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JSSC 2023.10 all papers
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OCTOBER 2023 VOLUME 58
NUMBER 10
IJSCBC
(ISSN 0018-9200)
SPECIAL SECTION ON THE 2022 ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC)
GUEST EDITORIAL
Introduction to the Special Section on the 2022 Asian Solid-State Circuits Conference (A-SSCC) ......................
........................................ . . . . . . . . ................................. S. Cho, J.-Y. Kim, M. Fujishima, and J. Zhou 2671
SPECIAL SECTION PAPERS
A Process-Scalable Ultra-Low-Voltage Sleep Timer With a Time-Domain Amplifier and a Switch-Less Resistance
Multiplier ........................................ . . . . . . . . .................... C. Jung, H. Seong, I. Choi, S. Ha, and M. Je 2675
C
3
MLS: An Ultra-Wide-Range Energy-Efficient Level Shifter With CCLS/CMLS Hybrid Structure ....................
........................................ . . . . . . . . ........................................ . . . . . . . . ............ C. Huang and H. Jiao 2685
A Wide-Load-Range and High-Slew Capacitor-Less NMOS LDO With Adaptive-Gain Nested Miller Compensation
and Pre-Emphasis Inverse Biasing ........................................... H. Park, W. Jung, M. Kim, and H.-M. Lee 2696
A 14b 500 MS/s Single-Channel Pipelined-SAR ADC With Reference Ripple Mitigation Techniques and Adaptively
Biased Floating Inverter Amplifier ....................................... . . . . . . . . ......................................... . . . . . .
..................................... W. Jiang, Y. Zhu, C. Chen, H. Xu, Q. Liu, M. Liu, R. P. Martins, and C.-H. Chan 2709
A 3.07 mW 30 MHz-BW 73.2 dB-SNDR Time-Interleaved Noise-Shaping SAR ADC With Self-Coupling
Second-Order Error-Feedforward ....... . . . S. Zhao, M. Guo, L. Qi, D. Xu, G. Wang, R. P. Martins, and S.-W. Sin 2722
A Multistep Multistage Fifth-Order Incremental Delta Sigma Analog-to-Digital Converter for Sensor Interfaces .....
........................................ . . . . . . . . ....................................... J.-S. Huang, S.-C. Kuo, and C.-H. Chen 2733
An RC Delay-Based Pressure-Sensing System With Energy-Efficient Bit-Level Oversampling Techniques for
Implantable IOP Monitoring Systems .......... D. Seo, M. Cho, M. Jeong, G. Shin, I. Lee, D. Blaauw, and Y. Lee 2745
(Contents Continued on Back Cover)
IEEE JOURNAL OF SOLID-STATE CIRCUITS
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ENNIS SYLVESTER,EDITOR-IN-CHIEF
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Univ. Michigan
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M.-F. (MARVIN)CHANG
Department of Electrical
Engineering
National Tsing Hua
University (NTHU)
Hsinchu, Taiwan
mfchang@ee.nthu.edu.tw
J. C
HOI
School of Electrical Engineering
KAIST
Korea
jaehyouk@kaist.ac.kr
Y. D
ONG
MediaTek Inc.
Woburn, MA 01801, USA
yunzhi.dong@ieee.org
M. F
UJISHIMA
Graduate Sch. of
Adv. Science & Eng.
Hiroshima University
Japan
fuji@hiroshima-u.ac.jp
P. H
EYDARI
UC Irvine
Irvine, CA 92697, USA
jssc.heydari@gmail.com
T. J
ANG
Institute of Integrated Systems
ETH Zurich
Switzerland
tkjang@ethz.ch
B. K
ELLER
NVIDIA Research
Santa Clara, CA
USA
benk@nvidia.com
W. H. K
I
Dept. Electronic Comp. Eng.
HKUST
Hong Kong, China
eeki@ust.hk
C. K
IM
Korea University
Seoul, Republic of Korea
ckim@korea.ac.kr
H. L
EE
Department of Electrical and
Computer Engineering
University of Texas at Dallas
USA
hoilee@utdallas.edu
P.-I. M
AK
State Key Lab of
Analog & Mixed-Signal VLSI
Univ. of Macau
Macau, China
pimak@umac.mo
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ATTHEW
Intel Corp.
USA
sanu.k.mathew@intel.com
S. P
ALERMO
Texas A&M University
College Station, TX
USA
spalermo@tamu.edu
H. P
AN
Broadcom Limited
Irvine, CA 92618 USA
hui.pan@broadcom.com
S. P
AVA N
Dept. Electr. Eng.
