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JANUARY 2022

VOLUME 57

NUMBER 1

IJSCBC

(ISSN 0018-9200)

SPECIAL SECTION ON THE 2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS

CONFERENCE (ISSCC)

GUEST EDITORIAL

Introduction to the Special Section on the 2021 IEEE International Solid-State Circuits Conference (ISSCC) ........

.................................................................. A. Amirkhany, T. Karnik, S. Das, J. Deguchi, and Y. Taito

SPECIAL SECTION PAPERS

A 224-Gb/s DAC-Based PAM-4 Quarter-Rate Transmitter With 8-Tap FFE in 10-nm FinFET ...........................

........................................................ J. Kim, S. Kundu, A. Balankutty, M. Beach, B. C. Kim, S. T. Kim,

Y. Liu, S. K. Murthy, P. Wali, K. Yu , H. S. Kim, C.-C. Liu, D. Shin, A. Cohen, Y. Segal, Y. Fan, P. Li, and F. O’Mahony

An Output Bandwidth Optimized 200-Gb/s PAM-4 100-Gb/s NRZ Transmitter With 5-Tap FFE in 28-nm CMOS ...

.................................... Z. Wang, M. Choi, K. Lee, K. Park, Z. Liu, A. Biswas, J. Han, S. Du, and E. Alon

A 112-Gb/s PAM-4 Low-Power Nine-Tap Sliding-Block DFE in a 7 -nm FinFET Wireline Receiver ...................

............... J. Bailey, H. Shakiba, E. Nir, G. Marderfeld, P. Krotnev, M.-A. LaCroix, D. Cassan, and D. Tonietto

A 100-Gb/s PAM-4 Optical Receiver With 2-Tap FFE and 2-Tap Direct-Feedback DFE in 28-nm CMOS ............

.............................................................. H. Li, C.-M. Hsu, J. Sharma, J. Jaussi, and G. Balamurugan

A 56-Gb/s 50-mW NRZ Receiver in 28-nm CMOS ............................................. A. Atharav and B. Razavi 54

A 40-nm, 64-Kb, 56.67 TOPS/W Voltage-Sensing Computing-In-Memory/Digital RRAM Macro Supporting Iterative

Write With Veriﬁcation and Online Read-Disturb Detection ................................................................

.................................. J.-H. Yoon, M. Chang, W.-S. Khwa, Y.-D. Chih, M.-F. Chang, and A. Raychowdhury

A Fractional-N Digital MDLL With Background Two-Point DTC Calibration .............................................

............................................................................... Q. Zhang, S. Su, C.-R. Ho, and M. S.-W. Chen

Improving SIMO-Regulated Digital SoC Energy Efﬁciencies Through Adaptive Clocking and Concurrent Domain

Control .......................... C.-H. Huang, Y. Chen, X. Sun, A. Mandal, V. R. Pamula, N. Kurd, and V. S. Sathe

SCVR-Less Dynamic Voltage-Stacking Scheme for IoT MCU ................................................................

...................................................... X. Liu, X. Li, H. Zhang, C. Li, L. Ren, Q. Chen, Y. Xu, and J. Yang

103

A 12-nm Autonomous Driving Processor With 60.4 TOPS, 13.8 TOPS/W CNN Executed b y Task-Separated ASIL D

Control ............................................................................................... K. Matsubara, H. Lieske,

M. Kimura, A. Nakamura, M. Koike, S. Morikawa, Y. Hotta, T. Irita, S. Mochizuki, H. Hamasaki, and T. Kamei

115

Vega: A Ten-Core SoC for IoT Endnodes With DNN Acceleration and Cognitive Wake-Up From MRAM-Based

State-Retentive Sleep Mode ............................................................. D. Rossi, F. Conti, M. Eggimann,

A. Di Mauro, G. Tagliavini, S. Mach, M. Guermandi, A. Pullini, I. Loi, J. Chen, E. Flamand, and L. Benini

127

(Contents Continued on Back Cover)

IEEE JOURNAL OF SOLID-STATE CIRCUITS

The IEEE JOURNAL OF SOLID-STATE CIRCUITS is published by the IEEE Solid-State Circuits Society. For membership and subscription information and pricing, please visit

www.ieee.org/membership-catalog.

