没有合适的资源?快使用搜索试试~ 我知道了~
资源推荐
资源详情
资源评论














4Y
3Y
2Y
1Y
4B
4A
3B
3A
2B
2A
1B
1A
G
G
4
12
2
1
6
7
10
9
14
15
3
5
11
13
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLS104
AM26C32
ZHCSIZ2L –DECEMBER 1990–REVISED OCTOBER 2018
AM26C32 四四路路差差动动线线路路接接收收器器
1
1 特特性性
1
• 符合或超出了 ANSI TIA/EIA-422-B、TIA/EIA-423-
B 和 ITU 建议 V.10 与 V.11 的要求。
• 低功耗,I
CC
= 10mA(典型值)
• 具有 ±200mV 灵敏度的 ±7V 共模范围
• 输入迟滞:60mV(典型值)
• t
pd
= 17ns(典型值)
• 采用 5V 单电源供电
• 三态输出
• 输入失效防护电路
• 是 AM26LS32 器件的改良替代品
• 可用于 Q-Temp 汽车
2 应应用用
• 高可靠性汽车 应用
• 工厂自动化
• ATM 和点钞机
• 智能电网
• 交流和伺服电机驱动器
3 说说明明
AM26C32 器件是一款四路差动线路接收器,用于
平衡或不平衡的数字数据传输。四个接收器均具有
使能功能,该功能提供了两种可选输入:高电平有
效输入和低电平有效输入。通过三态输出,该器件
可直接连接至总线组织式系统。失效防护设计规定
当输入处于开路状态时,输出始终为高电平。
AM26C32 器件采用 BiCMOS 工艺制造,该工艺
有效集成了双极晶体管和 CMOS 晶体管。通过该
工艺,即可实现双极晶体管的耐高电压大电流特性
又可实现 CMOS 的低功耗特性,器件功耗降低至
AM26LS32 标准器件的五分之一左右,同时仍可
保持交流和直流性能。
器器件件信信息息
(1)
器器件件编编号号 封封装装 封封装装尺尺寸寸((标标称称值值))
AM26C32N PDIP (16) 19.30mm x 6.35mm
AM26C32NS SO (16) 10.20mm × 5.30mm
AM26C32D SOIC (16) 9.90mm × 3.90mm
AM26C32PW TSSOP (16) 5.00mm × 4.40mm
AM26C32J
陶瓷双列直插封装
(CDIP) (16)
21.34mm × 6.92mm
AM26C32W CFP (16) 10.16mm × 6.73mm
AM26C32FK LCCC (20) 8.90mm × 8.90mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
简简化化原原理理图图

2
AM26C32
ZHCSIZ2L –DECEMBER 1990–REVISED OCTOBER 2018
www.ti.com.cn
Copyright © 1990–2018, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 5
6.7 Typical Characteristics.............................................. 6
7 Parameter Measurement Information .................. 7
8 Detailed Description.............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 9
9 Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application ................................................. 10
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 12
11.1 Layout Guidelines ................................................. 12
11.2 Layout Example .................................................... 12
12 器器件件和和文文档档支支持持 ..................................................... 13
12.1 接收文档更新通知 ................................................. 13
12.2 社区资源................................................................ 13
12.3 商标 ....................................................................... 13
12.4 静电放电警告......................................................... 13
12.5 术语表 ................................................................... 13
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 13
4 修修订订历历史史记记录录
Changes from Revision K (June 2015) to Revision L Page
• Changed I
I
unit value From: µA To: mA in the Electrical Characteristics table...................................................................... 5
Changes from Revision J (February 2014) to Revision K Page
• 添加了
引脚配置和功能
部分、ESD
额定值
表、
特性 说明
部分、
器件功能模式
、
应用和实施
部分、
电源建议
部分、
布
局
部分、
器件和文档支持
部分以及
机械、封装和可订购信息
部分 ........................................................................................... 1
Changes from Revision I (September 2004) to Revision J Page
• 将文档更新为新的 TI 产品说明书格式 - 无规格变化 ............................................................................................................... 1
• 删除了
订购信息
表。 ............................................................................................................................................................... 1
• 已更新
特性
.............................................................................................................................................................................. 1
• Added ESD Warning .............................................................................................................................................................. 3

3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4A
4Y
NC
G
3Y
1Y
G
NC
2Y
2A
1A
1B
NC
3B
3A
4B
2B
GND
NC
CC
V
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
1A
1Y
G
2Y
2A
2B
GND
V
CC
4B
4A
4Y
G
3Y
3A
3B
3
AM26C32
www.ti.com.cn
ZHCSIZ2L –DECEMBER 1990 –REVISED OCTOBER 2018
Copyright © 1990–2018, Texas Instruments Incorporated
5 Pin Configuration and Functions
D, N, NS, PW, J or W Package
16-Pin SOIC, PDIP, SO, TSSOP, CDIP, or CFP
Top View
FK Package
20-Pin LCCC
Top View
(1) NC – no internal connection.
Pin Functions
PIN
I/O DESCRIPTION
NAME LCCC
SOIC, PDIP, SO,
TSSOP, CFP, or CDIP
1A 3 2 I RS422/RS485 differential input (noninverting)
1B 2 1 I RS422/RS485 differential input (inverting)
1Y 4 3 O Logic level output
2A 8 6 I RS422/RS485 differential input (noninverting)
2B 9 7 I RS422/RS485 differential input (inverting)
2Y 7 5 O Logic level output
3A 13 10 I RS422/RS485 differential input (noninverting)
3B 12 9 I RS422/RS485 differential input (inverting)
3Y 14 11 O Logic level output
4A 18 14 I RS422/RS485 differential input (noninverting)
4B 19 15 I RS422/RS485 differential input (inverting)
4Y 17 13 O Logic level output
G 5 4 I Active-high select
G 15 12 I Active-low select
GND 10 8 — Ground
NC
(1)
1
— — Do not connect
6
11
16
V
CC
20 16 — Power Supply

