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采用增强型 Hotrod™ QFN 封装的 TPSM5601R5Hx 60V 输入、1V 至 16V 输出、

1.5A 电源模块

1 特性

• 5mm × 5.5mm × 4mm 增强型 HotRod

™

QFN

– 出色的热性能：在 85°C 且无气流的情况下具有

高达 18W 的输出功率

– 标准封装尺寸：单个大型散热焊盘和所有引脚均

分布在封装外围

• 专为可靠耐用的应用而设计

– 宽输入电压范围：4.2V 至 60V

– 高达 66V 的输入电压瞬态保护

– 工作结温范围：–40°C 至 +125°C

– 带 EXT 后缀器件的结温范围：–55°C 至

+125°C

• 固定 1MHz 开关频率

• FPWM 运行模式

• 针对超低 EMI 要求进行了优化

– 集成屏蔽式电感器和高频旁路电容器

– 符合 EN55011 EMI 标准

– 扩频选项可降低发射

• 26µA 非开关静态电流

• 单调启动至预偏置输出

• 无环路补偿或自举组件

• 具有迟滞功能的精密使能和输入 UVLO

• 具有迟滞功能的热关断保护

• 使用 WEBENCH

Power Designer 创建定制稳压器

设计方案

2 应用

• 现场发送器和传感器、PLC 模块

• 恒温器、视频监控、HVAC 系统

• 交流和伺服驱动器、旋转编码器

• 工业运输、资产跟踪

• 负输出应用

3 说明

TPSM5601R5Hx 电源模块是一款高度集成的 1.5A 电

源解决方案，在热增强型 QFN 封装内整合了一个带有

功率 MOSFET 的 60V 输入降压直流/直流转换器、一

个屏蔽式电感器和多个无源器件。此 5mm × 5.5mm ×

4mm

、15 引脚 QFN 封装采用

增强型

HotRod QFN 技

术来实现增强的热性能、小尺寸和低 EMI。该封装体

的所有引脚均分布在外围，具有单个大型散热焊盘，可

在制造过程中实现简单布局和轻松处理。

TPSM5601R5Hx 是一款紧凑、易用的电源模块，具有

1.0V 至 16V 的可调节宽输出电压范围。总体解决方案

仅需四个外部组件，并且省去了设计流程中的环路补偿

和磁性元件选择。全套功能集包括电源正常状态指示、

可编程 UVLO、预偏置启动、过流和过热保护，因此

TPSM5601R5Hx 成为为各种应用供电的出色器件。空

间受限型应用可从 5mm × 5.5mm 封装中受益。此外，

TPSM5601R5HEXT 可在 –55°C 的更低温度下运行，

TPSM5601R5H

S 支持扩频运行。

器件信息

器件型号

封装

(1)

封装尺寸（标称值）

TPSM5601R5H

QFN (15) 5.0mm × 5.5mmTPSM5601R5HE

TPSM5601R5HS

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

半桥配置

Output Current (A)

Efficiency (%)

0 0.3 0.6 0.9 1.2 1.5

100

OUT

= 12 V

= 24 V

= 48 V

= 60 V

典型效率 (V

OUT

= 12V)

TPSM5601R5H, TPSM5601R5HE

ZHCSMU2A – DECEMBER 2020 – REVISED MARCH 2021

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSFI4

Table of Contents

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................2

6 Pin Configuration and Functions...................................3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings ....................................... 4

