TI-TS3V330.pdf资源-CSDN文库

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FEATURES

D

D, DBQ, DGV, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

1 16

8 9

2

3

4

5

6

7

15

14

13

12

11

10

EN

S1

D

S2

D

S1

C

S2

C

S1

A

S2

A

D

A

S1

B

S2

B

D

B

IN

V

GND

CC

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

IN

S1

A

S2

A

D

A

S1

B

S2

B

D

B

GND

V

CC

EN

S1

D

S2

D

S1

C

S2

C

D

C

DESCRIPTION/ORDERING INFORMATION

TS3V330

QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH

WITH LOW ON-STATE RESISTANCE

SCDS162C – MAY 2004 – REVISED JULY 2005

• Low Differential Gain and Phase (D

G

= 0.82%,

D

P

= 0.1 Degree Typ)

• Wide Bandwidth (BW = 300 MHz Min)

• Low Crosstalk (X

TALK

= –80 dB Typ)

• Low Power Consumption

(I

CC

= 10 µ A Max)

• Bidirectional Data Flow With Near-Zero

Propagation Delay

• Low ON-State Resistance (r

on

= 3 Ω Typ)

• Rail-to-Rail Switching on Data I/O Ports

(0 to V

CC

)

• V

CC

Operating Range From 3 V to 3.6 V

• I

off

Supports Partial-Power-Down Mode

Operation

• Data and Control Inputs Provide Undershoot

Clamp Diode

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Suitable for Both RGB and Composite-Video

Switching

The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable ( EN) input.

When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is

disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data

path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device

has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

ORDERING INFORMATION

T

A

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

QFN – RGY Tape and reel TS3V330RGYR TF330

Tube TS3V330D

SOIC – D TS3V330

Tape and reel TS3V330DR

–40 ° C to 85 ° C SSOP (QSOP) – DBQ Tape and reel TS3V330DBQR TF330

Tube TS3V330PW

TSSOP – PW TF330

Tape and reel TS3V330PWR

TVSOP – DGV Tape and reel TS3V330DGVR TF330

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

www.ti.com

TS3V330

QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH

WITH LOW ON-STATE RESISTANCE

SCDS162C – MAY 2004 – REVISED JULY 2005

PARAMETER DEFINITIONS

PARAMETER DESCRIPTION

R

on

Resistance between the D and S ports, with the switch in the ON state

I

OZ

Output leakage current measured at the D and S ports, with the switch in the OFF state

I

OS

Short-circuit current measured at the I/O pins

V

IN

Voltage at IN

V

EN

Voltage at EN

C

IN

Capacitance at the control ( EN, IN) inputs

C

OFF

Capacitance at the analog I/O port when the switch is OFF

C

ON

Capacitance at the analog I/O port when the switch is ON

V

IH

Minimum input voltage for logic high for the control ( EN, IN) inputs

V

IL

Minimum input voltage for logic low for the control ( EN, IN) inputs

V

H

Hysteresis voltage at the control ( EN, IN) inputs

V

IK

I/O and control ( EN, IN) inputs diode clamp voltage

V

I

Voltage applied to the D or S pins when D or S is the switch input

V

O

Voltage applied to the D or S pins when D or S is the switch output

I

IH

Input high leakage current of the control ( EN, IN) inputs

I

IL

Input low leakage current of the control ( EN, IN) inputs

I

Current into the D or S pins when D or S is the switch input

I

O

Current into the D or S pins when D or S is the switch output

I

off

Output leakage current measured at the D or S ports, with V

CC

= 0

t

ON

Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned ON

t

OFF

Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned OFF

BW Frequency response of the switch in the ON state measured at –3 dB

Unwanted signal coupled from channel to channel. Measured in –dB. X

TALK

= 20 log V

O

/V

I

. This is a nonadjacent

X

TALK

crosstalk.

O

IRR

Off isolation is the resistance (measured in –dB) between the input and output with the switch OFF.

Magnitude variation between analog input and output pins when the switch is ON and the dc offset of composite-video

D

G

signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc

offset is from 0 to 0.714 V.

Phase variation between analog input and output pins when the switch is ON and the dc offset of composite-video

D

P

signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc

offset is from 0 to 0.714 V.

I

CC

Static power-supply current

I

CCD

Variation of I

CC

for a change in frequency in the control ( EN, IN) inputs

This is the increase in supply current for each control input that is at the specified voltage level, rather than V

CC

or

∆ I

CC

GND.

3

www.ti.com

Absolute Maximum Ratings

(1)

Recommended Operating Conditions

(1)

TS3V330

QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH

WITH LOW ON-STATE RESISTANCE

SCDS162C – MAY 2004 – REVISED JULY 2005

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

Supply voltage range –0.5 4.6 V

V

IN

Control input voltage range

(2) (3)

–0.5 4.6 V

V

I/O

Switch I/O voltage range

(2) (3) (4)

–0.5 4.6 V

I

IK

Control input clamp current V

IN

< 0 –50 mA

I

I/OK

I/O port clamp current V

I/O

< 0 –50 mA

I

I/O

ON-state switch current

(5)

± 128 mA

Continuous current through V

CC

or GND ± 100 mA

D package

(6)

73

DBQ package

(6)

90

θ

JA

Package thermal impedance DGV package 120  C/W

PW package

(6)

108

RGY package

(7)

39

T

stg

Storage temperature range –65 150  C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground, unless otherwise specified.

(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4) V

I

and V

O

are used to denote specific conditions for V

I/O

.

(5) I

I

and I

O

are used to denote specific conditions for I

I/O

.

(6) The package thermal impedance is calculated in accordance with JESD 51-7.

(7) The package thermal impedance is calculated in accordance with JESD 51-5.

MIN MAX UNIT

V

CC

Supply voltage 3 3.6 V

V

IH

High-level control input voltage (EN, IN) 2 V

CC

V

IL

Low-level control input voltage (EN, IN) 0 0.8 V

V

ANALOG

Analog I/O voltage 0 V

CC

V

T

A

Operating free-air temperature –40 85 ° C

(1) All unused control inputs of the device must be held at V

CC

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

5

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