SOLID-STATE CIRCUITS SOCIETY

http://sscs.org

President

K. K. O

Univ. Texas at Dallas

Richardson, TX, USA

phone: 972-883-5555

Vice President

J. L

ONG

Univ. of Waterloo

Waterloo, ON, Canada

phone: +15198884567X33133

Secretary

E. A

YRANCI

Peregrine Semiconductor

San Diego, CA, USA

Treasurer

T. S. F

IEZ

Univ. of Colorado Boulder

Boulder, CO, USA

Past-President

B. N

AUTA

Univ. Twente

Enschede, The Netherlands

phone: +31 53 489 2655

Executive Ofﬁce

[email protected]

Executive Director:

A. G

REENBERG

phone: 732 465-6459

a.greenberg@ieee.org

ADMINISTRATIVE COMMITTEE

Elected for 2019-2021 Term

A. B

URDETT

Sensium Healthcare

Oxfordshire, U.K.

Elected for 2020-2022 Term

A. C

ATHELIN

STMicroelectronics

Crolles, France

Elected for 2021-2023 Term

I. F

UJIMORI

Broadcom Corporation

Irvine, CA, USA

E. C

ANTATORE

Eindhoven Univ.of Tech.

Eindhoven, The Netherlands

V. K . D

Intel Corp

Hillsboro, OR, USA

R. M

ULLER

University of California, Berkeley

Berkeley, CA, USA

K. M

AKINWA

TU Delft

Delft, The Netherlands

M. I

KEDA

University of Tokyo

Tokyo, Japan

K. N

ISHIMURA

Panasonic

Moriguchi, Japan

D. S

YLVESTER

Univ. of Michigan

Ann Arbor, MI, USA

A. L. L

OKE

Qualcomm

San Diego, CA, USA

E. R

ODRIGUEZ-VILLEGAS

Imperial College London

London, England, United Kingdom

K. W

ILCOX

AMD

Boxborough, MA, USA

M. N

AGATA

Kobe University

Kobe Hyogo, Japan

H. Y

Korea Advanced Institute of

Science and Technology

Daejeon, South Korea

W. R

HEE

Institute Of Microelectronics

Tsinghua University

Beijing, China

STANDING COMMITTEE CHAIRS

Awards

J. J. C

ORCORAN

Keysight Technologies

Retired

Chapters

S. R

USU

TSMC Technology Inc.

San Jose, CA, USA

Education/Distinguished

Lecturer Program

A. S

HEIKHOLESLAMI

University of Toronto

Toronto, ON, Canada

Meetings

B. B

OWHILL

Intel Massachusetts

Microprocessor

Design Center

Hudson, Massachusetts

Membership

D. F

RIEDMAN

IBM

Yorktown Heights,

NY, USA

Nominations

B. N

AUTA

Univ. Twente

Enschede,

The Netherlands

Publications

S. P

AVA N

Indian Institute of

Technology, Madras

Chennai, India

Women in Circuits

K. W

ILCOX

AMD

Boxborough, MA, USA

EDITOR

AVA N KUMAR HANUMOLU,EDITOR-IN-CHIEF

University of Illinois, Urbana-Champaign

413 CSL, 1308 W. Main St, Urbana, IL, USA

[email protected]

Associate Editors

P. ANDREANI

Dept. of Electr. Inf. Technol.

Lund Univ.

221 00 Lund, Sweden

[email protected]

M.-F. (M

ARVIN)CHANG

Department of Electrical

Engineering

National Tsing Hua

University (NTHU)

Hsinchu, Taiwan

[email protected]

V. D

Intel Corp.

Hillsboro, OR 97124, USA

vivek.[email protected]

Y. D

ONG

Analog Devices, Inc.

Newton, MA, 02466, USA

[email protected]

D. F

RIEDMAN

Thomas J. Watson Research Center

Yorktown Heights, NY 10598, USA

[email protected]

D. G

RIFFITH

Texas Instruments

Dallas, TX 75243, USA

danielle.grifﬁ[email protected]

P. H

EYDARI

UC Irvine

Irvine, CA 92697, USA

[email protected]

W. H. K

Dept. Electronic Comp. Eng.

