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TI-TPSM41615.pdf
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TPSM41615 4-V to 16-V Input, 15-A DC/DC Power Module with Current Sharing
1 Features
• Integrated inductor power solution
• 11-mm × 16-mm × 4.2-mm QFN package
– All pins accessible from package perimeter
• Input voltage range: 4 V to 16 V
• Wide-output voltage range: 0.6 V to 7.1 V
• Selectable internal reference (±0.5% accuracy)
• Stackable up to two devices
– Parallel outputs for higher current
– Phase-interleaving for reduced ripple
• Efficiencies up to 97%
• Adjustable fixed switching frequency
(300 kHz to 1 MHz)
• Allows synchronization to an external clock
• Advanced current mode provides
ultra-fast load step response
• Power-good output
• Meets EN55011 radiated EMI limits
• Operating ambient range: –40°C to +105°C
• Operating IC junction range: –40°C to +125°C
• Pin compatible with: 25-A TPSM41625
• Create a custom design using the TPSM41615
With the WEBENCH
®
Power Designer
2 Applications
• Telecom and wireless infrastructure
• Industrial automated test equipment
• Enterprise switching and storage applications
• High-density distributed power systems
3 Description
The TPSM41615 power module is an easy-to-use
integrated power supply that combines a DC/DC
converter with power MOSFETs, a shielded inductor,
and passives into a compact QFN package. This
power solution requires few external components
while maintaining the ability to adjust key parameters
to meet specific design requirements. Applications
requiring increased current can benefit from the ability
to parallel two TPSM41615 devices.
The 11-mm × 16-mm × 4.2-mm, 69-pin QFN package
with optimal package layout has excellent power
dissipation capability which enhances thermal
performance. The package footprint has all signal pins
accessible from the perimeter and large thermal pads
beneath the device. The TPSM41615 offers flexibilty
with many features including power good signal, clock
synchronization, programmable UVLO, soft-start
timing selection, prebias start-up, as well as
overcurrent and overtemperature protection making it
a great product for powering a wide range of devices
and systems.
Device Information
DEVICE NUMBER PACKAGE
(1)
BODY SIZE (NOM)
TPSM41615 QFN (69) 11 mm × 16 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
space
space
Simplified Schematic
Output Current (A)
Efficiency (%)
0 3 6 9 12 15
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
V
OUT
, f
SW
5V
IN
, 3.3V
OUT
5V
IN
, 1.8V
OUT
5V
IN
, 1.2V
OUT
12V
IN
, 5V
OUT
12V
IN
, 3.3V
OUT
12V
IN
, 1.8V
OUT
Typical Efficiency
www.ti.com
TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
1
Product Folder Links: TPSM41615
TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings ....................................... 5
6.2 ESD Ratings .............................................................. 5
6.3 Recommended Operating Conditions ........................6
6.4 Thermal Information ...................................................6
6.5 Electrical Characteristics ............................................7
6.6 Typical Characteristics (PV
IN
= 12 V)..........................9
6.7 Typical Characteristics (PV
IN
= 5 V)..........................10
7 Detailed Description...................................................... 11
7.1 Overview................................................................... 11
7.2 Functional Block Diagram......................................... 11
7.3 Feature Description...................................................12
7.4 Device Functional Modes..........................................19
8 Application and Implementation.................................. 20
8.1 Application Information............................................. 20
8.2 Typical Application.................................................... 20
9 Power Supply Recommendations................................22
10 Layout...........................................................................23
10.1 Layout Guidelines................................................... 23
10.2 Layout Examples.................................................... 23
11 Device and Documentation Support..........................25
11.1 Device Support........................................................25
11.2 Receiving Notification of Documentation Updates.. 25
11.3 Support Resources................................................. 25
11.4 Trademarks............................................................. 25
11.5 Electrostatic Discharge Caution.............................. 25
11.6 Glossary.................................................................. 25
12 Mechanical, Packaging, and Orderable
Information.................................................................... 26
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (October 2020) to Revision A (December 2020) Page
• Changed device status from Advance Information to Production Data.............................................................. 1
TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TPSM41615
5 Pin Configuration and Functions
1
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
PGND
PGND
PGND
PGND
PVIN
PVIN
PVIN
PVIN
VIN
PGND
PGND
AGND
ILIM
BP5
22
55
PGND
PGND
NC
NC
NC
NC
NC
NC
NC
NC
SW
SW
SW
NC
DNC
NC
DNC
PGND
RS-
RS+
34
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
PGND
PGND
PGND
ISHARE
VSHARE
EN
PGOOD
SYNC
VSEL
SS
RT
MODE
RAMP
RAMP_SEL
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
23 24 25 26 27 28 29 30
31 32 33
66 65 64 63 62 61 60 59
58 57 56
67
69
68
VOUT
PGND
BP5
PGND
VOUT
PVIN
PGND
Figure 5-1. 69-Pin QFN MOV Package (Top View)
Table 5-1. Pin Functions
PIN
TYPE
(1)
DESCRIPTION
NAME NO.
