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JSSC 2023.11 all papers
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NOVEMBER 2023 VOLUME 58
NUMBER 11
IJSCBC
(ISSN 0018-9200)
SPECIAL SECTION ON THE 2023 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)
EDITORIAL
New Associate Editor ........................................................... . . . . . . . . . ............................. D. Sylvester 2951
GUEST EDITORIAL
Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC) ... . . . . .
... . . . . . . . . . ............................................... . . . . . . . . . .................................... M. Kiani and K. Sengupta 2952
SPECIAL SECTION PAPERS
A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and
On-Chip ISP and ESP Function .. . . . . . . . . . ............................................... . . . . . . . . . ................... M. Guo,
S. Chen, Z. Gao, W. Yang, P. Bartkovjak, Q. Qin, X. Hu, D. Zhou, Q. Huang, M. Uchiyama, Y. Kudo,
S. Fukuoka, C. Xu, H. Ebihara, X. Wang, P. Jiang, B. Jiang, B. Mu, H. Chen, J. Yang, T. J. Dai, and A. Suess 2955
A 113.3-dB Dynamic Range 600 Frames/s SPAD X-Ray Detector With Seamless Global Shutter and Time-Encoded
Extrapolation Counter ................ . . . . . . . . . ......... B. Park, H.-S. Choi, J. Jeong, T. Kim, M.-J. Lee, and Y. Chae 2965
A Low-Stimulus-Scattering Pixel-Sharing Sub-Retinal Prosthesis SoC With Time-Based Photodiode Sensing and
Per-Pixel Dynamic Voltage Scaling .......................................... . . . . . . . . . ..........................................
... . . . . . . . . ... K. Eom, M. Park, H.-S. Lee, S.-B. Ku, N. Kim, S. Cha, Y. S. Goo, S. Kim, S.-W. Kim, and H.-M. Lee 2976
An Online-Spike-Sorting IC Using Unsupervised Geometry-Aware OSort Clustering for Efficient Embedded
Neural-Signal Processing ........................................ . . . . . . . . . ................................................ . . . . . . . .
... . . . . . . . . ......... Y. Chen, B. Tacca, Y. Chen, D. Biswas, G. Gielen, F. Catthoor, M. Verhelst, and C. Mora Lopez 2990
A 65-nm CMOS Fluorescence Sensor for Dynamic Monitoring of Living Cells ................................... . . . . . . . .
... . . . . . . . . .............................. F. Aghlmand, C. Y. Hu, S. Sharma, K. Pochana, R. M. Murray, and A. Emami 3003
(Contents Continued on Back Cover)
IEEE JOURNAL OF SOLID-STATE CIRCUITS
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Intel
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Broadcom Corporation
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Texas Instruments
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LINEFELTER
Nvidia
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ULLER
University of California, Berkeley
Berkeley, CA, USA
C. K
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Korea University
Seoul, Republic of Korea
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ANGELSDORF
K. NISHIMURA
Panasonic
Moriguchi, Japan
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AHONY
Intel
Hillsboro, OR
M. T
AKAMIYA
University of Tokyo
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ODRIGUEZ-VILLEGAS
Imperial College London
London, England, United Kingdom
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HEIKH
Intel
Portland, OR
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OKUNAGA
Intel
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OO
Korea Advanced Institute of
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Daejeon, South Korea
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Sony
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OPRAK DENIZ
IBM
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Keysight Technologies
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Qualcomm
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Indian Institute of
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Intel Corporation
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EDITOR
D
ENNIS SYLVESTER,EDITOR-IN-CHIEF
Dept. Electr. Eng. Comput. Sci.
Univ. Michigan
Ann Arbor, MI 48109-2122
jssc.eic.sylvester@gmail.com
Associate Editors
M.-F. (MARVIN)CHANG
Department of Electrical
Engineering
National Tsing Hua
University (NTHU)
Hsinchu, Taiwan
mfchang@ee.nthu.edu.tw
J. C
HOI
School of Electrical Engineering
KAIST
Korea
jaehyouk@kaist.ac.kr
Y. D
ONG
MediaTek Inc.
Woburn, MA 01801, USA
yunzhi.dong@ieee.org
M. F
UJISHIMA
Graduate Sch. of
Adv. Science & Eng.
Hiroshima University
Japan
fuji@hiroshima-u.ac.jp
P. H
EYDARI
UC Irvine
Irvine, CA 92697, USA
jssc.heydari@gmail.com
T. J
ANG
Institute of Integrated Systems
ETH Zurich
Switzerland
tkjang@ethz.ch
B. K
ELLER
NVIDIA Research
Santa Clara, CA
USA
benk@nvidia.com
W. H. K
I
Dept. Electronic Comp. Eng.