7.2 ESD Ratings .............................................................. 4

7.3 Recommended Operating Conditions ........................5

7.4 Thermal Information ...................................................5

7.5 Electrical Characteristics ............................................6

7.6 Typical Characteristics (VIN = 12 V)........................... 8

7.7 Typical Characteristics (VIN = 24 V)........................... 9

7.8 Typical Characteristics (VIN = 48 V)......................... 10

7.9 Typical Characteristics (VIN = 60 V)......................... 11

8 Detailed Description......................................................12

8.1 Overview................................................................... 12

8.2 Functional Block Diagram......................................... 12

8.3 Feature Description...................................................13

8.4 Device Functional Modes..........................................16

9 Applications and Implementation................................ 17

9.1 Application Information............................................. 17

9.2 Typical Application.................................................... 17

10 Power Supply Recommendations..............................19

11 Layout........................................................................... 20

11.1 Layout Guidelines................................................... 20

11.2 Layout Example...................................................... 20

12 Device and Documentation Support..........................24

12.1 Device Support....................................................... 24

12.2 Documentation Support.......................................... 24

12.3 Receiving Notification of Documentation Updates..24

12.4 支持资源..................................................................24

12.5 Trademarks............................................................. 24

12.6 静电放电警告.......................................................... 25

12.7 术语表..................................................................... 25

13 Mechanical, Packaging, and Orderable

Information.................................................................... 25

4 Revision History

Changes from Revision * (December 2020) to Revision A (March 2021) Page

• 将器件状态从“预告信息”更改为“量产数据”................................................................................................ 1

5 Device Comparison Table

DEVICE DESCRIPTION

TPSM5601R5H 60-V input voltage, 1-V to 16-V output voltage, 1.5-A power module, fixed 1-MHz switching, operating

junction temperature range: –40°C to +125°C

TPSM5601R5HS Equivalent to TPSM5601R5H, but with spread spectrum operation

TPSM5601R5HEXT

Equivalent to TPSM5601R5H, but with extended junction temperature range: –55°C to +125°C

TPSM5601R5H, TPSM5601R5HE

ZHCSMU2A – DECEMBER 2020 – REVISED MARCH 2021

www.ti.com.cn

2 Submit Document Feedback

Product Folder Links: TPSM5601R5H TPSM5601R5HE

6 Pin Configuration and Functions

1 14

VIN

DNC

VOUT VOUT

AGND

V5V

PGOOD

VIN

PGND

图 6-1. 15-Pin QFN RDA Package (Top View)

表 6-1. Pin Functions

TYPE

(1)

DESCRIPTION

NO. NAME

10 AGND G

Analog ground. Zero voltage reference for internal references and logic. All electrical parameters are

measured with respect to this pin. This pin must be connected to PGND at a single point. See 节 11.2

for a recommended layout.

5 DNC

—

Do not connect. Do not connect this pin to ground, to another pin, or to any other voltage. This pin is

connected to the internal bootstrap capacitor. This pin must be soldered to an isolated pad.

2 EN I

Enable pin. This pin turns the converter on when pulled high and turns off the converter when pulled low.

This pin can be connected directly to VIN. Do not float. This pin can be used to set the input

undervoltage lockout with two resistors. See 节 8.3.4.

9 FB I

Feedback input. Connect the mid-point of the feedback resistor divider to this pin. Connect the upper

resistor (R

FBT

) of the feedback divider to V

OUT

at the desired point of regulation. Connect the lower

resistor (R

FBB

) of the feedback divider to AGND.

3, 6, 13 NC

—

Not connected. These pins are not connected to any circuitry within the module. Leaving these pins

unconnected to any other signal increases spacing near the high voltage pins (VIN, SW, EN, DNC).

However, if the high voltage spacing is not needed in the application, connecting these pins to the PGND

plane can help to enhance shielding and thermal performance.

15 PGND G

Power ground. This is the return current path for the power stage of the device. Connect this pad to the

input supply return, load return, and capacitors associated with the VIN and VOUT pins. See 节 11.2 for a

recommended layout.

12 PGOOD O

Power-good pin. Open-drain output that asserts low if the feedback voltage is not within the specified

window thresholds. A 10-kΩ to 100-kΩ pullup resistor is required and can be tied to the V5V pin or other

DC voltage less than 18 V. If not used, this pin can be left open or connected to PGND.

4 SW O Switch node. Do not place any external component on this pin or connect to any signal.

1, 14 VIN I

Input supply voltage. Connect the input supply to these pins. Connect input capacitors between these

pins and PGND in close proximity to the device.

7, 8 VOUT O

Output voltage. These pins are connected to the internal output inductor. Connect these pins to the

output load and connect external output capacitors between these pins and PGND.

