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TCA9801

GND

VCCA

3 SDAA

2 SCLA

7SCLB

6SDAB

C or SMBus Master

(e.g. Processor)

5 EN

VCCB

C Slave Devices

Product

Folder

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Now

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Documents

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本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确

性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SCPS265

TCA9801

ZHCSG40B –MARCH 2017–REVISED FEBRUARY 2020

TCA9801 电电平平转转换换 I

C 总总线线缓缓冲冲器器/中中继继器器

1 特特性性

• 双通道双向缓冲器

• 在 B 侧集成了电流源，不需要外部 B 侧电阻器

• 超低功耗

• 无静态电压偏移，低 V

• 与 I

C 总线和 SMBus 兼容

• 在 A 侧上，工作电源电压范围为 0.8V 至 3.6V

• 在 B 侧上，工作电源电压范围为 1.65V 至 3.6V

• 高电平有效中继器使能输入

• A 侧断电高阻抗 I

C 总线引脚

• 断电反射功率保护 I

C 总线引脚

• 支持时钟拉伸和多主仲裁

• 0.5mA 至 3mA 的电流源选项系列

2 应应用用

• 服务器

• 路由器（路由设备）

• 工业设备

• 个人计算机

• 功耗敏感型应用

3 说说明明

TCA9801 是一款适用于 I

C 总线和 SMBus/PMBus 系

统的双通道双向缓冲器。它在低电压（低至 0.8V）和

较高电压（1.65V 至 3.6V）之间提供双向电平转换。

TCA9801 在器件 B 侧具有一个内部电流源，因而 B

侧不需要外部上拉电阻器。该电流源还提供改进的上升

时间和超低功耗。

TCA9801 能够在不使用静态电压偏移或增量偏移的情

况下提供真正的缓冲（而不是 pass-FET 解决方案）。

这意味着 TCA9801 的 A 侧和 B 侧上的 V

极低（约

为 0.2V），有助于消除由于固定的 V

阈值导致的通

信问题。TCA9801 的另一个重要特性是没有电源定序

要求或电源依赖性。V

CCA

可以大于、小于或等于

CCB

。这使得系统设计人员可以灵活地使用

TCA9801。

TCA9801 是由四种器件组成的产品系列中的一部分，

每种器件有不同的电流源强度（请参见

器件比较表

）。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

TCA9801 VSSOP (8) 3.00mm × 3.00mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

器器件件比比较较

器器件件型型号号 I

：：电电流流源源值值（（典典型型

值值））

TCA9800 0.54mA

TCA9801 1.1mA

TCA9802 2.2mA

TCA9803 3.3mA

简简化化原原理理图图

TCA9801

ZHCSG40B –MARCH 2017–REVISED FEBRUARY 2020

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions......................... 3

7 Specifications......................................................... 4

7.1 Absolute Maximum Ratings ...................................... 4

7.2 ESD Ratings.............................................................. 4

7.3 Recommended Operating Conditions....................... 4

7.4 Thermal Information.................................................. 4

7.5 Electrical Characteristics........................................... 5

7.6 Timing Requirements................................................ 6

7.7 Switching Characteristics.......................................... 6

7.8 Typical Characteristics.............................................. 7

8 Parameter Measurement Information .................. 9

9 Detailed Description............................................ 10

9.1 Overview ................................................................. 10

9.2 Functional Block Diagram ....................................... 11

9.3 Feature Description................................................. 12

9.4 Device Functional Modes........................................ 13

10 Application and Implementation........................ 16

10.1 Application Information.......................................... 16

10.2 Typical Application ................................................ 18

11 Power Supply Recommendations ..................... 29

12 Layout................................................................... 30

12.1 Layout Guidelines ................................................. 30

12.2 Layout Example .................................................... 30

13 器器件件和和文文档档支支持持 ..................................................... 31

13.1 文档支持................................................................ 31

13.2 接收文档更新通知 ................................................. 31

13.3 支持资源................................................................ 31

13.4 商标 ....................................................................... 31

13.5 静电放电警告......................................................... 31

13.6 Glossary................................................................ 31

14 机机械械、、封封装装和和可可订订购购信信息息....................................... 31

4 修修订订历历史史记记录录

Changes from Revision A (March 2017) to Revision B Page

• Added last sentence: "When enable is a logic LOW while VCCB is powered on, the internal current source on B

side is still enabled...." to the Active-High Repeater Enable Input section........................................................................... 12

Changes from Original (March 2017) to Revision A Page

• Updated I

typical values in Device Comparison Table........................................................................................................ 3