HKUST
Hong Kong, China
eeki@ust.hk
C. K
IM
Korea University
Seoul, Republic of Korea
ckim@korea.ac.kr
H. L
EE
Department of Electrical and
Computer Engineering
University of Texas at Dallas
USA
hoilee@utdallas.edu
P.-I. M
AK
State Key Lab of
Analog & Mixed-Signal VLSI
Univ. of Macau
Macau, China
pimak@umac.mo
S. M
ATTHEW
Intel Corp.
USA
sanu.k.mathew@intel.com
S. P
ALERMO
Texas A&M University
College Station, TX
USA
spalermo@tamu.edu
H. P
AN
Broadcom Limited
Irvine, CA 92618 USA
hui.pan@broadcom.com
S. P
AVA N
Dept. Electr. Eng.
Indian Institute of Technology,
Madras
Chennai, India 600 036
shanthi@ee.iitm.ac.in
P. R
EYNAERT
KU Leuven ESAT-MICAS
Leuven, B3001, Belgium
patrick.reynaert@kuleuven.be
B. S
ADHU
IBM T. J. Watson Research Center
Yorktown Heights, NY 10598, USA
sadhu@us.ibm.com
F. S
EBASTIANO
Delft University of Technology
The Netherlands
f.sebastiano@tudelft.nl
D
R.N.A.W.DUTTON
STMichroelectronics
Edinburgh, U.K.
neale.dutton@st.com
N. V
AN HELLEPUTTE
Systems & Circuits for
Connected Health
IMECbe
Leuven I Belgium
Nick.VanHelleputte@imec.be
K. W
ILCOX
AMD
Boxborough, MA, USA
Kathy.wilcox@amd.com
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Digital Object Identifier 10.1109/JSSC.2023.3324110
NOVEMBER 2023 VOLUME 58
NUMBER 11
IJSCBC
(ISSN 0018-9200)
SPECIAL SECTION ON THE 2023 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)
EDITORIAL
New Associate Editor ... . . . . . . . . . ................................................. . . . . . . . . . ........................... D. Sylvester 2951
GUEST EDITORIAL
Introduction to the Special Section on the 2023 IEEE International Solid-State Circuits Conference (ISSCC) ........
... . . . . . . . . . ................................................. . . . . . . . . . .................................. M. Kiani and K. Sengupta 2952
SPECIAL SECTION PAPERS
A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and
On-Chip ISP and ESP Function .. . . . . . . . . . .................................................. . . . . . . . . ................. M. Guo,
S. Chen, Z. Gao, W. Yang, P. Bartkovjak, Q. Qin, X. Hu, D. Zhou, Q. Huang, M. Uchiyama, Y. Kudo,
S. Fukuoka, C. Xu, H. Ebihara, X. Wang, P. Jiang, B. Jiang, B. Mu, H. Chen, J. Yang, T. J. Dai, and A. Suess 2955
A 113.3-dB Dynamic Range 600 Frames/s SPAD X-Ray Detector With Seamless Global Shutter and Time-Encoded
Extrapolation Counter ................ ............... . . . B. Park, H.-S. Choi, J. Jeong, T. Kim, M.-J. Lee, and Y. Chae 2965
A Low-Stimulus-Scattering Pixel-Sharing Sub-Retinal Prosthesis SoC With Time-Based Photodiode Sensing and
Per-Pixel Dynamic Voltage Scaling ............................................ . . . . . . . ..........................................
... . . . . . . . . ... K. Eom, M. Park, H.-S. Lee, S.-B. Ku, N. Kim, S. Cha, Y. S. Goo, S. Kim, S.-W. Kim, and H.-M. Lee 2976
An Online-Spike-Sorting IC Using Unsupervised Geometry-Aware OSort Clustering for Efficient Embedded
Neural-Signal Processing ........................................... . . . . . . .................................................. . . . . . .
... . . . . . . . . ......... Y. Chen, B. Tacca, Y. Chen, D. Biswas, G. Gielen, F. Catthoor, M. Verhelst, and C. Mora Lopez 2990
A 65-nm CMOS Fluorescence Sensor for Dynamic Monitoring of Living Cells ........................ . . . . . . . . . ..........
