TCI6630K2L
ZHCSDQ3E –MAY 2013–REVISED JANUARY 2015
www.ti.com.cn
内内容容
1 器器件件概概述述 .................................................... 1 6.1 KeyStone Architecture ............................. 126
1.1 特性 ................................................... 1 6.2 Enhancements in KeyStone II ..................... 126
1.2 应用 ................................................... 2 6.3 Functional Block Diagram ......................... 127
1.3 说明 ................................................... 2 6.4 Processor Subsystems ............................ 127
1.4 功能框图 .............................................. 3 6.5 Memory ............................................ 139
2 修修订订历历史史 .................................................... 5 6.6 Memory Protection Unit (MPU) .................... 149
3 Device Comparison ..................................... 6 6.7 Interrupts for TCI6630K2L ......................... 163
6.8 Enhanced Direct Memory Access (EDMA3)
4 Terminal Configuration and Functions.............. 8
Controller for TCI6630K2L ......................... 210
4.1 Pin Diagram .......................................... 8
6.9 Identification........................................ 217
4.2 Pin Map............................................... 8
6.10 Boot Modes ........................................ 217
4.3 Pin Attributes........................................ 12
6.11 Device Configuration............................... 237
4.4 Signal Descriptions .................................. 28
6.12 System Interconnect ............................... 272
4.5 Pullup/Pulldown Resistors .......................... 42
7 Device and Documentation Support.............. 293
5 Specifications........................................... 43
7.1 Device Support..................................... 293
5.1 Absolute Maximum Ratings......................... 43
7.2 Documentation Support............................ 295
5.2 ESD Ratings ........................................ 43
7.3 社区资源 ........................................... 296
5.3 Recommended Operating Conditions............... 44
7.4 商标 ................................................ 296
5.4 Electrical Characteristics............................ 45
7.5 静电放电警告....................................... 296
5.5 Thermal Characteristics for PBGA Package [CMS] 45
7.6 Glossary............................................ 296
5.6 Power Supply to Peripheral I/O Mapping ........... 46
8 Mechanical Packaging and Orderable
5.7 Timing and Switching Characteristics ............... 46
Information............................................. 298
6 Detailed Description.................................. 126
8.1 Packaging Information ............................. 298
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