TI-DRV401.pdf资源-CSDN文库

FEATURES

D DESIGNED FOR SENSORS FROM

VACUUMSCHMELZE (VAC)

D SINGLE SUPPLY: 5V

D POWER OUTPUT: H-Bridge

D DESIGNED FOR DRIVING INDUCTIVE LOADS

D EXCELLENT DC PRECISION

D WIDE SYSTEM BANDWIDTH

D HIGH-RESOLUTION, LOW-TEMPERATURE

DRIFT

D BUILT-IN DEGAUSS SYSTEM

D EXTENSIVE FAULT DETECTION

D EXTERNAL HIGH-POWER DRIVER OPTION

APPLICATIONS

D GENERATOR/ALTERNATOR MONITORING

AND CONTROL

D FREQUENCY AND VOLTAGE INVERTERS

D MOTOR DRIVE CONTROLLERS

D SYSTEM POWER CONSUMPTION

D PHOTOVOLTAIC SYSTEMS

DESCRIPTION

The DRV401 is designed to control and process signals

from specific magnetic current sensors made by

Vacuumschmelze GmbH & Co. KG (VAC). A variety of

current ranges and mechanical configurations are

available. Combined with a VAC sensor, the DRV401

monitors both ac and dc currents to high accuracy.

Provided functions include: probe excitation, signal

conditioning of the probe signal, signal loop amplifier, an

H-bridge driver for the compensation coil, and an analog

signal output stage that provides an output voltage

proportional to the primary current. It offers overload and

fault detection, as well as transient noise suppression.

The DRV401 can directly drive the compensation coil, or

connect to external power drivers. Therefore, the DRV401

combines with sensors to measure small to very large

currents.

To maintain the highest accuracy, the DRV401 can

demagnetize (degauss) the sensor at power-up and on

demand.

Integrator

Filter

Probe

Interface

H−Bridge

Driver

V

OUT

REF

IN

I

COMP2

R

S

I

COMP1

Compensation

Patents Pending.

Diff

Amp

Timing, Error Detection,

and Power Control

Degauss V

REF

V

REF

GND+5V

IS2

IS1

DRV401

I

P

Compensation Winding

Magnetic Core

Primary Winding

Field Probe

PWM PWM

DRV401

SBVS070B − JUNE 2006 − REVISED MAY 2009

Sensor Signal Conditioning IC for

Closed-Loop Magnetic Current Sensor

www.ti.com

Copyright  2006−2009, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

         

          

 !     !   

"#$%

SBVS070B − JUNE 2006 − REVISED MAY 2009

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage +7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals:

Voltage

(2)

−0.5V to V

DD

+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential Amplifier

(3)

−10V to +10V. . . . . . . . . . . . . . . . . . . . . .

Current at IS1 and IS2 ±75mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current (pins other than IS1 and IS2)

(2)

±25mA. . . . . . . . . . . . . .

I

COMP

Short Circuit

(4)

+250mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature −50°C to +150°C. . . . . . . . . . . . .

Storage Temperature −55°C to +150°C. . . . . . . . . . . . . . . . . . . . . . .

ESD Rating:

Human Body Model (HBM)

Pins IA

IN1

and IA

IN2

Only 1kV. . . . . . . . . . . . . . . . . . . . . . . . . . .

All Other Pins 4kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1)

Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.5V beyond the supply

rails must be current limited, except for the differential amplifier

input pins.

(3)

These inputs are not internally protected against over voltage.

The differential amplifier input pins must be limited to 5mA, max or

±10V, max.

(4)

Power-limited; observe maximum junction temperature.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION

(1)

PRODUCT PACKAGE-LEAD

PACKAGE

DESIGNATOR

PACKAGE

MARKING

DRV401

QFN-20

(5mm x 5mm)

RGW HAAQ

DRV401 SO-20 DWP DRV401A

(1)

For the most current package and ordering information see the

Package Option Addendum at the end of this document, or see

the TI web site at www.ti.com.

