.00mm x 4.40mm
RGT (VQFN) 3.00mm x 3.00mm
RGV (VQFN) 4.00mm x 4.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
DB, DBQ, DGV, DW,
OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
A2
P0
P1
P2
P3
GND
V
CC
SDA
SCL
INT
P7
P6
P5
P4
RGV PACKAGE
(TOP VIEW)
16
6 8
2
10 P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
RGT PACKAGE
(TOP VIEW)
16
6 8
2
10
P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
PCA9554A
ZHCSNM0F – SEPTEMBER 2006 – REVISED MARCH 2021
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SCPS127
Table of Contents
1 特性................................................................................... 1
2 说明................................................................................... 1
3 Revision History.............................................................. 2
4 Description (Continued)..................................................3
5 Pin Configuration And Functions.................................. 4
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................6
6.6 I
2
C Interface Timing Requirements.............................7
6.7 Switching Characteristics............................................7
6.8 Typical Characteristics................................................ 8
7 Parameter Measurement Information.......................... 10
8 Detailed Description......................................................13
8.1 Functional Block Diagram......................................... 13
8.2 Device Functional Modes..........................................14
8.3 Programming............................................................ 15
9 Application Information Disclaimer............................. 21
9.1 Application Information............................................. 21
10 Power Supply Recommendations..............................23
10.1 Power-On Reset Requirements.............................. 23
11 Device and Documentation Support..........................25
11.1 支持资源..................................................................25
11.2 Trademarks............................................................. 25
11.3 静电放电警告...........................................................25
11.4 术语表..................................................................... 25
12 Mechanical, Packaging, and Orderable
Information.................................................................... 25
3 Revision History
Changes from Revision E (May 2014) to Revision F (March 2021) Page
• 更改了
器件信息
表.............................................................................................................................................. 1
• Moved the Storage temperature range from the Handling Ratings table to the Absolute Maximum Ratings
table.................................................................................................................................................................... 5
• Moved the Package thermal impedance to the Thermal Information table........................................................ 5
• Changed the V
IH
High-level input voltage (SDL, SDA) Max value From: 5.5 V To: V
CC
in the Recommended
Operating Conditions ......................................................................................................................................... 5
• Changed the V
IL
Low-level input voltage (A2–A0, P7–P0) Max value From: 0.8 V To: 0.3 x V
CC
in the
Recommended Operating Conditions ................................................................................................................5
• Added the Thermal Information table................................................................................................................. 5
• Changed the V
PORR
row in the Electrical Characteristics .................................................................................. 6
• Added the V
PORF
row in the Electrical Characteristics .......................................................................................6
• Changed the I
CC
Standby mode values in the Electrical Characteristics ...........................................................6
• Changed the C
i
SCL Max value From: 5 pF To: 8 pF in the Electrical Characteristics ......................................6
• Changed the C
io
SDA Max value From: 6.5 pF To: 9.5 pF in the Electrical Characteristics ..............................6
• Changed the t
pv
Output data valid MAX values From: 200 ns To 350 ns in the Switching Characteristics ....... 7
• Changed the Typical Characteristics graphs...................................................................................................... 8
• Changed the Power Supply Recommendations .............................................................................................. 23
Changes from Revision D (August 2008) to Revision E (May 2014) Page
• Added Interrupt Errata section. ........................................................................................................................15
• Added the Power-On Reset Errata section ......................................................................................................23
PCA9554A
ZHCSNM0F – SEPTEMBER 2006 – REVISED MARCH 2021
www.ti.com.cn
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: PCA9554A
4 Description (Continued)
The PCA9554A open-drain interrupt ( INT) output is activated when any input state differs from its corresponding
Input Port register state and is used to indicate to the system master that an input state has changed.
INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the
remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via
the I
2
C bus. Thus, the PCA9554A can remain a simple slave device.
The device's outputs (latched) have high-current drive capability for directly driving LEDs and low current
consumption.
Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I
2
C address and allow up to eight
devices to share the same I
2
C bus or SMBus.
