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SEPTEMBER 2023 VOLUME 58

NUMBER 9

IJSCBC

(ISSN 0018-9200)

SPECIAL SECTION ON IEEE 2022 BiCMOS AND COMPOUND SEMICONDUCTOR INTEGRATED

CIRCUITS AND TECHNOLOGY SYMPOSIUM

EDITORIALS

New Associate Editor ........................................................... . . . . . . . . . ............................. D. Sylvester 2403

New Associate Editor ... . . . . . . . . . ............................................... . . . . . . . . . ............................. D. Sylvester 2404

GUEST EDITORIAL

IEEE 2022 BiCMOS and Compound Semiconductor Integrated Circuits and Technology

Symposium ... . . . . . . . . . ............................................... . . . . . . . . . ............................. Y. M. Greshishchev 2405

SPECIAL SECTION PAPERS

A 0.4-4 THz p-i-n Diode Frequency Multiplier in 90-nm SiGe BiCMOS .. . . . . . . . . . ........................................

... . . . . . S. Thomas, S. Razavian, W. Sun, B. Fallahi Motlagh, A. D. Kim, Y. Wu, B. S. Williams, and A. Babakhani 2407

280-GHz Frequency Multiplier Chains in 250-nm InP HBT Technology ............................................. . . . . . . .

... . . . . . . . . . ............................................... . . . . . . . . . .... U. Soylu, A. Alizadeh, M. Seo, and M. J. W. Rodwell 2421

A 117.5–155-GHz SiGe ×12 Frequency Multiplier Chain With Push-Push Doublers and a Gilbert Cell-Based

Tripler . . . ....................... J. Romstadt, A. Zaben, H. Papurcu, P. Stadler, T. Welling, K. Auﬁnger, and N. Pohl 2430

A Ka-Band InP HBT MMIC Power Ampliﬁer With 19.8:1 IP3/P

LFOM at 48 GHz ......... . . . . . . . ...................

... . . . . . . . . .............................................. K. W. Kobayashi, P. Partyka, T. Howle, T. Sellas, and L. Hayden 2441

REGULAR PAPERS

A Highly Accurate and Sensitive mmWave Displacement-Sensing Doppler Radar With a Quadrature-Less Edge-Driven

Phase Demodulator .. ................................................ . . . . . . . . . .......... H. Wang, H. Afzal, and O. Momeni 2451

A Novel LO Phase-Shifting System Based on Digital Bang-Bang PLLs With Background Phase-Offset Correction for

Integrated Phased Arrays .. . . . . . . ................................................ . . . . . . . . . ........................... F. Tesolin,

S. M. Dartizio, F. Buccoleri, A. Santiccioli, L. Bertulessi, C. Samori, A. L. Lacaita, and S. Levantino 2466

(Contents Continued on Back Cover)

IEEE JOURNAL OF SOLID-STATE CIRCUITS

The IEEE JOURNAL OF SOLID-STATE CIRCUITS is published by the IEEE Solid-State Circuits Society. For membership and subscription information and pricing, please visit

www.ieee.org/membership-catalog.

SOLID-STATE CIRCUITS SOCIETY

http://sscs.org

President

J. L

ONG

University of Waterloo

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OWHILL

Intel

Framingham MA

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LOYD

North Carolina State University

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AMD

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Univ. Texas at Dallas

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Broadcom Corporation

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Elected for 2023-2024 Term

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RIFFITH

Texas Instruments

USA

Elected for 2023-2025 Term

A. K

LINEFELTER

Nvidia

R. M

ULLER

University of California, Berkeley

Berkeley, CA, USA

C. K

Korea University

Seoul, Republic of Korea

C. M

ANGELSDORF

K. NISHIMURA

Panasonic

Moriguchi, Japan

F. O’M

AHONY

Intel

Hillsboro, OR

M. T

AKAMIYA

University of Tokyo

E. R

ODRIGUEZ-VILLEGAS

Imperial College London

London, England, United Kingdom

F. S

HEIKH

Intel

Portland, OR

C. T

OKUNAGA

Intel

H. Y

Korea Advanced Institute of

Science and Technology

Daejeon, South Korea

Y. O

IKE

Sony

Kanagawa, Japan

Z. T

OPRAK DENIZ

IBM

STANDING COMMITTEE CHAIRS

Awar ds

J. J. C

ORCORAN

Keysight Technologies

Retired

Chapters

A. L. L

OKE

Qualcomm

San Diego, CA, USA

Education/Distinguished

Lecturer Program

A. S

HEIKHOLESLAMI

University of Toronto

Toronto, ON, Canada

Conferences

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IOVACCARI

Austin, TX, USA

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RIEDMAN

IBM

Yorktown Heights,

NY, USA

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K. K. O.