HKUST

Hong Kong, China

[email protected]

J. K

Seoul National University

Seoul, Republic of Korea

[email protected]

P.-I. M

State Key Lab of

Analog & Mixed-Signal VLSI

Univ. of Macau

Macau, China

[email protected]

P. M

ALCOVATI

Univ. of Pavia

27100 Pavia, Italy

piero.malcovati@unipv.it

A. N

ATARAJAN

School of Electrical Engineering

and Computer Science,

Oregon State University

Corvallis, OR 97331-5501, USA

[email protected]

K. O

KADA

Dept. Phys. Electron.

Graduate Sch. Sci. Eng.

Tokyo Inst. of Technology

Tokyo 152-8552, Japan

[email protected].jp

H. P

Broadcom Limited

Irvine, CA 92618 USA

[email protected]

S. P

AVA N

Dept. Electr. Eng.

Indian Institute of Technology,

Madras

Chennai, India 600 036

[email protected]

P. R

EYNAERT

KU Leuven ESAT-MICAS

Leuven, B3001, Belgium

patrick.reynaert@kuleuven.be

D. S

TOPPA

Heptagon-AMS group

Moosstrasse 2

CH-8803 R¨uschlikon, Switzerland

[email protected]

D. S

YLVESTER

Dept. Electr. Eng. Comput. Sci.

Univ. Michigan

Ann Arbor, MI 48109-2122

[email protected]

N. V

AN HELLEPUTTE

Systems & Circuits for

Connected Health

IMECbe

Leuven I Belgium

Nick.V[email protected]

IEEE Ofﬁcers

SUSAN “KATHY”LAND, President & CEO

K. J. RAY LIU, Director & President-Elect

KATHLEEN A. KRAMER, Director & Secretary

MARY ELLEN RANDALL, Director & Treasurer

TOSHIO FUKUDA, Past President

TEPHEN M. PHILLIPS, Director & Vice President, Educational Activities

AWR EN CE O. HALL, Director & Vice President, Publication Services and Products

AIKE LUIKEN, Director & Vice President, Member and Geographic Activities

AMES MATTHEWS, Director & President, Standards Association

OGER FUJII, Director & Vice President, Technical Activities

ATHERINE J. DUNCAN, Director & President, IEEE-USA

LFRED E. DUNLOP, Director & Delegate, Division I

IEEE Executive Staff

STEPHEN P. W ELBY, Executive Director & Chief Operating Ofﬁcer

HOMAS SIEGERT, Finance and Administration

ONNA HOURICAN, Corporate Activities

AMIE MOESCH, Educational Activities

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ECELIA JANKOWSKI, Member and Geographic Activities

TEVEN HEFFNER, Publications

ONSTANTINOS KARACHALIOS, Standards Association

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IEEE JOURNAL OF SOLID-STATE CIRCUITS (ISSN 0018-9200) is published monthly by The Institute of Electrical and Electronics Engineers, Inc. Responsibility for the contents rests upon the

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Digital Object Identiﬁer 10.1109/JSSC.2021.3138285

JANUARY 2022

VOLUME 57

NUMBER 1

IJSCBC

(ISSN 0018-9200)

SPECIAL SECTION ON THE 2021 IEEE INTERNATIONAL SOLID-STATE CIRCUITS

CONFERENCE (ISSCC)

GUEST EDITORIAL

Introduction to the Special Section on the 2021 IEEE International Solid-State Circuits Conference (ISSCC) ........

.................................................................. A. Amirkhany, T. Karnik, S. Das, J. Deguchi, and Y. Taito

SPECIAL SECTION PAPERS

A 224-Gb/s DAC-Based PAM-4 Quarter-Rate Transmitter With 8-Tap FFE in 10-nm FinFET ...........................

........................................................ J. Kim, S. Kundu, A. Balankutty, M. Beach, B. C. Kim, S. T. Kim,

Y. Liu, S. K. Murthy, P. Wali, K. Yu, H. S. Kim, C.-C. Liu, D. Shin, A. Cohen, Y. Segal, Y. Fan, P. Li, and F. O’Mahony