Indian Institute of Technology,
Madras
Chennai, India 600 036
shanthi@ee.iitm.ac.in
P. R
EYNAERT
KU Leuven ESAT-MICAS
Leuven, B3001, Belgium
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ADHU
IBM T. J. Watson Research Center
Yorktown Heights, NY 10598, USA
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EBASTIANO
Delft University of Technology
The Netherlands
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R.N.A.W.DUTTON
STMichroelectronics
Edinburgh, U.K.
neale.dutton@st.com
N. V
AN HELLEPUTTE
Systems & Circuits for
Connected Health
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ILCOX
AMD
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Digital Object Identifier 10.1109/JSSC.2023.3313705
OCTOBER 2023 VOLUME 58
NUMBER 10
IJSCBC
(ISSN 0018-9200)
SPECIAL SECTION ON THE 2022 ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC)
GUEST EDITORIAL
Introduction to the Special Section on the 2022 Asian Solid-State Circuits Conference (A-SSCC) ......................
........................................ . . . . . . ................................... S. Cho, J.-Y. Kim, M. Fujishima, and J. Zhou 2671
SPECIAL SECTION PAPERS
A Process-Scalable Ultra-Low-Voltage Sleep Timer With a Time-Domain Amplifier and a Switch-Less Resistance
Multiplier ........................................ . . . . . . ...................... C. Jung, H. Seong, I. Choi, S. Ha, and M. Je 2675
C
3
MLS: An Ultra-Wide-Range Energy-Efficient Level Shifter With CCLS/CMLS Hybrid Structure ....................
........................................ . . . . . . ......................................... . . . . . . . .............. C. Huang and H. Jiao 2685
A Wide-Load-Range and High-Slew Capacitor-Less NMOS LDO With Adaptive-Gain Nested Miller Compensation
and Pre-Emphasis Inverse Biasing ....................... . . . . . . .............. H. Park, W. Jung, M. Kim, and H.-M. Lee 2696
A 14b 500 MS/s Single-Channel Pipelined-SAR ADC With Reference Ripple Mitigation Techniques and Adaptively
Biased Floating Inverter Amplifier ....................................... . . . . . . ......................................... . . . . . . . .
..................................... W. Jiang, Y. Zhu, C. Chen, H. Xu, Q. Liu, M. Liu, R. P. Martins, and C.-H. Chan 2709
A 3.07 mW 30 MHz-BW 73.2 dB-SNDR Time-Interleaved Noise-Shaping SAR ADC With Self-Coupling
Second-Order Error-Feedforward ....... . . . S. Zhao, M. Guo, L. Qi, D. Xu, G. Wang, R. P. Martins, and S.-W. Sin 2722
A Multistep Multistage Fifth-Order Incremental Delta Sigma Analog-to-Digital Converter for Sensor Interfaces .....
........................................ . . . . . . ........................................ . J.-S. Huang, S.-C. Kuo, and C.-H. Chen 2733
An RC Delay-Based Pressure-Sensing System With Energy-Efficient Bit-Level Oversampling Techniques for
Implantable IOP Monitoring Systems .......... D. Seo, M. Cho, M. Jeong, G. Shin, I. Lee, D. Blaauw, and Y. Lee 2745
A 1984-Pixels, 1.26 nW/Pixel Retinal Prosthesis Chip With Time-Domain In-Pixel Image Processing and Bipolar
Stimulating Electrode Sharing ............ . . . . . . ........................................ . . . . . . . . . D.-H. Choi and D.-W. Jee 2757
A Multimode Vision Sensor With Temporal Contrast Pixel and Column-Parallel Local Binary Pattern Extraction for
Dynamic Depth Sensing Using Stereo Vision .......... . . . . . ......................................... . . . . . . . ..................
................. M.-Y. Chiu, G.-C. Chen, T.-H. Hsu, R.-S. Liu, C.-C. Lo, K.-T. Tang, M.-F. Chang, and C.-C. Hsieh 2767
A Wide-Bandwidth Ultrasound Receiver and On-Chip Ultrasound Transmitter for Ultrasound Capsule
Endoscopy ............. . . . . . . . ............. K. Jeong, G. Yun, J. Choi, I. Choi, J. Son, J. Y. Hwang, S. Ha, and M. Je 2778
A Charge Recycling Logic Data Links for Single- and Multiple-Channel I/Os .................... . . . . . . ...................
