2
DRV2605
ZHCSCW9E –DECEMBER 2012–REVISED APRIL 2018
www.ti.com.cn
版权 © 2012–2018, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements................................................ 6
6.7 Switching Characteristics.......................................... 6
6.8 Typical Characteristics.............................................. 8
7 Detailed Description............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 18
7.5 Programming........................................................... 22
7.6 Register Map........................................................... 33
8 Application and Implementation ........................ 49
8.1 Application Information............................................ 49
8.2 Typical Application .................................................. 50
8.3 Initialization Setup................................................... 53
9 Power Supply Recommendations...................... 54
10 Layout................................................................... 55
10.1 Layout Guidelines ................................................. 55
10.2 Layout Example .................................................... 56
11 器器件件和和文文档档支支持持 ..................................................... 57
11.1 法律声明................................................................ 57
11.2 波形库效果列表 ..................................................... 57
11.3 接收文档更新通知 ................................................. 58
11.4 社区资源................................................................ 58
11.5 商标 ....................................................................... 58
11.6 静电放电警告......................................................... 58
11.7 Glossary................................................................ 58
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 58
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (December 2015) to Revision E Page
• Changed the DEFAULT value for bit 5-4 of Table 25 From: 1 To 3 ................................................................................... 46
• Changed the DEFAULT value for bit 3-2 of Table 25 From: 2 To 1 ................................................................................... 46
• Changed the DEFAULT value for bit 1-0 of Table 25 From: 2 To 1 ................................................................................... 46
• Changed the typical value of C
(VDD)
in Table 30 From: 0.1 µF To: 1 µF .............................................................................. 49
• Changed C
(VDD)
from 0.1 to 1 µF in Figure 56...................................................................................................................... 50
• Changed the input-voltage supply range From: 2 V to 5.2 V To: 2.5 V to 5.5 V in the Power Supply
Recommendations secton .................................................................................................................................................... 54
Changes from Revision C (September 2014) to Revision D Page
• Changed t
h(1)
Hold time, SCL to SDA from 10 ns to 50 ns in Timing Requirements ............................................................. 6
• Changed the default value of NG_THRESH[1:0] from 1 to 2 in the Register Map Control3 Register Field Descriptions ... 47
Changes from Revision B (February 2014) to Revision C Page
• 已更改 将特性 项目符号从
免专利费集成
Immersion
库
更改为
波形事件序列生成器和触发器
............................................... 1
• 已更改 特性项目符号从
音频至触觉模式
更改为
顶级：经许可的
Immersion TouchSense 2200
特性：
.................................. 1
• 已更改 从
音频至触觉模式
更改为
音频至气氛
.......................................................................................................................... 1
• 已更改 更改了 说明 的第二段，用于澄清。............................................................................................................................ 1
• Updated document to new datasheet style ............................................................................................................................ 4
• Deleted Operating free-air temperature range, T
A
(information replaced by Thermal Information table) ............................. 5
• Changed EN pulldown resistance added to Electrical Characteristics .................................................................................. 6
• Changed connection terminal of input impedance from GND to V
(CM_ANA)
in Electrical Characteristics section.................... 6
• Moved switching parameters to new Switching Characteristics table ................................................................................... 6
• Added TI Haptic Broadcast Mode section ............................................................................................................................ 23
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