SCDS037J − DECEMBER 1997 − REVISED OCTOBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
D Standard ’125-Type Pinout
D 5-Ω Switch Connection Between Two Ports
D Rail-to-Rail Switching on Data I/O Ports
D I
off
Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
DBQ PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
1OE
1A
1B
2OE
2A
2B
GND
V
CC
4OE
4A
4B
3OE
3A
3B
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OE
1A
1B
2OE
2A
2B
GND
V
CC
4OE
4A
4B
3OE
3A
3B
RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4OE
4A
4B
3OE
3A
1A
1B
2OE
2A
2B
1OE
3B
V
GND
CC
description/ordering information
The SN74CBTLV3125 quadruple FET bus switch features independent line switches. Each switch is disabled
when the associated output-enable (OE
) input is high.
This device is fully specified for partial-power-down applications using I
off
. The I
off
feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE
should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74CBTLV3125RGYR CL125
SOIC − D
Tube SN74CBTLV3125D
CBTLV3125
SOIC − D
Tape and reel SN74CBTLV3125DR
CBTLV3125
−40°C to 85°C
SOP − NS Tape and reel SN74CBTLV3125NSR CBTLV3125
−40 C to 85 C
SSOP (QSOP) − DBQ Tape and reel SN74CBTLV3125DBQR CL125
TSSOP − PW Tape and reel SN74CBTLV3125PWR CL125
TVSOP − DGV Tape and reel SN74CBTLV3125DGVR CL125
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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