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AUGUST 2023 VOLUME 58

NUMBER 8

IJSCBC

(ISSN 0018-9200)

EDITORIALS

New Associate Editor ........................................................... . . . . . . . . . ............................. D. Sylvester 2127

New Associate Editor ... . . . . . . . . . ............................................... . . . . . . . . . ............................. D. Sylvester 2128

REGULAR PAPERS

A Study of Injection Locking in Oscillators and Frequency Dividers ... . . . . . . . . . .............. H. Razavi and B. Razavi 2129

A 300-GHz 52-mW CMOS Receiver With On-Chip LO Generation ........... O. Memioglu, Y. Zhao, and B. Razavi 2141

A Highly Linear Receiver Using Parallel Preselect Filter for 5G Microcell Base Station Applications ... . . . . . . . . . .....

... . . . . . . . . ................................................ . . . . M. A. Montazerolghaem, L. C. N. de Vreede, and M. Babaie 2157

A 120-GHz Class-F Frequency Doubler With 7.8-dBm P

OUT

in 55-nm Bulk CMOS ..................... . . . . . . . . . .......

... . . . . . . . . . ............................................... . . . . . . . . . ....................... Z. Yang, K. Ma, F. Meng, and B. Liu 2173

Design of a 10.56-Gb/s 64-QAM Polar Transmitter at 60 GHz in 28-nm CMOS .... . . . . . . . . . .............................

... . . . . . . . . ........................ J. Nguyen, K. Khalaf, X. Tang, S. Brebels, K. Vaesen, M. Shrivas, and P. Wambacq 2189

A Dual-Polarization Silicon-Photonic Coherent Receiver Front-End Supporting 528 Gb/s/Wavelength .. . ...............

... . . . . . . . . . ........................................... A. H. Ahmed, L. Vera, L. Iotti, R. Shi, S. Shekhar, and A. Rylyakov 2202

A Predistortion-Less Digital MIMO Transmitter With DTC-Based Quadrature Imbalance Compensation . .............

... . . . . . . . . . ............................................... . . . . . . . . . .................... J. Zanen, E. Klumperink, and B. Nauta 2214

A 100-to-10-kHz 5.4-to-216-µW Power-Efﬁcient Readout Circuit Employing Closed-Loop Dynamic Ampliﬁer for

MEMS Capacitive Accelerometer ..................................... L. Zhong, S. Liu, P. Shang, W. Cao, and Z. Zhu 2226

A 1.1- / 0.9-nA Temperature-Independent 213- /565-ppm/

◦

C Self-Biased CMOS-Only Current Reference in 65-nm

Bulk and 22-nm FDSOI ................................... . . . . . . . . . ................. M. Lefebvre, D. Flandre, and D. Bol 2239

(Contents Continued on Back Cover)

IEEE JOURNAL OF SOLID-STATE CIRCUITS

The IEEE JOURNAL OF SOLID-STATE CIRCUITS is published by the IEEE Solid-State Circuits Society. For membership and subscription information and pricing, please visit

www.ieee.org/membership-catalog.

SOLID-STATE CIRCUITS SOCIETY

http://sscs.org

President

J. L

ONG

University of Waterloo

Waterloo, ON, Canada

Vice President

B. B

OWHILL

Intel

Framingham MA

Secretary

B. F

LOYD

North Carolina State University

USA

Treasurer

K. W

ILCOX

AMD

Boxborough, MA, USA

Past-President

K. K. O

Univ. Texas at Dallas

Richardson, TX, USA

Executive Ofﬁce

sscs@ieee.org

Executive Director:

