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GND

Input 1 Signal

Output 1

Differential Pair

Input 2 Signal

Output 2

Differential Pair

Output 4

Differential Pair

Input 4 Signal

Output 3

Differential Pair

Input 3 Signal

Active Low Enable Signal

0.1 PF

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

AM26C31

SLLS103O –DECEMBER 1990–REVISED JUNE 2016

AM26C31 Quadruple Differential Line Driver

1 Features

• Meets or Exceeds the Requirements of TIA/EIA-

422-B and ITU Recommendation V.11

• Low Power, I

= 100 μA Typical

• Operates From a Single 5-V Supply

• High Speed, t

PLH

= t

PHL

= 7 ns Typical

• Low Pulse Distortion, t

sk(p)

= 0.5 ns Typical

• High Output Impedance in Power-Off Conditions

• Improved Replacement for AM26LS31 Device

• Available in Q-Temp Automotive

– High-Reliability Automotive Applications

– Configuration Control and Print Support

– Qualification to Automotive Standards

• On Products Compliant to MIL-PRF-38535, All

Parameters Are Tested Unless Otherwise Noted.

On All Other Products, Production Processing

Does Not Necessarily Include Testing of All

Parameters.

2 Applications

• Chemical and Gas Sensors

• Field Transmitters: Temperature Sensors and

Pressure Sensors

• Military: Radars and Sonars

• Motor Control: Brushless DC and Brushed DC

• Military and Avionics Imaging

• Temperature Sensors and Controllers Using

Modbus

3 Description

The AM26C31 device is a differential line driver with

complementary outputs, designed to meet the

requirements of TIA/EIA-422-B and ITU (formerly

CCITT). The 3-state outputs have high-current

capability for driving balanced lines, such as twisted-

pair or parallel-wire transmission lines, and they

provide the high-impedance state in the power-off

condition. The enable functions are common to all

four drivers and offer the choice of an active-high (G)

or active-low (G) enable input. BiCMOS circuitry

reduces power consumption without sacrificing

speed.

The AM26C31C device is characterized for operation

from 0°C to 70°C, the AM26C31I device is

characterized for operation from –40°C to 85°C, the

AM26C31Q device is characterized for operation over

the automotive temperature range of –40°C to 125°C,

and the AM26C31M device is characterized for

operation over the full military temperature range of

–55°C to 125°C.

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

AM26C31J CDIP (16) 19.56 mm × 6.92 mm

AM26C31N PDIP (16) 19.30 mm × 6.35 mm

AM26C31NS SO (16) 10.30 mm × 5.30 mm

AM26C31W CFP (16) 10.30 mm × 6.73 mm

AM26C31D SOIC (16) 9.90 mm × 3.91 mm

AM26C31DB SSOP (16) 6.20 mm × 5.30 mm

AM26C31PW TSSOP (16) 5.00 mm × 4.40 mm

AM26C31FK LCCC (20) 8.89 mm × 8.89 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Common Application Diagram

AM26C31

SLLS103O –DECEMBER 1990–REVISED JUNE 2016

www.ti.com

Product Folder Links: AM26C31

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ..................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics: AM26C31C and

AM26C31I .................................................................. 5

6.6 Electrical Characteristics: AM26C31Q and

AM26C31M ................................................................ 6

6.7 Switching Characteristics: AM26C31C and

AM26C31I .................................................................. 6

6.8 Switching Characteristics: AM26C31Q and

AM26C31M ................................................................ 7

6.9 Typical Characteristics.............................................. 7

7 Parameter Measurement Information .................. 8

8 Detailed Description............................................ 10

8.1 Overview ................................................................. 10

8.2 Functional Block Diagrams ..................................... 10

8.3 Feature Description................................................. 11

8.4 Device Functional Modes........................................ 11

9 Application and Implementation ........................ 12

9.1 Application Information............................................ 12

9.2 Typical Application ................................................. 12

10 Power Supply Recommendations ..................... 13

11 Layout................................................................... 14

11.1 Layout Guidelines ................................................. 14

11.2 Layout Example .................................................... 14

12 Device and Documentation Support ................. 15

12.1 Receiving Notification of Documentation Updates 15

12.2 Community Resources.......................................... 15

12.3 Trademarks ........................................................... 15

12.4 Electrostatic Discharge Caution............................ 15

12.5 Glossary ................................................................ 15

13 Mechanical, Packaging, and Orderable

Information ........................................................... 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision N (October 2011) to Revision O Page