........................................ . . . . . . ........................... H. Wu, J. H. Park, R. Jiang, J.-H. Choi, and J. Yoo 2790
A 103 fJ/b/dB, 10–26 Gb/s Receiver With a Dual Feedback Nested Loop CDR for Wide Bandwidth Jitter Tolerance
Enhancement ................................ . . . . . Y.-C. Liu, W.-Z. Chen, Y.-S. Lee, Y.-H. Chen, S. Ming, and Y.-H. Lin 2801
SNPU: An Energy-Efficient Spike Domain Deep-Neural-Network Processor With Two-Step Spike Encoding and
Shift-and-Accumulation Unit . ................................... S. Kim, S. Kim, S. Um, S. Kim, J. Lee, and H.-J. Yoo 2812
An Energy-Efficient Bayesian Neural Network Accelerator With CiM and a Time-Interleaved Hadamard Digital GRNG
Using 22-nm FinFET . . . . . . . ......................... R. Dorrance, D. Dasalukunte, H. Wang, R. Liu, and B. Carlton 2826
A 28-nm RRAM Computing-in-Memory Macro Using Weighted Hybrid 2T1R Cell Array and Reference Subtracting
Sense Amplifier for AI Edge Inference ... . . . . . . . ............................... W. Ye, L. Wang, Z. Zhou, J. An, W. Li,
H. Gao, Z. Li, J. Yue, H. Hu, X. Xu, J. Yang, J. Liu, D. Shang, F. Zhang, J. Tian, C. Dou, Q. Liu, and M. Liu 2839
A 37–43.5-GHz Phase and Amplitude Detection Circuit With 0.049
◦
and 0.036-dB Accuracy for 5G Phased-Array
Calibration Using Transformer-Based Injection-Enhanced ILFD .. . . . . ......................................... . . . . . . ......
................... Y. Yamazaki, J. Sakamaki, J. Pang, J. Alvin, Z. Li, D. You, J. Mayeda, A. Shirane, and K. Okada 2851
A Compact and Low Phase Noise Square-Geometry Quad-Core Class-F VCO Using Parallel Inductor-Sharing
Technique .................. . . . . . . ................................... Y. Sun, W. Deng, H. Jia, Y. He, Z. Wang, and B. Chi 2861
REGULAR PAPERS
A Hybrid Magnetic Current Sensor With a Multiplexed Ripple-Reduction Loop .. . . .......................................
............................. A. Jouyaeian, Q. Fan, R. Zamparette, U. Ausserlechner, M. Motz, and K. A. A. Makinwa 2874
A 12-Bit 260-MS/s Pipelined-SAR ADC With Ring-TDC-Based Fine Quantizer for Automatic Cross-Domain Scale
Alignment ............................ . . . . . ......................................... . . . . . . . . ............. H. Zhao and F. F. Dai 2883
A 12-ENOB Second-Order Noise-Shaping SAR ADC With PVT-Insensitive Voltage–Time–Voltage Converter .......
........................................ . . . . . . ............. C.-C. Chen, Y.-H. Huang, J. C. J. S. Marquez, and C.-C. Hsieh 2897
A Serrodyne Modulator-Based Fractional Frequency Synthesis Technique for Low-Noise, GHz-Rate Clocking . ......
........................................ . . . . . . ........................................ A. Sharkia, S. Mirabbasi, and S. Shekhar 2907
Laser Voltage Probing Attack Detection With 100% Area/Time Coverage at Above/Below the Bandgap Wavelength
and Fully-Automated Design . ......................................... . . . . . . . H. Zhang, L. Lin, Q. Fang, and M. Alioto 2919
Neuro-CIM: ADC-Less Neuromorphic Computing-in-Memory Processor With Operation Gating/Stopping and
Digital–Analog Networks ..................................... S. Kim, S. Kim, S. Um, S. Kim, K. Kim, and H.-J. Yoo 2931
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 58, NO. 10, OCTOBER 2023 2671
Guest Editorial
Introduction to the Special Section on
the 2022 Asian Solid-State Circuits
Conference (A-SSCC)
T
HE Special Issue of the IEEE JOURNAL OF SOLID-
STATE CIRCUITS (JSSC) highlights outstanding papers
presented at the 2022 Asian Solid-State Circuits Conference
(A-SSCC), which was held from November 6 to 9, 2022 in
Taipei, Taiwan, under the conference theme “Silicon ICs
Enabling a Carbon Neutral World.” As one of the five con-
ferences fully supported by the IEEE Solid-State Circuits
Society, A-SSCC has gained prominence since its inception in
2005 as a leading global forum for showcasing advancements
in solid-state circuits and system-on-chip (SoC). In 2022,
A-SSCC adopted a hybrid format, allowing participants to
attend either in person or virtually via an online platform.
