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UCD90160
ZHCSJQ1D –NOVEMBER 2010–REVISED APRIL 2019
www.ti.com.cn
版权 © 2010–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 8
6.1 Absolute Maximum Ratings ..................................... 8
6.2 ESD Ratings.............................................................. 8
6.3 Recommended Operating Conditions....................... 8
6.4 Thermal Information.................................................. 8
6.5 Electrical Characteristics........................................... 9
6.6 Timing Requirements: I
2
C/SMBus/PMBus.............. 10
6.7 Typical Characteristics............................................ 11
7 Detailed Description............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 18
7.5 Programming........................................................... 35
8 Application and Implementation ........................ 40
8.1 Application Information............................................ 40
8.2 Typical Application ................................................. 41
9 Power Supply Recommendations...................... 44
10 Layout................................................................... 44
10.1 Layout Guidelines ................................................. 44
10.2 Layout Example .................................................... 45
11 器器件件和和文文档档支支持持 ..................................................... 47
11.1 器件支持................................................................ 47
11.2 文档支持................................................................ 47
11.3 社区资源................................................................ 47
11.4 商标 ....................................................................... 47
11.5 静电放电警告......................................................... 47
11.6 Glossary................................................................ 47
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 47
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (August 2017) to Revision D Page
• Updated Table 10 ................................................................................................................................................................. 37
• Clarified Step 8 in Design Requirements section................................................................................................................. 42
Changes from Revision B (December 2015) to Revision C Page
• Changed Layout Guidelines 1st bullet From "0.1-µF, X7R ....." To " 1-μF, X7R ceramic in parallel with 0.01-μF, X7R
ceramic at pin 47 (BPCAP)" ................................................................................................................................................. 44
Changes from Revision A (September 2011) to Revision B Page
• 已添加 添加了 ESD
额定值
表、
特性 说明
部分、
器件功能模式
、
应用和实施
部分、
电源建议
部分、
布局
部分、
器
件和文档支持
部分以及
机械、封装和可订购信息
部分........................................................................................................... 1
• Changed second sentence in VOLTAGE MONITORING section FROM:....62, 63, and 63 TO: ...62, and 63.................... 20
• Deleted in second paragraph 'and 62.2 us to convert all 16 of the analog inputs.'.............................................................. 20
• Changed the first sentence, first paragraph in Fault Responses and Alert Processing FROM: Device
monitors....operation....TO: The UCD90160 monitors....normal operation........................................................................... 21
• Changed first list item in GPI Special Functions section FROM: Sequencing....good state. TO: GPI Fault
Enable....as a fault................................................................................................................................................................ 26
• Deleted Device Reset section. ............................................................................................................................................. 35
• Moved Device Configuration and Programming, JTAG Interface, and Internal Fault Management and Memory Error
Correction (ECC) sections into the Programming section.................................................................................................... 35
• Changed second sentence in first paragraph under Figure 27, per the Errata document................................................... 37
• Added new paragraph in JTAG Interface section. .............................................................................................................. 38
• Moved Estimating ADC Reporting Accuracy section, it now follows the Application Curves section. ................................ 43