The PCA9554A is pin-to-pin and I
2
C address compatible with the PCF8574A. However, software changes are
required, due to the enhancements in the PCA9554A over the PCF8574A.
The PCA9554A and PCA9554 are identical except for their fixed I
2
C address. This allows for up to 16 of these
devices (8 of each) on the same I
2
C/SMBus.
www.ti.com.cn
PCA9554A
ZHCSNM0F – SEPTEMBER 2006 – REVISED MARCH 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: PCA9554A
5 Pin Configuration And Functions
DB, DBQ, DGV, DW,
OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
A2
P0
P1
P2
P3
GND
V
CC
SDA
SCL
INT
P7
P6
P5
P4
RGV PACKAGE
(TOP VIEW)
16
6 8
2
10 P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
RGT PACKAGE
(TOP VIEW)
16
6 8
2
10
P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
表 5-1. Pin Functions
PIN
DESCRIPTION
NAME
QSOP (DBQ)
SOIC (DW),
SSOP (DB),
TSSOP (PW), AND
TVSOP (DGV)
QFN (RGT AND
RGV)
A0 1 15 Address input. Connect directly to V
CC
or ground.
A1 2 16 Address input. Connect directly to V
CC
or ground.
A2 3 1 Address input. Connect directly to V
CC
or ground.
P0 4 2 P-port input/output. Push-pull design structure.
P1 5 3 P-port input/output. Push-pull design structure.
P2 6 4 P-port input/output. Push-pull design structure.
P3 7 5 P-port input/output. Push-pull design structure.
GND 8 6 Ground
P4 9 7 P-port input/output. Push-pull design structure.
P5 10 8 P-port input/output. Push-pull design structure.
P6 11 9 P-port input/output. Push-pull design structure.
P7 12 10 P-port input/output. Push-pull design structure.
INT 13 11 Interrupt output. Connect to V
CC
through a pullup resistor.
SCL 14 12 Serial clock bus. Connect to V
CC
through a pullup resistor.
SDA 15 13 Serial data bus. Connect to V
CC
through a pullup resistor.
V
CC
16 14 Supply voltage
PCA9554A
ZHCSNM0F – SEPTEMBER 2006 – REVISED MARCH 2021
www.ti.com.cn
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: PCA9554A
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage range
–0.5
6 V
V
I
Input voltage range
(2)
–0.5
6 V
V
O
Output voltage range
(2)
–0.5
6 V
I
IK
Input clamp current V
I
< 0
–20
mA
I
OK
Output clamp current V
O
< 0
–20
mA
I
IOK
Input/output clamp current V
O
< 0 or V
O
> V
CC
±20 mA
I
OL
Continuous output low current V
O
= 0 to V
CC
50 mA
I
OH
Continuous output high current V
O
= 0 to V
CC
–50
mA
I
CC
Continuous current through GND
–250
mA
Continuous current through V
CC
160
T
stg
Storage temperature range
–65
150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
MIN MAX UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins
(1)
0 2000
V
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins
(2)
0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN MAX UNIT
V
CC
Supply voltage 2.3 5.5 V
V
IH
High-level input voltage
SCL, SDA 0.7 × V
CC
V
CC
V
A2–A0, P7–P0
2 5.5
V
IL
Low-level input voltage
SCL, SDA
–0.5
0.3 × V
CC
V
A2–A0, P7–P0 –0.5
0.3 × V
CC
I
OH
High-level output current
P7–P0 –10
mA
I
OL
Low-level output current
P7–P0
25 mA
T
A
Operating free-air temperature
–40
85 °C
6.4 Thermal Information
THERMAL METRIC
(1)
PCA9554A
UNIT
DB
(SSOP)
DBQ
(SSOP)
DGV
(TVSOP)
DW
(SOIC)
PW
(TSSOP)
RGT
(TSSOP)
RGV
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 113.2 121.7 120 84.7 122 63.2 51 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
www.ti.com.cn
PCA9554A
ZHCSNM0F – SEPTEMBER 2006 – REVISED MARCH 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: PCA9554A
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