2
LP5030
,
LP5036
ZHCSIQ2B –SEPTEMBER 2018 –REVISED JANUARY 2019
www.ti.com.cn
版权 © 2018–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 说说明明 （（续续））.............................................................. 3
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 7
7.1 Absolute Maximum Ratings ...................................... 7
7.2 ESD Ratings.............................................................. 7
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics........................................... 8
7.6 Timing Requirements................................................ 9
7.7 Typical Characteristics............................................ 10
8 Detailed Description............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 19
8.5 Programming .......................................................... 20
8.6 Register Maps ........................................................ 24
9 Application and Implementation ........................ 49
9.1 Application Information............................................ 49
9.2 Typical Application ................................................. 49
10 Power Supply Recommendations ..................... 50
11 Layout................................................................... 51
11.1 Layout Guidelines ................................................. 51
11.2 Layout Examples................................................... 52
12 器器件件和和文文档档支支持持 ..................................................... 54
12.1 相关链接................................................................ 54
12.2 接收文档更新通知 ................................................. 54
12.3 社区资源................................................................ 54
12.4 商标 ....................................................................... 54
12.5 静电放电警告......................................................... 54
12.6 术语表 ................................................................... 54
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 54
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (December 2018) to Revision B Page
• Changed max standy current from 10uA to 12uA .................................................................................................................. 8
• Changed power-save mode current from 10uA to 12uA........................................................................................................ 8
• 已更改 from LED3 to LED11................................................................................................................................................. 28
Changes from Original (September 2018) to Revision A Page
• 首次发布生产数据数据表 ........................................................................................................................................................ 1