TCA9801

ZHCSG40B –MARCH 2017–REVISED FEBRUARY 2020

www.ti.com.cn

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

CCA

Supply voltage on A-side –0.5 4 V

CCB

Supply voltage on B-side –0.5 4 V

Enable input voltage –0.5 4 V

I/O

C bus voltage –0.5 4 V

Maximum SDAA, SCLA I

current 20 mA

Input clamp current (SDAB/SCLB) –20 mA

Input clamp current (EN, VCCA, VCCB, SDAA, SCLA) –20 mA

Output clamp current (SDAB/SCLB) –20 mA

Output clamp current (EN, VCCA, VCCB, SDAA, SCLA) –20 mA

Operating junction

temperature

130 °C

Storage temperature T

stg

–60 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

001, all pins

(1)

±2000

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins

(2)

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Operating free-air temperature –40 125 °C

CCA

Supply voltage 0.8 3.6 V

CCB

Supply voltage 1.65 3.6 V

I/O

Input-output voltage

SDAA, SCLA 0 3.6

VSDAB, SCLB 0 3.6

EN 0 3.6

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC

(1)

TCA9801

UNITDGK (VSSOP)

8 PINS

θJA

Junction-to-ambient thermal resistance 174.1 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 85 °C/W

θJB

Junction-to-board thermal resistance 104.4 °C/W

Junction-to-top characterization parameter 18.3 °C/W

Junction-to-board characterization parameter 102.8 °C/W

TCA9801

www.ti.com.cn

ZHCSG40B –MARCH 2017–REVISED FEBRUARY 2020

(1) All typical values are at nominal supply voltage (1.8 V) and T

= 25 °C unless otherwise specified.

(2) SDAB, SCLB may not sink current from external sources. It is required that no source of external current be used on these pins for

proper device operation due to the internal current source.

(3) Parameter specified by design. Not tested in production.

(4) V

specification is for the first low-level seen by the SDAB and SCLB pins. I

ILC

must also be satisfied in order to be interpreted as a low.

(5) SDAB, SCLB have a maximum supported capacitive load for device operation. If this load capacitance maximum is violated, the device

does not function properly. SDAA, SCLA have no maximum capacitance limit.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

(1)

MAX UNIT

OUTPUT CHARACTERISTICS

Low-level output voltage

SDAA, SCLA I

= 6 mA, V

ILB

= 0 V 0.04 0.13

SDAB, SCLB V

= 0 V 0.22 0.26

EXT-I

(2)

Allowed input leakage current of I

SDAB, SCLB 0 200 µA

EXT-O

(2)

Allowed output leakage current of I

SDAB, SCLB 0 100 µA

Current source value 1.1 mA

Current source tolerance –25 25 %

INPUT CHARACTERISTICS

Enable pin pull-up 150 250 450 kΩ

High-level input voltage

SDAA, SCLA

0.7 ×

CCA

VSDAB, SCLB

(3)

0.7 ×

CCB

0.7 ×

CCA

Low-level input voltage

SDAA, SCLA 0

0.3 ×

CCA

VSDAB, SCLB

(4) (3)

0.3 ×

CCB

EN 0

0.3 ×

CCA

ILC

Low-level input current contention SDAB, SCLB

(4)

500 µA

ILC

Low-level allowed pull-down resistance SDAB, SCLB

(3)

150 Ω

BUS

Bus capacitance limit SDAB, SCLB

(5)

0 400 pF

DC CHARACTERISTICS

UVLO Under-voltage lock out

CCA

rising and falling; V

CCB

1.65 or 3.6 V

0.3 0.55 0.8

CCB

rising; V

CCA

= 0.8 or 3.6 V 1.3 1.51 1.6

CCB

falling; V

CCA

= 0.8 or 3.6 V 1.2 1.4 1.6

CCA

Quiescent supply current for V

CCA

SDAA = SCLA =

CCA

GND, SDAB =

SCLB = open,

EN = V

CCA

= 0.8 V 0.1 7

µA

CCA

= 1.8 V 0.1 8

CCA

= 2.5 V 0.2 9

CCA

= 3.6 V 0.2 12

CCB

Quiescent supply current for V

CCB

Both channels

high, SDAA =

SCLA = pulled

up to

CCA

, SDAB =

SCLB = open,

EN = V

CCA

CCB

= 1.8 V 22 50

µA

CCB

= 2.5 V 24 55

CCB

= 3.6 V 29 60

Both channels

low, SDAA =

SCLA = GND.

SDAB = SCLB =

open, EN =

CCA

CCB

= 1.8 V 2.2 2.8

CCB

= 2.5 V 2.3 2.9

CCB

= 3.6 V 2.4 2.9

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