2
DRV5023
ZHCSEF3G –MAY 2014–REVISED SEPTEMBER 2016
www.ti.com.cn
版权 © 2014–2016, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics.......................................... 6
6.7 Magnetic Characteristics........................................... 6
6.8 Typical Characteristics.............................................. 7
7 Detailed Description.............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 15
8 Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Applications ................................................ 16
9 Power Supply Recommendations...................... 18
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 器器件件和和文文档档支支持持 ..................................................... 20
11.1 器件支持................................................................ 20
11.2 接收文档更新通知 ................................................. 21
11.3 社区资源................................................................ 21
11.4 商标 ....................................................................... 21
11.5 静电放电警告......................................................... 21
11.6 Glossary................................................................ 21
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 21
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision F (May 2016) to Revision G Page
• Changed the power-on time for the FA version in the Electrical Characteristics table .......................................................... 6
• Added the Layout section .................................................................................................................................................... 19
• 已添加
接收文档更新通知
部分 .............................................................................................................................................. 21
Changes from Revision E (February 2016) to Revision F Page
• Revised preliminary limits for the FA version ......................................................................................................................... 6
Changes from Revision D (December 2015) to Revision E Page
• 已添加 FA 器件选项 ................................................................................................................................................................ 1
• Added the typical bandwidth value to the Magnetic Characteristics table ............................................................................ 6
Changes from Revision C (May 2015) to Revision D Page
• 已更正 SOT-23 封装体尺寸并将 SIP 封装名称更正为 TO-92 ................................................................................................ 1
• Added B
MAX
to Absolute Maximum Ratings ........................................................................................................................... 5
• Removed table note from junction temperature .................................................................................................................... 5
• 已更新封装卷带选项 M 和空白.............................................................................................................................................. 20
• 已添加
社区资源
.................................................................................................................................................................. 21
Changes from Revision B (September 2014) to Revision C Page
• 已将器件状态更新为量产数据 ................................................................................................................................................ 1
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