Univ. Texas at Dallas

Richardson, TX, USA

Publications

S. P

AVA N

Indian Institute of

Technology, Madras

Chennai, India

Women in Circuits

F. S

HEIKH

Intel Corporation

MS: JF2-82

Hillsboro, OR USA

EDITOR

ENNIS SYLVESTER,EDITOR-IN-CHIEF

Dept. Electr. Eng. Comput. Sci.

Univ. Michigan

Ann Arbor, MI 48109-2122

jssc.eic.sylvester@gmail.com

Associate Editors

M.-F. (MARVIN)CHANG

Department of Electrical

Engineering

National Tsing Hua

University (NTHU)

Hsinchu, Taiwan

mfchang@ee.nthu.edu.tw

J. C

HOI

School of Electrical Engineering

KAIST

Korea

jaehyouk@kaist.ac.kr

Y. D

ONG

MediaTek Inc.

Woburn, MA 01801, USA

yunzhi.dong@ieee.org

M. F

UJISHIMA

Graduate Sch. of

Adv. Science & Eng.

Hiroshima University

Japan

fuji@hiroshima-u.ac.jp

P. H

EYDARI

UC Irvine

Irvine, CA 92697, USA

jssc.heydari@gmail.com

T. J

ANG

Institute of Integrated Systems

ETH Zurich

Switzerland

tkjang@ethz.ch

B. K

ELLER

NVIDIA Research

Santa Clara, CA

USA

benk@nvidia.com

W. H. K

Dept. Electronic Comp. Eng.

HKUST

Hong Kong, China

eeki@ust.hk

C. K

Korea University

Seoul, Republic of Korea

ckim@korea.ac.kr

H. L

Department of Electrical and

Computer Engineering

University of Texas at Dallas

USA

hoilee@utdallas.edu

P.-I. M

State Key Lab of

Analog & Mixed-Signal VLSI

Univ. of Macau

Macau, China

pimak@umac.mo

P. M

ALCOVATI

Univ. of Pavia

27100 Pavia, Italy

piero.malcovati@unipv.it

S. M

ATTHEW

Intel Corp.

USA

sanu.k.mathew@intel.com

S. P

ALERMO

Texas A&M University

College Station, TX

USA

spalermo@tamu.edu

H. P

Broadcom Limited

Irvine, CA 92618 USA

hui.pan@broadcom.com

S. P

AVA N

Dept. Electr. Eng.

Indian Institute of Technology,

Madras

Chennai, India 600 036

shanthi@ee.iitm.ac.in

P. R

EYNAERT

KU Leuven ESAT-MICAS

Leuven, B3001, Belgium

patrick.reynaert@kuleuven.be

B. S

ADHU

IBM T. J. Watson Research Center

Yorktown Heights, NY 10598, USA

sadhu@us.ibm.com

R.N.A.W.DUTTON

STMichroelectronics

Edinburgh, U.K.

neale.dutton@st.com

N. V

AN HELLEPUTTE

Systems & Circuits for

Connected Health

IMECbe

Leuven I Belgium

Nick.VanHelleputte@imec.be

K. W

ILCOX

AMD

Boxborough, MA, USA

Kathy.wilcox@amd.com

IEEE Ofﬁcers

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AY LIU, IEEE Past President

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IEEE JOURNAL OF SOLID-STATE CIRCUITS (ISSN 0018-9200) is published monthly by The Institute of Electrical and Electronics Engineers, Inc. Responsibility for the contents rests upon the

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Digital Object Identiﬁer 10.1109/JSSC.2023.3297379

SEPTEMBER 2023 VOLUME 58

NUMBER 9

IJSCBC

(ISSN 0018-9200)

SPECIAL SECTION ON IEEE 2022 BiCMOS AND COMPOUND SEMICONDUCTOR INTEGRATED

CIRCUITS AND TECHNOLOGY SYMPOSIUM

EDITORIALS

New Associate Editor ... . . . . . . . . . ................................................. . . . . . . . . . ........................... D. Sylvester 2403

New Associate Editor ... . . . . . . . . . ................................................. . . . . . . . . . ........................... D. Sylvester 2404

GUEST EDITORIAL

IEEE 2022 BiCMOS and Compound Semiconductor Integrated Circuits and Technology

Symposium ... . . . . . . . . . .................................................. . . . . . . . . . .......................... Y. M. Greshishchev 2405

SPECIAL SECTION PAPERS

A 0.4-4 THz p-i-n Diode Frequency Multiplier in 90-nm SiGe BiCMOS .... . . . . . . . ........................................