... . . . . . . . . .............................. F. Aghlmand, C. Y. Hu, S. Sharma, K. Pochana, R. M. Murray, and A. Emami 3003
A 47-nW Voice Activity Detector (VAD) Featuring a Short-Time CNN Feature Extractor and an RNN-Based Classifier
With a Non-Volatile CAP-ROM . . . .......................... J. Lin, K.-F. Un, W.-H. Yu, R. P. Martins, and P.-I. Mak 3020
Subtractive Photonics in Bulk CMOS .................................. . . . . . . .......... C. Ives, D. Sarkar, and A. Hajimiri 3030
Design and Characterization of a <4-mW/Qubit 28-nm Cryo-CMOS Integrated Circuit for Full Control of a
Superconducting Quantum Processor Unit Cell ....................... . . . . . . . . J. Yoo, Z. Chen, F. Arute, S. Montazeri,
M. Szalay, C. Erickson, E. Jeffrey, R. Fatemi, M. Giustina, M. Ansmann, E. Lucero, J. Kelly, and J. C. Bardin 3044
A Polar-Modulation-Based Cryogenic Transmon Qubit State Controller in 28 nm Bulk CMOS for Superconducting
Quantum Computing ..................................... . . . . . . . ................................................. . . . . . . . Y. Guo,
Q. Liu, Y. Li, W. Huang, T. Tian, S. Zhang, N. Wu, S. Tan, N. Deng, Z. Wang, H. Jiang, T. Li, and Y. Zheng 3060
REGULAR PAPERS
Deep-Learning-Based Inverse-Designed Millimeter-Wave Passives and Power Amplifiers . . . . . . . . .........................
... . . . . . . . . .................................................. . . . . . . . . . ................. E. A. Karahan, Z. Liu, and K. Sengupta 3074
H-Band Power Amplifiers in 65-nm CMOS by Adopting Output Power Maximized G
max
-Core and Transmission
Line-Based Zero-Degree Power Combining Networks ............................. B. Yun, D.-W. Park, and S.-G. Lee 3089
A 76–81 GHz 2 × 8 MIMO Radar Transceiver With Broadband Fast Chirp Generation and 16-Antenna-in-Package
Virtual Array ... Z. Duan, B. Wu, Y. Wang, Y. Fang, Y. Li, Y. Wu, T. Zhang, C. Zhu, Y. Dai, L. Sang, and H. Gao 3103
A Highly Efficient 165-GHz 4FSK 17-Gb/s Transceiver System With Frequency Overlapping Architecture in 65-nm
CMOS .. . . . . ................................................ . . . . . . . . . ......................... H. Afzal, C. Li, and O. Momeni 3113
All Rivers Flow to the Sea: A High-Density Wireless Power Receiver With Split-Dual-Path and Hybrid-Quad-Path
Step-Down Rectifying Conversion ................... . . . . . . ........ Z. Lin, Y. Lu, F. Mao, C. Wang, and R. P. Martins 3127
An EMG Interface Comprising a Flexible a-IGZO Active Electrode Matrix and a 65-nm CMOS IC ...................
... . . . . . . . E. Genco, C. Garripoli, J.-L. P. J. van der Steen, G. H. Gelinck, S. Abdinia, P. Harpe, and E. Cantatore 3138
39 000-Subexposures/s Dual-ADC CMOS Image Sensor With Dual-Tap Coded-Exposure Pixels for Single-Shot HDR
and 3-D Computational Imaging ....................................... . . . . . . . ..................................................
.. . . . . . R. Gulve, N. Sarhangnejad, G. Dutta, M. Sakr, D. Nguyen, R. Rangel, W. Chen, Z. Xia, M. Wei, N. Gusev,
E. Y. H. Lin, X. Sun, L. Hanxu, N. Katic, A. M. S. Abdelhadi, A. Moshovos, K. N. Kutulakos, and R. Genov 3150
An Area-Efficient 10-Bit Source-Driver IC With LSB-Stacked LV-to-HV-Amplify DAC for Mobile OLED
Displays .................... . . . . . . . . . .......................... G.-W. Lim, G.-G. Kang, H. Ma, M. Jeong, and H.-S. Kim 3164
A 0.004-mm
2
3.65-mW 7-Bit 2-GS/s Single-Channel GRO-Based Time-Domain ADC Incorporating Dead-Zone
Elimination and On-Chip Folding-Offset Calibration in 28-nm CMOS ............................................. . . . . . .