"#$%

SBVS070B − JUNE 2006 − REVISED MAY 2009

www.ti.com

3

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range: T

J

= −40°C to +125°C.

At T

A

= +25°C and V

DD1

= V

DD2

= +5V with external 100kHz filter BW, and zero output current I

COMP

, unless otherwise noted.

DRV401

PARAMETER CONDITIONS MIN TYP MAX

UNITS

DIFFERENTIAL AMPLIFIER R

L

= 10kΩ to 2.5V, V

REFIN

= 2.5V

OFFSET VOLTAGE

Offset Voltage, RTO

(1)(2)

V

OS

Gain 4V/V ±0.01 ±0.1 mV

Drift, RTO

(2)

dV

OS

/dT ±0.1 ±1

(3)

µV/°C

vs Common-Mode, RTO CMRR −1V to +6V, V

REF

= 2.5V ±50 ±250 µV/V

vs Power-Supply, RTO PSRR V

REF

not included ±4 ±50 µV/V

SIGNAL INPUT

Common-Mode Voltage Range −1 (V

DD

) + 1 V

SIGNAL OUTPUT

Signal Over-Range Indication (OVER-RANGE), Delay

(2)

V

IN

= 1V Step, See Notes 2 and 3 2.5 to 3.5 µs

Voltage Output Swing From Negative Rail

(2)

,

OVER-RANGE Trip Level

I = +2.5mA, CMP Trip Level +48 +85 mV

Voltage Output Swing From Positive Rail

(2)

,

OVER-RANGE Trip Level

I = −2.5mA, CMP Trip Level V

DD

− 85 V

DD

− 48 mV

Short-Circuit Current

(2)

I

SC

V

OUT

Connected To GND −18 mA

V

OUT

Connected To V

DD

+20 mA

Gain, V

OUT

/V

IN_DIFF

4 V/V

Gain Error ±0.02 ±0.3 %

Gain Error Drift ±0.1 ppm/°C

Linearity Error R

L

= 1kΩ 10 ppm

FREQUENCY RESPONSE

Bandwidth

(2)

BW

−3dB

2 MHz

Slew Rate

(2)

SR CMVR = −1V to = +4V 6.5 V/µs

Settling Time, Large-Signal

(2)

dV ± 2V to 1%, No External Filter 0.9 µs

Settling Time

(2)

dV ± 0.4V to 0.01% 14 µs

INPUT RESISTANCE

Differential 16.5 20 23.5 kΩ

Common-Mode 41 50 59 kΩ

External Reference Input 41 50 59 kΩ

NOISE

Output Voltage Noise Density, f = 1kHz, RTO

(2)

e

n

Compensation Loop Disabled 170 nV/√Hz

COMPENSATION LOOP

DC STABILITY Probe f = 250kHz, R

LOAD

= 20Ω

Offset Error

(4)

Deviation from 50% PWM, Pin Gain = L 0.03 %

Offset Error Drift

(2)

Deviation from 50% PWM, Pin Gain = L 7.5 ppm/°C

Gain, Pin Gain = L

(2)

|V

ICOMP1

| − |V

ICOMP2

| −200 25 200 ppm/V

Power-Supply Rejection Ratio

PSRR

Probe Loop f = 250kHz

500 ppm/V

FREQUENCY RESPONSE

Open-Loop Gain, Two Modes, 7.8kHz Pin Gain H/L

24/32 dB

PROBE COIL LOOP

Input Voltage Clamp Range Field Probe Current < 50mA −0.7 to V

DD

+ 0.7 V

Internal Resistor, IS1 or IS2 to V

DD1

(2)

R

HIGH

47 59 71 Ω

Internal Resistor, IS1 or IS2 to GND1

(2)