The conference had a record-high number of participants, with
594 attendees, where 345 attended physically and 249 joined
online.
In 2022, A-SSCC received 233 papers, out of which
89 were accepted, resulting in a 39% acceptance rate. This
Special Section of JSSC includes seventeen papers that provide
in-depth materials beyond what was published in the 2022
A-SSCC proceedings, carefully selected from the highly qual-
ified accepted papers. These papers cover a diverse range of
topics, from analog, power, biomedical, and RF circuits to
machine learning SoCs.
In analog and power circuits, three articles are included.
The first article [A1], presented by the Korea Advanced
Institute of Science and Technology (KAIST), Daejeon,
Republic of Korea, introduces a sleep timer that utilizes
an ultra-low-voltage frequency-locked-loop architecture with
a time-domain amplifier and a switch-less resistance mul-
tiplier. This design achieves a temperature dependency of
2.73 ppm/
◦
C while consuming only 63 nW at 0.4 V. The next
article from Peking University [A2] presents a cross-coupled,
current-mirror hybrid level shifter with a propagation delay of
20.08 ns and an energy consumption per transition of 18.11 fJ
for 0.3–1.2 V level conversion. The third article [A3], from
Korea University, focuses on an output capacitor-less NMOS
low-dropout regulator. This design incorporates wide-range
adaptive-gain nested Miller compensation and pre-emphasis
inverse biasing to ensure a small undershoot and overshoot
of 48 and 59 mV, respectively, against a large load current
change of 299 mA.
Digital Object Identifier 10.1109/JSSC.2023.3295522
In the area of data converters, the following articles intro-
duce state-of-the-art performances. Fudan University presents
an article [A4] that introduces a reference ripple mitigation
technique and an adaptively biased floating inverter ampli-
fier. These innovations enable the achievement of a 14-bit,
500 MS/s single-channel pipelined successive-approximation-
register (SAR) analog-to-digital converter (ADC). The Univer-
sity of Macau [A5] presents a time-interleaved noise-shaping
SAR ADC with a 30 MHz bandwidth and signal-to-noise
and distortion ratio (SNDR) of 73 dB. Finally, a fifth-order
multi-stage incremental delta sigma ADC for sensor interface
is presented by National Yang Ming Chiao Tung University
[A6], which achieves a figure-of-merit of 168.5 dB.
For biomedical and vision applications, four articles are
included. Sungkyunkwan University [A7] proposes an efficient
bit-level oversampling techniques for implantable intraocular
pressure monitoring systems. In the next article by Ajou Uni-
versity [A8], a 1984-pixel retinal prosthesis chip is introduced,
featuring time-domain in-pixel image processing and bipolar
stimulation. National Tsing Hua University [A9] presents
a multi-mode vision sensor chip that can extract temporal
and spatial information with in-sensor processing. Lastly,
KAIST [A10] presents an ultrasound transceiver IC with a
wide-bandwidth receiver and an on-chip transmitter for an
ultrasound capsule endoscopy system. It demonstrates success-
ful B-mode imaging in both the water tank and customized
phantom settings.
In the area of high-speed energy-efficient links, the article
from the National University of Singapore [A11] proposes
a new charge recycling logic that achieves over 20% power
reduction under random data streaming. The article [A12] from
the National Yang-Ming Jiao Tong University introduces a
10–26 Gbps energy-efficient receiver that incorporates dual
feedback nested-loop clock and data recovery circuit.
For artificial intelligence (AI), the following three articles
focus on improving the energy efficiency of machine learning
processors. First, KAIST [A13] presents an energy-efficient
spike domain deep-neural-network processor utilizing two-step
encoding and omni-sparsity handling unit to achieve state-of-
the-art energy efficiency of 13.7 TOPS/W for object detec-
tion and 31.5 TOPS/W for ImageNet classification. Next,
an energy-efficient Bayesian neural network accelerator is pro-
posed by Intel Labs [A14] with a highly efficient compute-in-
memory (CIM) macro and Gaussian random number generator.
0018-9200 © 2023 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
See https://www.ieee.org/publications/rights/index.html for more information.
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