4
AM26C32
ZHCSIZ2L –DECEMBER 1990–REVISED OCTOBER 2018
www.ti.com.cn
Copyright © 1990–2018, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage
(2)
7 V
V
I
Input voltage
A or B inputs –11 14
V
G or G inputs –0.5 V
CC
+ 0.5
V
ID
Differential input voltage –14 14 V
V
O
Output voltage –0.5 V
CC
+ 0.5 V
I
O
Output current ±25 mA
T
stg
Storage temperature -65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±3000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±2000
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 V
V
IH
High-level input voltage 2 V
cc
V
V
IL
Low-level input voltage 0 0.8 V
V
IC
Common-mode input voltage -7 +7 V
I
OH
High-level output current –6 mA
I
OL
Low-level output current 6 mA
T
A
Operating free-air temperature
AM26C32C 0 70
°C
AM26C32I –40 85
AM26C32Q –40 125
AM26C32M –55 125
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
AM26C32
UNITD (SOIC) N (PDIP) NS (SO) PW (TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 73 67 64 108 °C/W

5
AM26C32
www.ti.com.cn
ZHCSIZ2L –DECEMBER 1990 –REVISED OCTOBER 2018
Copyright © 1990–2018, Texas Instruments Incorporated
(1) All typical values are at V
CC
= 5 V, V
IC
= 0, and T
A
= 25°C.
(2) The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-
mode input voltage.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
IT+
Differential input high-threshold
voltage
V
O
= V
OH(min)
, I
OH
= –440
µA
V
IC
= –7 V to 7 V 0.2
V
V
IC
= 0 V to 5.5 V 0.1
V
IT–
Differential input low-threshold
voltage
V
O
= 0.45 V, I
OL
= 8 mA
V
IC
= –7 V to 7 V –0.2
(2)
V
V
IC
= 0 V to 5.5 V –0.1
(2)
V
hys
Hysteresis voltage (V
IT+
– V
IT−
) 60 mV
V
IK
Enable input clamp voltage V
CC
= 4.5 V, I
I
= –18 mA –1.5 V
V
OH
High-level output voltage V
ID
= 200 mV, I
OH
= –6 mA 3.8 V
V
OL
Low-level output voltage V
ID
= –200 mV, I
OL
= 6 mA 0.2 0.3 V
I
OZ
OFF-state (high-impedance state)
output current
V
O
= V
CC
or GND ±0.5 ±5 µA
I
I
Line input current
V
I
= 10 V, Other input at 0 V 1.5 mA
V
I
= –10 V, Other input at 0 V –2.5 mA
I
IH
High-level enable current V
I
= 2.7 V 20 μA
I
IL
Low-level enable current V
I
= 0.4 V –100 μA
r
i
Input resistance One input to ground 12 17 kΩ
I
CC
Quiescent supply current V
CC
= 5.5 V 10 15 mA
(1) All typical values are at V
CC
= 5 V, T
A
= 25°C.
6.6 Switching Characteristics
over operating free-air temperature range, C
L
= 50 pF (unless otherwise noted)
PARAMETER TEST CONDITIONS
AM26C32C
AM26C32I
AM26C32Q
AM26C32M
UNIT
MIN TYP
(1)
MAX MIN TYP
(1)
MAX
t
PLH
Propagation delay time,
low- to high-level
output
See Figure 2
9 17 27 9 17 27 ns
t
PHL
Propagation delay time,
high- to low-level
output
9 17 27 9 17 27 ns
t
TLH
Output transition time,
low- to high-level
output
See Figure 2
4 9 4 10 ns
t
THL
Output transition time,
high- to low-level
output
4 9 4 9 ns
t
PZH
Output enable time to
high-level
See Figure 3
13 22 13 22 ns
t
PZL
Output enable time to
low-level
13 22 13 22 ns
t
PHZ
Output disable time
from high-level
See Figure 3
13 22 13 26 ns
t
PLZ
Output disable time
from low-level
13 22 13 25 ns
剩余30页未读,继续阅读
资源评论

不觉明了
- 粉丝: 701
- 资源: 4046

上传资源 快速赚钱
我的内容管理 收起
我的资源 快来上传第一个资源
我的收益
登录查看自己的收益我的积分 登录查看自己的积分
我的C币 登录后查看C币余额
我的收藏
我的下载
下载帮助

会员权益专享
最新资源
- 脑电功能连接性分析工具包
- 22年开始整理从17年陆续收集的github源码链接,整理成Excel文档 此为第10个文档
- 22年开始整理从17年陆续收集的github源码链接,整理成Excel文档 此为第9个文档
- 【计算机专业VB-毕业设计100套之】VB健身中心会员管理系统(源代码+系统+开题报告+答辩PPT+中英文翻译)
- armarmarmarmarm
- 研究生人工智能机器学习PPT
- 【计算机专业VB-毕业设计100套之】VB计算机自动出卷系统(开题报告+外文翻译+源程序+可执行程序+论文正文+答辩ppt)
- MACMidjourney必备Discord
- 22年开始整理从17年陆续收集的github源码链接,整理成Excel文档 此为第8个文档
- 【计算机专业VB-毕业设计100套之】vb家庭财务管理系统设计(论文+源代码+英文文献)
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈



安全验证
文档复制为VIP权益,开通VIP直接复制