... . . . . . S. Thomas, S. Razavian, W. Sun, B. Fallahi Motlagh, A. D. Kim, Y. Wu, B. S. Williams, and A. Babakhani 2407

280-GHz Frequency Multiplier Chains in 250-nm InP HBT Technology ............................................. . . . . . . .

... . . . . . . . . . ................................................. . . . . . . . . . .. U. Soylu, A. Alizadeh, M. Seo, and M. J. W. Rodwell 2421

A 117.5–155-GHz SiGe ×12 Frequency Multiplier Chain With Push-Push Doublers and a Gilbert Cell-Based

Tripler . . . ....................... J. Romstadt, A. Zaben, H. Papurcu, P. Stadler, T. Welling, K. Auﬁnger, and N. Pohl 2430

A Ka-Band InP HBT MMIC Power Ampliﬁer With 19.8:1 IP3/P

LFOM at 48 GHz ......... . . . . . . . . . .................

... . . . . . . . . .............................................. K. W. Kobayashi, P. Partyka, T. Howle, T. Sellas, and L. Hayden 2441

REGULAR PAPERS

A Highly Accurate and Sensitive mmWave Displacement-Sensing Doppler Radar With a Quadrature-Less Edge-Driven

Phase Demodulator .. ................................................ . . . . . . . . . .......... H. Wang, H. Afzal, and O. Momeni 2451

A Novel LO Phase-Shifting System Based on Digital Bang-Bang PLLs With Background Phase-Offset Correction for

Integrated Phased Arrays .. . . . . . . .................................................. . . . . . . . . . ......................... F. Tesolin,

S. M. Dartizio, F. Buccoleri, A. Santiccioli, L. Bertulessi, C. Samori, A. L. Lacaita, and S. Levantino 2466

Design Aspects of Single-Ended and Differential SiGe Low-Noise Ampliﬁers Operating Above f

max

/2 in

Sub-THz/THz Frequencies .. . . . .......................... S. P. Singh, T. Rahkonen, M. E. Leinonen, and A. Pärssinen 2478

A Wideband Digital-Intensive Current-Mode Transmitter Line-Up ..................................... . . . . . . . . ...............

... . . . . . . . . . ................................ Y. Shen, M. Hoogelander, R. Bootsman, M. S. Alavi, and L. C. N. de Vreede 2489

A Fully-Reﬂective Wi-Fi-Compatible Backscatter Communication System With Retro-Reﬂective MIMO Gain for

Improved Range ....... M. Meng, M. Dunna, S.-K. Kuo, H. C. Yu, P.-H. P. Wang, D. Bharadia, and P. P. Mercier 2501

A Calibration-Free Fractional-N Analog PLL With Negligible DSM Quantization Noise ................... . . . . . . . . . .....

... . . . . . . . . . ................................................. . . . . . . . . . ........ D. Murphy, D. Yang, H. Darabi, and A. Behzad 2513

A Digital PLL-Based Phase Modulator With Non-Uniform Clock Compensation and Non-linearity Predistortion ....

... . . . . . . . . ................................................. Z. Gao, M. Fritz, G. Spalink, R. B. Staszewski, and M. Babaie 2526

A 0.4-V 0.0294-mm

Resistor-Based Temperature Sensor Achieving ±0.24

◦

C p2p Inaccuracy From −40

◦

C to

125

◦

C and 385 fJ · K

Resolution FoM in 65-nm CMOS ....... . D. Shi, K.-M. Lei, R. P. Martins, and P.-I. Mak 2543

A 372 µW 10 kHz-BW 109.2 dB-SNDR Nested Delta-Sigma Modulator Using Hysteresis-Comparison MSB-Pass

Quantization ... . . . . . . . . . ................................................ . . . . . . . . .......... Y. Guo, J. Jin, X. Liu, and J. Zhou 2554

A Bandwidth-Adaptive Pipelined SAR ADC With Three-Stage Cascoded Floating Inverter Ampliﬁer ..................

... . . . . . . . . . ............................................. X. Tang, X. Yang, J. Liu, Z. Wang, W. Shi, D. Z. Pan, and N. Sun 2564

A 1 V 1.07 µW 15-Bit Pseudo-Pseudo-Differential Incremental Zoom ADC ........................................... . . . .