11 V5V O

Internal 5-V LDO output. Supplies internal control circuits. Do not connect to external loads. This pin can

be used as logic supply for PGOOD pin.

(1) G = Ground, I = Input, O = Output

www.ti.com.cn

TPSM5601R5H, TPSM5601R5HE

ZHCSMU2A – DECEMBER 2020 – REVISED MARCH 2021

Submit Document Feedback

Product Folder Links: TPSM5601R5H TPSM5601R5HE

7 Specifications

7.1 Absolute Maximum Ratings

Over the operating ambient temperature range

(1)

PARAMETER MIN MAX UNIT

Input voltage

VIN to PGND

–0.3

EN to AGND

(2)

–0.3

+ 0.3

PGOOD to AGND

(2)

–0.3

FB to AGND

–0.3

5.5

AGND to PGND

–0.3

0.3

Output voltage

VOUT to PGND

(2)

–0.3

VCC to AGND 0 5.5

Operating IC junction

temperature, T

(3)

Non-EXT suffix device

–40

125 °C

EXT suffix device

–55

125 °C

Storage temperature, T

stg

–55

150 °C

Peak reflow case temperature 245 °C

Maximum number or reflows allowed 3

Mechanical vibration Mil-STD-883H, Method 2007.3, 1 msec, 1/2 sine, mounted 20 G

Mechanical shock Mil-STD-883H, Method 2002.5, 20 to 2000Hz 500 G

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any conditions beyond those indicated in Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V

(3) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the

internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating

area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the

module is never exceeded.

7.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM)

(1)

±1500

Charged-device model (CDM)

(2)

±1500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TPSM5601R5H, TPSM5601R5HE

ZHCSMU2A – DECEMBER 2020 – REVISED MARCH 2021

www.ti.com.cn

4 Submit Document Feedback

Product Folder Links: TPSM5601R5H TPSM5601R5HE

7.3 Recommended Operating Conditions

Over operating ambient temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Input voltage, V

4.2 60 V

Output voltage, V

OUT

1 16

(3)

Output current, I

OUT

0 1.5 A

EN voltage, V

(2)

0 V

PGOOD pullup voltage, V

PGOOD

(2)

0 18 V

Operating ambient temperature, T

Non-EXT suffix device

–40

105 °C

EXT suffix device

–55

105 °C

(1) Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not ensure specific

performance limits. For ensured specifications, see 节 7.5.

(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.

(3) The recommended maximum output voltage varies depending input voltage.

7.4 Thermal Information

THERMAL METRIC

(1)

TPSM5601R5Hx

UNITRDA (QFN)

15 PINS

θJA

Junction-to-ambient thermal resistance

(2)

Nat Conv 20.4 °C/W

100 LFM 18.9 °C/W

200 LFM 17.6 °C/W

Junction-to-top characterization parameter

(3)

3.6 °C/W

Junction-to-board characterization parameter

(4)

15.3 °C/W

SHDN

Thermal shutdown temperature 170 °C

Recovery temperature 158 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics app-note.

(2) The junction-to-ambient thermal resistance, R

θJA

, applies to devices soldered directly to a 6.35 cm × 8.25 cm, four-layer PCB with 2-

oz. copper. Additional airflow and PCB copper area reduces R

θJA

. See 节 11.2.1 for more information.

(3) The junction-to-top board characterization parameter, ψ

, estimates the junction temperature, T

, of a device in a real system, using a

procedure described in JESD51-2A (section 6 and 7). T

= ψ

× Pdis + T

; where Pdis is the power dissipated in the device and T

the temperature of the top of the device.

(4) The junction-to-board characterization parameter, ψ

, estimates the junction temperature, T

, of a device in a real system, using a

procedure described in JESD51-2A (sections 6 and 7). T

= ψ

× Pdis + T

; where Pdis is the power dissipated in the device and T

is the temperature of the board 1mm from the device.

www.ti.com.cn

TPSM5601R5H, TPSM5601R5HE

ZHCSMU2A – DECEMBER 2020 – REVISED MARCH 2021

Submit Document Feedback

Product Folder Links: TPSM5601R5H TPSM5601R5HE

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