AGND 19 G
Analog ground. Zero voltage reference for internal references and logic. Do not connect this pin to
PGND; the connection is made internal to the device.
BP5 21, 22 O
Output of an internal 5-V regulator used for the controller driver stage within the module. This output
can be used to connect a pullup resistor to the PGOOD pin. Leave these pins open if not used as a
pullup for PGOOD.
DNC 38, 40 –
Do Not Connect. Do not connect these pins to AGND, PGND, another DNC pin, or any other
voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad.
EN 25 I
Enable pin. This pin turns the converter on when floated or opened. This pin is internally pulled up to
the BP5 voltage when left open. The converter can be turned off by either driving it directly with a
logic input or an open drain/collector device to connect this pin to AGND. An external voltage divider
can be placed between this pin, AGND, and PVIN/VIN to create an external UVLO.
ILIM 20 I
Current limit setting pin. This pin sets the current limit threshold of the converter. Leave this pin open
for the full current limit threshold. The current limit threshold can be lowered by connecting an
appropriate resistor from this pin to AGND.
ISHARE 23 O
Current sharing pin. This pin is interconnected between modules for multi-phase configurations.
Leave this pin open for single-phase configurations.
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TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
Copyright © 2021 Texas Instruments Incorporated
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3
Product Folder Links: TPSM41615
Table 5-1. Pin Functions (continued)
PIN
TYPE
(1)
DESCRIPTION
NAME NO.
MODE 31 I
Mode select pin. This pin is used to configure the module for single-phase or multi-phase operation.
For single-phase operation, this pin is used to select the API and Body Brake functions. For multi-
phase operation, this pin selects the primary/secondary and SYNC configurations.
NC
39, 41,
45-52
–
Not connected. These pins are not connected to any circuitry within the module. It is recommended
that these pins be connected to the PGND plane on the application board to enhance shielding and
thermal performance.
PGND
8-11, 17,
18, 34, 37,
53-58, 68
G
This is the return path for the power stage of the device. Connect these pins to the input supply
return, load return, and bypass capacitors associated with the PVIN and VOUT pins.
PGOOD 26 O
Power Good pin. Open-drain output that asserts low if the remote sense feedback voltage is not
within the specified PGOOD thresholds. When using this signal as an output, a pullup resistor is
required. If unused, leave this pin open. The BP5 output can be used as the pullup voltage source.
PVIN 12-15, 67 I
Input switching voltage. Supplies voltage to the power switches of the converter. Connect these pins
to the input supply. Connect bypass capacitors between these pins and PGND, close to the module.
RAMP 32 I
Internal ramp selection. This pin is used to select an internal ramp amplitude. See Table 7-3 for
recommended settings. An internal 78.7-kΩ resistor is connected between RAMP and RAMP_SEL
within the module. To select the internal resistor, it is recommended to leave this pin open and to
connect the RAMP_SEL pin to AGND.
RAMP_SEL 33 I
Internal default ramp selection. This pin is used to select the internal default ramp selection for the
control loop. An internal 78.7-kΩ resistor is connected between RAMP and RAMP_SEL pins.