... . . . . . . . . .................................................. . . . . . . . . . ....... Z. Lu, H. Ji, W. Qu, L. Ye, M. Zhao, and Z. Tan 2575

A Single-Trim Frequency Reference System With 0.7 ppm/

◦

C From −63

◦

C to 165

◦

C Consuming 210 µW

at 70 MHz .................................. A. S. Delke, T. J. Hoen, A.-J. Annema, Y. Jin, J. Verlinden, and B. Nauta 2585

A Synchronized Switch Harvesting Rectiﬁer With Reusable Storage Capacitors for Piezoelectric Energy

Harvesting ............................................... . . . . . . . . . ............................................. X. Yue and S. Du 2597

A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer

for High-Resolution 3-D Ultrasound Imaging ..................... . . . . . . . ........................................... P. Guo,

F. Fool, Z.-Y. Chang, E. Noothout, H. J. Vos, J. G. Bosch, N. de Jong, M. D. Verweij, and M. A. P. Pertijs 2607

A 26.6–119.3-µW 101.9-dB SNR Direct Digitization Bio-Impedance Readout IC ................................ . . . . . . . ..

... . . . . . . . . . ................................................. . . . . . . . . . T.-T. Zhang, H. Son, J. Zhao, C.-H. Heng, and Y. Gao 2619

A 3.3-Gb/s SPAD-Based Quantum Random Number Generator .............................. P. Keshavarzian, K. Ramu,

D. Tang, C. Weill, F. Gramuglia, S. S. Tan, M. Tng, L. Lim, E. Quek, D. Mandich, M. Stipˇcevi´c, and E. Charbon 2632

A 4-Bit Mixed-Signal MAC Macro With One-Shot ADC Conversion ............................... X. Yang and N. Sun 2648

A 0.85-pJ/b 16-Gb/s/Pin Single-Ended Transmitter With Integrated Voltage Modulation for Low-Power Memory

Interfaces . . . . . . . . .................................................. . . . . . . . . . ............ Y.-U. Jeong, J.-H. Chae, and S. Kim 2659

IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 58, NO. 9, SEPTEMBER 2023 2403

New Associate Editor

T IS with great pleasure that I welcome Prof. Sam Palermo

to the editorial board of IEEE JOURNAL OF SOLID-STATE

CIRCUITS as a new Associate Editor. Prof. Palermo is an

expert on high-speed SerDes circuits and silicon photonic

interconnects.

Digital Object Identiﬁer 10.1109/JSSC.2023.3295934

DENNIS SYLVESTER, Editor-in-Chief

University of Michigan

Ann Arbor, MI 48109 USA

e-mail: jssc.eic.sylvester@gmail.com

Samuel Palermo (Senior Member, IEEE) received the B.S. and M.S. degrees in electrical

engineering from Texas A&M University, College Station, TX, USA, in 1997 and 1999,

respectively, and the Ph.D. degree in electrical engineering from Stanford University, Stanford,

CA, USA, in 2007.

From 1999 to 2000, he was with Texas Instruments, Dallas, TX, USA, where he worked

on the design of mixed-signal integrated circuits for high-speed serial data communication.

From 2006 to 2008, he was with Intel Corporation, Hillsboro, OR, USA, where he worked

on high-speed optical and electrical I/O architectures. In 2009, he joined the Electrical and

Computer Engineering Department, Texas A&M University, where he is currently a Professor.

His research interests include high-speed electrical and optical interconnect architectures,

RF photonics, high-performance clocking circuits, and radiation-hardened circuit design.

Dr. Palermo is a recipient of a 2013 NSF-CAREER award. He is a member of Eta Kappa Nu.

He has previously served as an Associate Editor for IEEE SOLID-STATE CIRCUITS LETTERS

and IEEE TRANSACTIONS ON CIRCUITS AND SYSTEM—II: EXPRESS BRIEFS. He has also previously served as a distinguished

lecturer for the IEEE Solid-State Circuits Society and on the IEEE CASS Board of Governors. He was a coauthor of the Jack

Raper Award for Outstanding Technology-Directions Paper at the 2009 International Solid-State Circuits Conference, the

Best Student Paper at the 2014 Midwest Symposium on Circuits and Systems, and an Outstanding Student Paper Award

at the 2018 Custom Integrated Circuits Conference. He received the Texas A&M University Department of Electrical and

Computer Engineering Outstanding Professor Award in 2014 and the Engineering Faculty Fellow Award in 2015.

See https://www.ieee.org/publications/rights/index.html for more information.

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