• Updated the Features section and added the Applications section, the Device Information table, ESD Ratings table,

Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section. ..................................................................................................................... 1

• Deleted Ordering Information table, see POA at the end of the data sheet........................................................................... 1

• Changed Thermal Information table....................................................................................................................................... 5

Changes from Revision M (June 2008) to Revision N Page

• Changed units to mA from µA to fix units typo....................................................................................................................... 4

AM26C31

www.ti.com

SLLS103O –DECEMBER 1990–REVISED JUNE 2016

Product Folder Links: AM26C31

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2) Maximum power dissipation is a function of T

J(max

), R

θJA

, and T

. The maximum allowable power dissipation at any allowable ambient

temperature is P

= (T

J(max)

– T

) / R

θJA

. Operating at the absolute maximum T

of 150°C can affect reliability.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

(4) Modelling assumption: MIL-STD-883 for R

θJC(top)

and R

θJC(bot)

JESD51 for R

θJB

6.4 Thermal Information

THERMAL METRIC

(1)

AM26C31

UNIT

(SOIC)

(SSOP)

(TSSOP)

(SO)

(PDIP)

(CDIP)

(CFP)

(LCCC)

16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS

θJA

Junction-to-ambient

thermal resistance

(2)(3)

75.3 93.1 102.1 75.6 44.5 — — — °C/W

θJC(top)

Junction-to-case (top)

thermal resistance

35.6 43.8 37.2 32.6 31.1 39.3

(4)

58.9

(4)

37.1

(4)

°C/W

θJB

Junction-to-board

thermal resistance

32.5 43.6 47.0 36.4 24.5 56.4

(4)

109.3

(4)

36.2

(4)

°C/W

Junction-to-top

characterization

parameter

7.1 9.6 2.8 5.7 15.4 — — — °C/W

Junction-to-board

characterization

parameter

32.3 43.1 46.4 36.0 24.4 — — — °C/W

θJC(bot)

Junction-to-case

(bottom) thermal

resistance

n/a n/a n/a n/a n/a 12.0

(4)

5.7

(4)

4.3

(4)

°C/W

(1) All typical values are at V

= 5 V and T

= 25°C.

(2) Δ|V

| and Δ|V

| are the changes in magnitude of V

and V

, respectively, that occur when the input is changed from a high level to

a low level.

(3) This parameter is measured per input. All other inputs are at 0 or 5 V.

6.5 Electrical Characteristics: AM26C31C and AM26C31I

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

(1)

MAX UNIT

High-level output voltage I

= –20 mA 2.4 3.4 V

Low-level output voltage I

= 20 mA 0.2 0.4 V

Differential output voltage magnitude R

= 100 Ω, see Figure 2 2 3.1 V

Δ|V

| Change in magnitude of differential output voltage

(2)

= 100 Ω, see Figure 2 ±0.4 V

Common-mode output voltage R

= 100 Ω, see Figure 2 3 V

Δ|V

| Change in magnitude of common-mode output voltage

(2)

= 100 Ω, see Figure 2 ±0.4 V

Input current V

= V

or GND ±1 μA

O(off)

Driver output current with power off V

= 0

= 6 V 100

μA

= –0.25 V –100

Driver output short-circuit current V

= 0 –30 –150 mA

High-impedance off-state output current

= 2.5 V 20

μA

= 0.5 V –20

Quiescent supply current I

= 0

= 0 or 5 V 100 μA

= 2.4 V or 0.5 V

(3)

1.5 3 mA

Input capacitance 6 pF

剩余32页未读，继续阅读

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