A. G

REENBERG

phone: 732 465-6459

a.greenberg@ieee.org

ADMINISTRATIVE COMMITTEE

Elected for 2021-2023 Term

I. F

UJIMORI

Broadcom Corporation

Irvine, CA, USA

Elected for 2023-2024 Term

D. G

RIFFITH

Texas Instruments

USA

Elected for 2023-2025 Term

A. K

LINEFELTER

Nvidia

R. M

ULLER

University of California, Berkeley

Berkeley, CA, USA

C. K

Korea University

Seoul, Republic of Korea

C. M

ANGELSDORF

K. NISHIMURA

Panasonic

Moriguchi, Japan

F. O’M

AHONY

Intel

Hillsboro, OR

M. T

AKAMIYA

University of Tokyo

E. R

ODRIGUEZ-VILLEGAS

Imperial College London

London, England, United Kingdom

F. S

HEIKH

Intel

Portland, OR

C. T

OKUNAGA

Intel

H. Y

Korea Advanced Institute of

Science and Technology

Daejeon, South Korea

Y. O

IKE

Sony

Kanagawa, Japan

Z. T

OPRAK DENIZ

IBM

STANDING COMMITTEE CHAIRS

Awar ds

J. J. C

ORCORAN

Keysight Technologies

Retired

Chapters

A. L. L

OKE

Qualcomm

San Diego, CA, USA

Education/Distinguished

Lecturer Program

A. SHEIKHOLESLAMI

University of Toronto

Toronto, ON, Canada

Conferences

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IOVACCARI

Austin, TX, USA

Membership

D. F

RIEDMAN

IBM

Yorktown Heights,

NY, USA

Nominations

K. K. O.

Univ. Texas at Dallas

Richardson, TX, USA

Publications

S. P

AVA N

Indian Institute of

Technology, Madras

Chennai, India

Women in Circuits

F. S

HEIKH

Intel Corporation

MS: JF2-82

Hillsboro, OR USA

EDITOR

ENNIS SYLVESTER,EDITOR-IN-CHIEF

Dept. Electr. Eng. Comput. Sci.

Univ. Michigan

Ann Arbor, MI 48109-2122

jssc.eic.sylvester@gmail.com

Associate Editors

M.-F. (MARVIN)CHANG

Department of Electrical

Engineering

National Tsing Hua

University (NTHU)

Hsinchu, Taiwan

mfchang@ee.nthu.edu.tw

J. C

HOI

School of Electrical Engineering

KAIST

Korea

jaehyouk@kaist.ac.kr

Y. D

ONG

MediaTek Inc.

Woburn, MA 01801, USA

yunzhi.dong@ieee.org

D. F

RIEDMAN

IBM T. J. Watson Research Center

Yorktown Heights, NY 10598, USA

dfriedmn@us.ibm.com

M. F

UJISHIMA

Graduate Sch. of

Adv. Science & Eng.

Hiroshima University

Japan

fuji@hiroshima-u.ac.jp

P. H

EYDARI

UC Irvine

Irvine, CA 92697, USA

jssc.heydari@gmail.com

T. J

ANG

Institute of Integrated Systems

ETH Zurich

Switzerland

tkjang@ethz.ch

W. H. K

Dept. Electronic Comp. Eng.

HKUST

Hong Kong, China

eeki@ust.hk

J. K

Seoul National University

Seoul, Republic of Korea

jaeha@snu.ac.kr

H. L

Department of Electrical and

Computer Engineering

University of Texas at Dallas

USA

hoilee@utdallas.edu

P.-I. M

State Key Lab of

Analog & Mixed-Signal VLSI

Univ. of Macau

Macau, China

pimak@umac.mo

P. M

ALCOVATI

Univ. of Pavia

27100 Pavia, Italy

piero.malcovati@unipv.it

S. M

ATTHEW

Intel Corp.

USA

sanu.k.mathew@intel.com

H. P

Broadcom Limited

Irvine, CA 92618 USA

hui.pan@broadcom.com

S. P

AVA N

Dept. Electr. Eng.

Indian Institute of Technology,

Madras

Chennai, India 600 036

shanthi@ee.iitm.ac.in

P. R

EYNAERT

KU Leuven ESAT-MICAS

Leuven, B3001, Belgium

patrick.reynaert@kuleuven.be

B. S

ADHU

IBM T. J. Watson Research Center

Yorktown Heights, NY 10598, USA

sadhu@us.ibm.com

R.N.A.W.DUTTON

STMichroelectronics

Edinburgh, U.K.

