TI-TPS92661-Q1.pdf_TPS92662报开路故障资源-CSDN文库

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TI-TPS92661-Q1.pdf 该文档是关于TI公司的TPS92661-Q1 LED矩阵管理器的数据手册。该器件是一款紧凑型高集成解决方案，适用于汽车前灯系统中的高亮度LED矩阵管理。特性 1. 12个开关串联阵列，用于绕过串联电路中的单个LED 2. 串行通信接口，用于与微控制器进行控制和管理 3. 多点UART通信接口 4. 可编程10位脉宽调制（PWM）亮度调节 5. 板载充电泵电源轨可升至接地端以上67V，能够提供独立的打开和关闭时间 6. LED旁路开关栅极驱动，具有低导通电阻（RDS(on)）和内置相移功能 7. 器件间同步，多个器件可同步为相同的频率和相位 8. LED开路/短路检测和保护，通过串行接口实现故障报告 9. AEC-Q100等级1认证 10. 散热增强型封装，48引脚薄型四方扁平（TQFP）外露垫封装应用 1. 汽车前灯系统中的高亮度LED矩阵管理 2. 其他需要高亮度LED矩阵管理的应用电路原理图该器件的电路原理图包括LED矩阵、Buck Current Regulator、Boost Voltage Regulator、CAN Bus、µC、5V3.3V/5V Auxiliary Voltage Regulators等部分。技术参数 1. 输入电压：VBAT 2. 输出电压：LED Matrix 3. 频率：可编程的PWM频率 4. 电流：最大12个串联LED 5. 导通电阻：RDS(on) 6. 工作温度：-40°C to 125°C 7. 封装：48引脚薄型四方扁平（TQFP）应用信息 1. 该器件适用于汽车前灯系统中的高亮度LED矩阵管理 2. 可以与微控制器进行串行通信 3. 可编程的PWM频率和相位 4. 具有LED开路/短路检测和保护功能设计实例 1. 汽车前灯系统中的LED矩阵管理 2. 其他需要高亮度LED矩阵管理的应用电源推荐 1. 输入电压：VBAT 2. 输出电压：LED Matrix 3. 频率：可编程的PWM频率生产数据 1. 生产日期：2014年9月 2. 产品认证：AEC-Q100等级1 3. 封装：48引脚薄型四方扁平（TQFP） TPS92661-Q1是一个功能强大且紧凑的LED矩阵管理器，适用于汽车前灯系统中的高亮度LED矩阵管理。

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VBAT

LED MODULEDRIVER MODULE

DC Voltage Rail

n Channels Matrix

Manager

TPS92661

LED Matrix

Manager 1

n Channels Buck Current

Regulators

Buck

Supply

and Return

Cable

TPS92661

LED Matrix

Manager n

Boost

Voltage

Regulator

CAN

Xcvr

CAN

Bus

µC

3.3V

3.3V / 5V

Auxiliary

Voltage

Regulators

Buck Current

Regulator

Buck Current

Regulator

LED12 LED1

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

TPS92661-Q1

ZHCSCS9 –SEPTEMBER 2014

适适用用于于汽汽车车前前灯灯系系统统的的高高亮亮度度 LED 矩矩阵阵管管理理器器

1 特特性性

TPS92661 器件包括一个 12 开关串联阵列（用于绕过

串联电路中的单个 LED）以及一个串行通信接口（通

• 12 个串联 LED 旁路开关

过主微控制器进行控制和管理）。

• 多点 UART 通信接口

• 可编程 10 位脉宽调制 (PWM) 亮度调节

板载充电泵电源轨可升至接地端以上 67 V，能够提供

– 独立的打开和关闭时间

LED 旁路开关栅极驱动。旁路开关的低导通电阻

– 内置相移功能

DS(on)

) 最大限度降低了传导损耗和功耗。

– 器件间同步

TPS92661 器件包含一个多点通用异步收发器

• LED 开路/短路检测和保护

(UART)，适用于串行通信。串联电路中各 LED 的打

– 故障报告

开和关闭时间可单独编程。 PWM 频率可通过内部寄

• AEC-Q100 等级 1

存器调整，多个器件可同步为相同的频率和相位。

• 散热增强型封装

– 48 引脚薄型四方扁平 (TQFP) 外露垫封装

TPS92661 器件具有 LED 开路保护以及通过串行接口

实现的 LED 开路和短路故障报告功能。

2 应应用用

TQFP 封装采用连通拓扑，能够在单层金属核 LED 载

• 汽车前灯系统

板上轻松传递信号。

• 高亮度 LED 矩阵系统

器器件件信信息息

(1)