... . . . . . . . . .................................................. . . . . . . . . . ........ C. Zhang, J. Wei, Y. Chen, M. Liu, and Y. Yang 3179
An 8-Shaped Antenna-Based Battery-Free Neural-Recording System Featuring 3 cm Reading Range and 140 pJ/bit
Energy Efficiency ..... . . . . . . . . . . Y. Zhang, C. Yang, Z. Chang, Z. Li, H. Gao, Y. Luo, K. Xu, G. Pan, and B. Zhao 3194
A 12-to-1 Flying Capacitor Cross-Connected Buck Converter With Inserted D > 0.5 Control for Fast Transient
Response .............. . . . . . . . . . ................................................. T. Hu, M. Huang, R. P. Martins, and Y. Lu 3207
A 95% Peak Efficiency Modified KY Converter With Improved Flying Capacitor Charging in DCM for IoT
Applications ............. . . . . . . . . . .............. C. Pan, W.-L. Zeng, C.-S. Lam, S.-W. Sin, C. Zhan, and R. P. Martins 3219
A 0.45 mV/V Line Regulation, 0.6 V Output Voltage, Reference-Integrated, Error Amplifier-Less LDO With a
5-Transistor Regulation Core .................................................. . . . . . . .. I. Bhattacharjee and G. Chowdary 3231
An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s .......................................
... . . . . . . . . ..................................... J.-Y. Kim, T. Kim, J. You, K. Kim, B. M. Moon, K. Sohn, and S.-O. Jung 3242
A 20-Gb/s/Pin Compact Single-Ended DCC-Less DECS Transceiver With CDR-Less RX Front-End for On-Chip
Links . . .................................................. . . . . . . ............... J. Seo, S. Lee, M. Lee, C. Moon, and B. Kim 3253
A 0.8 V Intelligent Vision Sensor With Tiny Convolutional Neural Network and Programmable Weights Using
Mixed-Mode Processing-in-Sensor Technique for Image Classification .. . . . . . . . . . ........................................
... . . . . . . . . ...... T.-H. Hsu, G.-C. Chen, Y.-R. Chen, R.-S. Liu, C.-C. Lo, K.-T. Tang, M.-F. Chang, and C.-C. Hsieh 3266
An Error-Resilient RISC-V Microprocessor With a Fully Integrated DC–DC Voltage Regulator for Near-Threshold
Operation in 28-nm CMOS . . . . . . . . .................................................. B.-C. Wu, W.-T. Chen, and T.-T. Liu 3275
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 58, NO. 11, NOVEMBER 2023 2951
New Associate Editor
I
T IS with great pleasure that I welcome Prof. Fabio
Sebastiano to the editorial board of IEEE JOURNAL
OF SOLID-STATE CIRCUITS as a new Associate Editor.
Prof. Sebastiano is an expert on cryogenic circuits, analog and
mixed-signal circuits, and sensor interfaces.
Digital Object Identifier 10.1109/JSSC.2023.3313706
DENNIS SYLVESTER, Editor-in-Chief
University of Michigan
Ann Arbor, MI 48109 USA
e-mail: jssc.eic.sylvester@gmail.com
Fabio Sebastiano (Senior Member, IEEE) received the B.Sc. and M.Sc. degrees (cum laude)
in electrical engineering from the University of Pisa, Pisa, Italy, in 2003 and 2005, respectively,
the M.Sc. degree (cum laude) from Sant’Anna School of Advanced Studies, Pisa, in 2006, and
the Ph.D. degree from the Delft University of Technology, Delft, The Netherlands, in 2011.
From 2006 to 2013, he was with NXP Semiconductors Research, Eindhoven, The Netherlands,
where he conducted research on fully integrated CMOS frequency references, nanometer
temperature sensors, and area-efficient interfaces for magnetic sensors. In 2013, he joined the
Delft University of Technology, where he is currently an Associate Professor. He has authored
or coauthored one book, 11 patents, and over 100 technical publications. His main research
interests are cryogenic electronics, quantum computing, sensor read-outs, and fully integrated
frequency references.
Dr. Sebastiano is on the technical program committee of the ISSCC and the IEEE RFIC
Symposium, and has been on the program committee of IMS. He is currently serving as an
Associate Editor for IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, and has also served
as a Guest Editor for IEEE JOURNAL OF SOLID-STATE CIRCUITS. He was a co-recipient of the 2008 ISCAS Best Student
Paper Award, the 2017 DATE Best IP Award, the ISSCC 2020 Jan van Vessem Award for Outstanding European Paper, and
the 2022 IEEE CICC Best Paper Award. He has served as Distinguished Lecturer for the IEEE Solid-State Circuit Society.
0018-9200 © 2023 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
See https://www.ieee.org/publications/rights/index.html for more information.
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