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TLV320AIC3262
ZHCSE78A –DECEMBER 2011–REVISED SEPTEMBER 2015
www.ti.com.cn
版权 © 2011–2015, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用范范围围................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 说说明明 ((续续)).............................................................. 3
6 Device Comparison Table..................................... 4
7 Pin Configuration and Functions......................... 5
8 Specifications....................................................... 12
8.1 Absolute Maximum Ratings .................................... 12
8.2 ESD Ratings............................................................ 12
8.3 Recommended Operating Conditions..................... 12
8.4 Thermal Information................................................ 13
8.5 Electrical Characteristics, SAR ADC....................... 14
8.6 Electrical Characteristics, ADC ............................... 15
8.7 Electrical Characteristics, Bypass Outputs ............. 17
8.8 Electrical Characteristics, Microphone Interface..... 18
8.9 Electrical Characteristics, Audio DAC Outputs ....... 19
8.10 Electrical Characteristics, Class-D Outputs .......... 22
8.11 Electrical Characteristics, Miscellaneous.............. 23
8.12 Electrical Characteristics, Logic Levels................. 23
8.13 I
2
S/LJF/RJF Timing in Master Mode (see
Figure 2)................................................................... 24
8.14 I
2
S/LJF/RJF Timing in Slave Mode (see
Figure 3)................................................................... 24
8.15 DSP/Mono PCM Timing in Slave Mode (see
Figure 5)................................................................... 24
8.16 I
2
C Interface Timing (see Figure 6)....................... 25
8.17 SPI Interface Timing ............................................. 25
8.18 Dissipation Ratings ............................................... 26
8.19 Typical Characteristics.......................................... 28
9 Parameter Measurement Information ................ 31
10 Detailed Description ........................................... 32
10.1 Overview ............................................................... 32
10.2 Functional Block Diagram ..................................... 33
10.3 Feature Description............................................... 34
10.4 Device Functional Modes...................................... 59
10.5 Register Maps....................................................... 60
11 Application and Implementation........................ 70
11.1 Application Information.......................................... 70
11.2 Typical Application ............................................... 71
12 Power Supply Recommendations ..................... 74
12.1 Device Power Consumption ................................. 74
13 Layout................................................................... 75
13.1 Layout Guidelines ................................................. 75
13.2 Layout Examples................................................... 75
14 器器件件和和文文档档支支持持 ..................................................... 78
14.1 文档支持................................................................ 78
14.2 社区资源................................................................ 78
14.3 商标 ....................................................................... 78
14.4 静电放电警告......................................................... 78
14.5 Glossary................................................................ 78
15 机机械械、、封封装装和和可可订订购购信信息息....................................... 78
4 修修订订历历史史记记录录
注:之前版本的页码可能与当前版本有所不同。
Changes from Original (December 2011) to Revision A Page
• 已添加
引脚配置和功能
部分,ESD
额定值
表,
特性 描述
部分,
器件功能模式
,
应用和实施
部分,
电源相关建议
部
分,
布局
部分,
器件和文档支持
部分以及
机械、封装和可订购信息
部分 ................................................................................ 1
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