3 说说明明

部部件件号号封封装装封封装装尺尺寸寸（（标标称称值值））

TPS92661 器件是一款紧凑型高集成解决方案，适用

TPS92661-Q1 PHP (48) 7.00mm x 7.00mm

于对应用中的大阵列高亮度 LED（如，汽车前灯）进

(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。

行分流 FET 亮度调节。

简简化化系系统统电电路路原原理理图图

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

English Data Sheet: SLUSBU2

TPS92661-Q1

ZHCSCS9 –SEPTEMBER 2014

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1 8 Application and Implementation ........................ 38

8.1 Applications Information.......................................... 38

2 应应用用.......................................................................... 1

8.2 Design Examples .................................................... 38

3 说说明明.......................................................................... 1

9 Power Supply Recommendations...................... 40

4 修修订订历历史史记记录录 ........................................................... 2

9.1 General Recommendations .................................... 40

5 Pin Configuration and Functions......................... 3

9.2 Internal Regulator.................................................... 40

6 Specifications......................................................... 4

9.3 Power Up and Reset............................................... 41

6.1 Absolute Maximum Ratings ...................................... 4

9.4 VIN Power Consumption......................................... 41

6.2 Handling Ratings....................................................... 5

9.5 Initialization Set-Up ................................................. 41

6.3 Recommended Operating Conditions....................... 5

10 Layout................................................................... 43

6.4 Thermal Information.................................................. 5

10.1 Layout Guidelines ................................................. 43

6.5 Electrical Characteristics........................................... 6

10.2 Layout Example .................................................... 43

6.6 Typical Characteristics.............................................. 7

11 器器件件和和文文档档支支持持 ..................................................... 44

7 Detailed Description.............................................. 9

11.1 商标 ....................................................................... 44

7.1 Overview ................................................................... 9

11.2 静电放电警告......................................................... 44

7.2 Functional Block Diagram ....................................... 10

11.3 Export Control Notice............................................ 44

7.3 Feature Description................................................. 10

11.4 术语表 ................................................................... 44

7.4 Device Functional Modes........................................ 20

12 机机械械封封装装和和可可订订购购信信息息 .......................................... 45

7.5 Programming........................................................... 31

7.6 Register Map........................................................... 35

4 修修订订历历史史记记录录

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

日日期期修修订订版版本本注注释释

2014 年 9 月 * 最初发布。

TPS92661-Q1

ZHCSCS9 –SEPTEMBER 2014

www.ti.com.cn

Pin Functions (continued)

I/O DESCRIPTION

NAME NO.

LED3 39 O Connect to anode of LED3 and cathode of LED4.

LED4 40 O Connect to anode of LED4 and cathode of LED5.

LED5 41 O Connect to anode of LED5 and cathode of LED6.

LED6 42 O Connect to anode of LED6 and cathode of LED7.

LED7 43 O Connect to anode of LED7 and cathode of LED8.

LED8 44 O Connect to anode of LED8 and cathode of LED9.

LED9 45 O Connect to anode of LED9 and cathode of LED10.

LED10 46 O Connect to anode of LED10 and cathode of LED11.

LED11 47 O Connect to anode of LED11 and cathode of LED12.

LED12 48 O Connect to anode of LED12.

2, 17, 18, 19,

NC — No connection.

20, 21, 35

12 Received data pins. Connect one RX pin of first device to microcontroller unit TX output and

RX I/O use second pin to connect to a RX pin of the second device. All other devices use both pins

to route the RX line through each device.

6 Synchronization pins. Allows synchronization of multiple TPS92661 devices on the same

network. May be driven by the microcontroller unit, or one TPS92661 device may be

SYNC I/O

programmed via the serial interface to provide this pulse. Only one device should drive this

signal. May be left unconnected if not used.

10 Transmitted data pins. Connect one TX pin of first device to microcontroller unit RX input and

TX I/O use second pin to connect to a TX pin of the second device. All other devices use both pins

to route the TX line through each device. This pin requires a 100kΩ pull-up resistor.

Output of the on-board 3.3-V LDO. This pin requires a ceramic output capacitor with a value

VCC 13 O

of 0.1 µF or greater. Tie to the VIN pin for 5-V microcontroller unit systems.

5-V power supply input for device. Bypass with a ceramic capacitor with a minimum value of

VIN I

0.1 µF.

Thermal Pad - Connect to system GND.

6 Specifications

6.1 Absolute Maximum Ratings

(1)(2)

Over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

VIN, VCC to GND –0.3 7

CPP to GND –0.3 67

CPP to LED12 –0.3 7

Input voltage V

LEDx to GND –0.3 60

LEDx to LED(x-1) –0.3 7

SYNC, EN, CLK, TX, RX, ADR0-2 to GND –0.3 7

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales/Office/Distributors for availability and

specifications.

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