R

LOW

60 75 90 Ω

Resistance Mismatch Between IS1 and IS2

(2)

ppm of R

HIGH

+ R

LOW

300 1500 ppm

Total Input Resistance

(3)

134 200 W

Comparator Threshold Current

(3)

22 28 34 mA

Minimum Probe Loop Half-Cycle

(2)

250 280 310 ns

Probe Loop Minimum Frequency 250 kHz

No Oscillation Detect (Error) Suppression 35 µs

COMPENSATION COIL DRIVER, H-BRIDGE

Peak Current

(2)

V

ICOMP1

− V

ICOMP2

= 4.0V

PP

250 mA

Voltage Swing 20Ω Load 4.2 V

PP

Output Common-Mode Voltage V

DD2

/2 V

Wire Break Detect, Threshold Current

(5)

I

COMP1

and I

COMP2

Railed 33 57 mA

"#$%

SBVS070B − JUNE 2006 − REVISED MAY 2009

www.ti.com

4

ELECTRICAL CHARACTERISTICS (continued)

Boldface limits apply over the specified temperature range, T

J

= −40°C to +125°C, with zero output current I

COMP

.

At T

A

= +25°C and V

DD1

= V

DD2

= +5V with external 100kHz filter BW, unless otherwise noted.

DRV401

PARAMETER CONDITIONS MIN TYP MAX

UNITS

VOLTAGE REFERENCE

Voltage

(2)

No Load 2.495 2.5 2.505 V

Drift

(2)

No Load ±5 ±50 ppm/°C

PSRR

(2)

±15 ±200 µV/V

Load Regulation

(2)

Load to GND/V

DD

, dI = 0mA to 5mA 0.15 mV/mA

Short-Circuit Current I

SC

REF

OUT

Connected to V

DD

+20 mA

REF

OUT

Connected to GND −18 mA

DEMAGNETIZATION

Duration See Timing Diagram 106 130

(3)

ms

DIGITAL I/O

LOGIC INPUTS (DEMAG, GAIN, and CCdiag Pins) CMOS Type Levels

Pull-Up High Current (CCdiag) 3.5 < V

IN

< V

DD

160 µA

Pull-Up Low Current (CCdiag) 0 < V

IN

< 1.5 5 µA

Logic Input Leakage Current 0 < V

IN

< V

DD

0.01 5 µA

Logic Level, Input: L/H 2.1/2.8 V

Hysteresis 0.7 V

OUTPUTS (ERROR AND OVER-RANGE Pins)

Logic Level, Output: L 4mA Sink 0.3 V

Logic Level, Output: H No Internal Pull-Up

OUTPUTS (PWM and PWM Pins) Push-Pull Type

Logic Level L 4mA Sink 0.2 V

Logic Level H 4mA Source (V

DD

) − 0.4 V

POWER SUPPLY

Specified Voltage Range V

DD

4.5 5 5.5 V

Power-On Reset Threshold V

RST

1.8 V

Quiescent Current [I(V

DD1

) + I(V

DD2

)] I

Q

I

COMP

= 0mA, Sensor Not Connected 6.8 mA

Brownout Voltage Level

(2)

4 V

Brownout Indication Delay 135 µs

TEMPERATURE RANGE

Specified Range

T

J

−40 +125 °C

Operating Range

T

J

−50 +150 °C

Package Thermal Resistance

QFN Surface-Mount

q

JA

See Note 6 40 °C/W

SO PowerPAD Surface-Mount

q

JA

See Note 6 27 °C/W

(1)

Parameter value referred to output (RTO).

(2)

See Typical Characteristic curves.

(3)

Total input resistance and comparator threshold current are inversely related. See Figure 2a.

(4)

For VAC sensors, 0.2% of PWM offset approximately corresponds to 10mA primary current offset per winding.

(5)

See Compensation Driver section in Applications Information.

(6)

See Applications Information section for information on power dissipation, layout considerations, and proper PCB soldering and heat-sinking technique.

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