Connect the RAMP_SEL pin to AGND and leave the RAMP pin open to select the internal resistor.
RS+ 35 I
Positive input to the internal differential remote sense amplifier. This pin is used for the feedback
connection to VOUT. Connect this pin to the output voltage at the load. This connection can be
made using a direct connection or an external upper feedback resistor, depending on the magnitude
of VOUT and the VSEL selection. A 1-kΩ lower feedback resistor is connected across RS+ and RS–
internal to the module. The RS+ connection is not needed for secondary devices in multi-phase
configurations, and should be left open.
RS–
36 I
Negative input to the internal differential remote sense amplifier. This pin is used for the feedback
connection to VOUT return. Connect this pin to the output voltage return at the load. A 1-kΩ lower
feedback resistor is connected across RS+ and RS– internal to the module. The RS- connection is
not needed for secondary devices in multi-phase configurations, and should be left open.
RT 30 I
Switching frequency setting pin. This analog pin is used to set the switching frequency of the
converter by placing an external resistor from this pin to AGND. This pin also selects the phase
interleaving of the module when used in multi-phase configurations.
SS 29 I
Soft-start selection pin. This pin is used to select the soft-start time. Ten possible selections are
available by connecting an appropriate resistor from this pin to AGND. The selections range from 0.5
ms to 32 ms.
SW 42-44 O
Switch node. These pins are connected to the internal output inductor and switching MOSFETs.
Connect these pins together using a small copper island beneath the device. Keep this copper
island to a minimum to prevent issues with noise and EMI.
SYNC 27 I
Frequency synchronization pin. MODE can be used to configure this pin as a sync input or a sync
output for external clock and multi-phase primary/secondary configurations.
VIN 16 I
Input bias voltage. Supplies the control circuitry of the power converter. Connect a 1-µF bypass
capacitor from this pin to PGND (pins 17 and 18) in close proximity to the module. For split rail
applications, connect this pin to an input bias supply. For strapped rail applications, connect this pin
to PVIN through a 0 Ω to 10 Ω resistor.
VOUT
1-7, 59-66,
69
O
Output voltage. These pins are connected to the internal output inductor. Connect these pins to the
output load and connect external bypass capacitors between these pins and PGND in close
proximity to the module.
VSEL 28 I
Internal reference voltage selection. This pin is used to select the desired internal reference voltage.
Ten possible selections are available by connecting an appropriate resistor from this pin to AGND.
The selections range from 0.6 V to 1.1 V.
VSHARE 24 O
Voltage sharing pin. This pin is interconnected between modules for multi-phase configurations.
Leave this pin open for single-phase configurations.
(1) G = Ground, I = Input, O = Output, – = Not Connected
TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TPSM41615
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Input voltage
PVIN –0.3 17 V
PVIN to SW
DC –0.3 25 V
<10 ns –5 25 V
VIN –0.3 18 V
VSEL, SS, MODE, RT, SYNC, EN, ISHARE, ILIM –0.3 7 V
RS+ –0.3 3.6 V
RS- –0.3 0.3 V
AGND, PGND –0.3 0.3 V
SW
DC –0.3 20 V
<10 ns –5.0 20 V
Output voltage
VOUT –0.3 8 V
BP5, PGOOD, RAMP –0.3 7 V
VSHARE –0.3 3.6 V
Mechanical shock Mil-STD-883H, Method 2002.5, 1 msec, 1/2 sine, mounted 500 G
Mechanical vibration Mil-STD-883H, Method 2007.3, 20 to 2000 Hz 20 G
Operating IC junction temperature, T
J
(2)
–40 125 °C
Operating ambient temperature, T
A
(2)
–40 105 °C
Storage temperature, T
stg
–40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the
internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating
area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the
module is never exceeded.
6.2 ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
www.ti.com
TPSM41615
SLVSEX5A – OCTOBER 2020 – REVISED DECEMBER 2020
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TPSM41615
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