neale.dutton@st.com

N. V

AN HELLEPUTTE

Systems & Circuits for

Connected Health

IMECbe

Leuven I Belgium

Nick.VanHelleputte@imec.be

K. W

ILCOX

AMD

Boxborough, MA, USA

Kathy.wilcox@amd.com

IEEE Ofﬁcers

SAIFUR RAHMAN, IEEE President & CEO

HOMAS M. COUGHLIN, IEEE President-Elect

K. J. R

AY LIU, IEEE Past President

ORREST D. WRIGHT, Director & Secretary

ARY ELLEN RANDALL, Director & Treasurer

ABAB WARD, Director & Vice President, Educational Activities

ILL I. GOSTIN, Director & Vice President, Member and Geographic Activities

ERGIO BENEDETTO, Director & Vice President, Publication Services and Products

U YUAN, Director & President, Standards Association

OHN P. V ERBONCOEUR, Director & Vice President, Technical Activities

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RANCO MALOBERTI, Director & Delegate, Division I

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IEEE Publishing Operations

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Director, Editorial Services: KEVIN LISANKIE Director, Production Services: PETER M. TUOHY

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Senior Manager, Journals Production: KATIE SULLIVAN Journals Production Manager: SARA T. SCUDDER

IEEE JOURNAL OF SOLID-STATE CIRCUITS (ISSN 0018-9200) is published monthly by The Institute of Electrical and Electronics Engineers, Inc. Responsibility for the contents rests upon the

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Dig

ital Object Identiﬁer 10.1109/JSSC.2023.3291192

AUGUST 2023 VOLUME 58

NUMBER 8

IJSCBC

(ISSN 0018-9200)

EDITORIALS

New Associate Editor ... . . . . . . . . . ................................................. . . . . . . . . . ........................... D. Sylvester 2127

New Associate Editor ... . . . . . . . . . ................................................. . . . . . . . . . ........................... D. Sylvester 2128

REGULAR PAPERS

A Study of Injection Locking in Oscillators and Frequency Dividers ..... . . . . . . . .............. H. Razavi and B. Razavi 2129

A 300-GHz 52-mW CMOS Receiver With On-Chip LO Generation ........... O. Memioglu, Y. Zhao, and B. Razavi 2141

A Highly Linear Receiver Using Parallel Preselect Filter for 5G Microcell Base Station Applications ..... . . . . . . . . . ...

... . . . . . . . . .................................................. . . M. A. Montazerolghaem, L. C. N. de Vreede, and M. Babaie 2157

A 120-GHz Class-F Frequency Doubler With 7.8-dBm P

OUT

in 55-nm Bulk CMOS ......................... . . . . . . . . . ...

... . . . . . . . . . ................................................. . . . . . . . . . ..................... Z. Yang, K. Ma, F. Meng, and B. Liu 2173

Design of a 10.56-Gb/s 64-QAM Polar Transmitter at 60 GHz in 28-nm CMOS ........ . . . . . . . . . .........................

... . . . . . . . . ........................ J. Nguyen, K. Khalaf, X. Tang, S. Brebels, K. Vaesen, M. Shrivas, and P. Wambacq 2189

A Dual-Polarization Silicon-Photonic Coherent Receiver Front-End Supporting 528 Gb/s/Wavelength .. . ...............

... . . . . . . . . . ........................................... A. H. Ahmed, L. Vera, L. Iotti, R. Shi, S. Shekhar, and A. Rylyakov 2202

A Predistortion-Less Digital MIMO Transmitter With DTC-Based Quadrature Imbalance Compensation . .............

... . . . . . . . . . ................................................. . . . . . . . . . .................. J. Zanen, E. Klumperink, and B. Nauta 2214

A 100-to-10-kHz 5.4-to-216-µW Power-Efﬁcient Readout Circuit Employing Closed-Loop Dynamic Ampliﬁer for

MEMS Capacitive Accelerometer ..................................... L. Zhong, S. Liu, P. Shang, W. Cao, and Z. Zhu 2226

A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/

◦

C Self-Biased CMOS-Only Current Reference in 65-nm

Bulk and 22-nm FDSOI ................................... . . . . . . . . . ................. M. Lefebvre, D. Flandre, and D. Bol 2239

Analysis and Design of a Dual-Mode VCO With Inherent Mode Compensation Enabling a 7.9–14.3-GHz 85-fs-rms

Jitter PLL ............................... . . . Y. Wang, J. Shi, H. Xu, S. Ji, Y. Mao, T. Zou, J. Tao, H. Min, and N. Yan 2252

Low-Power Process and Temperature-Invariant Constant Slope-and-Swing Ramp-Based Phase Interpolator ...........

... . . . . . . . . .................................................. . . . . . . . . . ........ S. Mohapatra, C.-C. Lin, S. Gupta, and D. Heo 2267

Spatially Resolved Event-Driven 24 × 24 Pixels SPAD Imager With 100% Duty Cycle for Low Optical Power

Quantum Entanglement Detection ......................... . . . . . . . . . ................................................. . . . . . . . . . ...

... . . . . . . . . ......... F. Severini, I. Cusini, F. Madonini, D. Brescia, R. Camphausen, Á. Cuevas, S. Tisa, and F. Villa 2278

An 18-MS/s 76-dB SNDR Continuous-Time 16 Modulator Incorporating an Input Voltage Tracking GmC Loop

Filter ....................................... . . . . . . . . . ........ M. Runge, J. Edler, T. Kaiser, K. Misselwitz, and F. Gerfers 2288

A 38-GS/s 7-bit Pipelined-SAR ADC With Speed-Enhanced Bootstrapped Switch and Output Level Shifting Technique

in 22-nm FinFET ........................................ . . . . . . . . ................................................ . . . . . . . . . .........

... . . . . . . . . ...... Y. Zhu, T. Liu, S. K. Kaile, S. Kiran, I.-M. Yi, R. Liu, J. C. Gomez Diaz, S. Hoyos, and S. Palermo 2300

A 33-Gb/s/Pin 1.09-pJ/Bit Single-Ended PAM-3 Transceiver With Ground-Referenced Signaling and Time-Domain

Decision Technique for Multi-Chip Module Memory Interfaces .................... . . . . . . . .................................

... . . . . . . . . . ...... Y. Kwon, H. Park, Y. Choi, J. Sim, J. Choi, S. Park, K.-M. Kim, C. Choi, H.-K. Jung, and C. Kim 2314

A 0.90-Tb/s/in 1.29-pJ/b Wireline Transceiver With Single-Ended Crosstalk Cancellation Coding Scheme for

High-Density Interconnects ... . . . . . . . . . .................................................. . . . . . . . . Q. Liu, L. Du, and Y. Du 2326

Fully Integrated Frequency-Tuning Switched-Capacitor Rectiﬁer for Piezoelectric Energy Harvesting . . . . . . . . . .........

... . . . . . . . . .................................................. . . . . . . . . . .... C. Xie, G. Zhao, Y. Ma, M.-K. Law, and M. Zhang 2337

A 0.2–2 GHz Time-Interleaved Multistage Switched-Capacitor Delay Element Achieving 2.55–448.6 ns Programmable

Delay Range and 330 ns/mm

Area Efﬁciency ........................................... . . . . . . . . . ...........................

.. . . . . . . . . . .................................... T. Forbes, B. Magstadt, J. Moody, J. Saugen, A. Suchanek, and S. Nelson 2349

TinyVers: A Tiny Versatile System-on-Chip With State-Retentive eMRAM for ML Inference at the Extreme

Edge ..................... . . . . . . . . . ................. V. Jain, S. Giraldo, J. De Roose, L. Mei, B. Boons, and M. Verhelst 2360

A Time-Domain Wavefront Computing Accelerator With a 32 × 32 Reconﬁgurable PE Array ..........................

... . . . . . . . . .................................................. . C. Yu, J. Mu, Y. Su, K. T. C. Chai, T. T.-H. Kim, and B. Kim 2372

A 334 µW 0.158 mm

ASIC for Post-Quantum Key-Encapsulation Mechanism Saber With Low-Latency Striding

Toom–Cook Multiplication ... . . . . . . . . ................................................ . . . . . . . . . ...................................

... . . . . . . . . .................... A. Ghosh, J. M. B. Mera, A. Karmakar, D. Das, S. Ghosh, I. Verbauwhede, and S. Sen 2383

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